
Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 10624469
[patent_doc_number] => 09343419
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[patent_title] => 'Bump structures for semiconductor package'
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Array
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[patent_title] => 'Packaging devices and methods for semiconductor devices'
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Array
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[patent_title] => 'Package arrangement and a method of manufacturing a package arrangement'
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Array
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Array
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[id] => 9428289
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Array
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Array
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Array
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[patent_doc_number] => 20140367701
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Array
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[id] => 8821610
[patent_doc_number] => 20130122655
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[patent_title] => 'Embedded Wafer-Level Bonding Approaches'
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Array
(
[id] => 8819009
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[patent_title] => 'DIE POWER STRUCTURE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/732048 | Die power structure | Dec 30, 2012 | Issued |
Array
(
[id] => 11599575
[patent_doc_number] => 09646747
[patent_country] => US
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[patent_issue_date] => 2017-05-09
[patent_title] => 'Chip component'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/373900 | Chip component | Dec 25, 2012 | Issued |
Array
(
[id] => 8792184
[patent_doc_number] => 20130109153
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[patent_title] => 'MULTIPLE SEAL RING STRUCTURE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/725123 | Multiple seal ring structure | Dec 20, 2012 | Issued |
Array
(
[id] => 8826004
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Array
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Array
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Array
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Array
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