Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 8858433
[patent_doc_number] => 08460967
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-06-11
[patent_title] => 'Integrated antennas in wafer level package'
[patent_app_type] => utility
[patent_app_number] => 13/622058
[patent_app_country] => US
[patent_app_date] => 2012-09-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/622058 | Integrated antennas in wafer level package | Sep 17, 2012 | Issued |
Array
(
[id] => 9360532
[patent_doc_number] => 20140070404
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[patent_kind] => A1
[patent_issue_date] => 2014-03-13
[patent_title] => 'SEMICONDUCTOR PACKAGE STRUCTURE AND INTERPOSER THEREFOR'
[patent_app_type] => utility
[patent_app_number] => 13/612820
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Array
(
[id] => 8753607
[patent_doc_number] => 20130087911
[patent_country] => US
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[patent_issue_date] => 2013-04-11
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 13/612764
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/612764 | Integrated circuit package structure | Sep 11, 2012 | Issued |
Array
(
[id] => 9360548
[patent_doc_number] => 20140070420
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[patent_issue_date] => 2014-03-13
[patent_title] => 'Chip To Package Interface'
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Array
(
[id] => 9869184
[patent_doc_number] => 08956955
[patent_country] => US
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[patent_issue_date] => 2015-02-17
[patent_title] => 'Manufacturing method of semiconductor device and semiconductor device'
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Array
(
[id] => 9360531
[patent_doc_number] => 20140070403
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[patent_issue_date] => 2014-03-13
[patent_title] => 'Packaging Methods and Packaged Devices'
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Array
(
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[patent_issue_date] => 2014-07-29
[patent_title] => 'Integrated circuit packages having redistribution structures'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/610077 | Integrated circuit packages having redistribution structures | Sep 10, 2012 | Issued |
Array
(
[id] => 8838975
[patent_doc_number] => 20130134603
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-05-30
[patent_title] => 'Semiconductor Devices Including Protected Barrier Layers'
[patent_app_type] => utility
[patent_app_number] => 13/610068
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/610068 | Semiconductor devices including protected barrier layers | Sep 10, 2012 | Issued |
Array
(
[id] => 8705457
[patent_doc_number] => 20130062745
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-03-14
[patent_title] => 'SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING STRUCTURE AND POWER SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/606581
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/606581 | Semiconductor device, semiconductor device manufacturing method, semiconductor device mounting structure and power semiconductor device | Sep 6, 2012 | Issued |
Array
(
[id] => 10870912
[patent_doc_number] => 08896113
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-11-25
[patent_title] => 'Base plate and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 13/607522
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/607522 | Base plate and semiconductor device | Sep 6, 2012 | Issued |
Array
(
[id] => 9031668
[patent_doc_number] => 20130234306
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-09-12
[patent_title] => 'LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/605990
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Array
(
[id] => 8818481
[patent_doc_number] => 20130119526
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[patent_kind] => A1
[patent_issue_date] => 2013-05-16
[patent_title] => 'LEAD FRAME, SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR DEVICE'
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Array
(
[id] => 9202436
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Array
(
[id] => 8730336
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Array
(
[id] => 9692564
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Array
(
[id] => 10858210
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[patent_title] => 'Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture'
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Array
(
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/585393 | Structure and method for power field effect transistor | Aug 13, 2012 | Issued |