Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 8450871
[patent_doc_number] => 20120261817
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-10-18
[patent_title] => 'Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution'
[patent_app_type] => utility
[patent_app_number] => 13/536120
[patent_app_country] => US
[patent_app_date] => 2012-06-28
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/536120 | Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution | Jun 27, 2012 | Abandoned |
Array
(
[id] => 8772297
[patent_doc_number] => 08426253
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[patent_kind] => B2
[patent_issue_date] => 2013-04-23
[patent_title] => 'Potted integrated circuit device with aluminum case'
[patent_app_type] => utility
[patent_app_number] => 13/493196
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/493196 | Potted integrated circuit device with aluminum case | Jun 10, 2012 | Issued |
Array
(
[id] => 9118309
[patent_doc_number] => 20130285231
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[patent_kind] => A1
[patent_issue_date] => 2013-10-31
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/978323
[patent_app_country] => US
[patent_app_date] => 2012-06-11
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Array
(
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[patent_kind] => B1
[patent_issue_date] => 2013-02-05
[patent_title] => 'Exposed die overmolded flip chip package'
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[patent_app_number] => 13/487713
[patent_app_country] => US
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Array
(
[id] => 9828146
[patent_doc_number] => 08937375
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[patent_issue_date] => 2015-01-20
[patent_title] => 'Substrate structure, semiconductor device array and semiconductor device having the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/468790 | Substrate structure, semiconductor device array and semiconductor device having the same | May 9, 2012 | Issued |
Array
(
[id] => 8287383
[patent_doc_number] => 20120175706
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[patent_title] => 'Chip-Exposed Semiconductor Device'
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Array
(
[id] => 8287456
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[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/418845 | Semiconductor package having an internal cooling system | Mar 12, 2012 | Issued |
Array
(
[id] => 9031681
[patent_doc_number] => 20130234319
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[patent_kind] => A1
[patent_issue_date] => 2013-09-12
[patent_title] => 'SEMICONDUCTOR CONSTRUCTIONS'
[patent_app_type] => utility
[patent_app_number] => 13/418113
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[patent_app_date] => 2012-03-12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/418113 | Semiconductor constructions | Mar 11, 2012 | Issued |
Array
(
[id] => 8275067
[patent_doc_number] => 20120168928
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-07-05
[patent_title] => 'CHIP ASSEMBLY WITH FREQUENCY EXTENDING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/418201
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/418201 | Chip assembly with frequency extending device | Mar 11, 2012 | Issued |
Array
(
[id] => 9239804
[patent_doc_number] => 08604599
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-12-10
[patent_title] => 'Semiconductor housing and method for the production of a semiconductor housing'
[patent_app_type] => utility
[patent_app_number] => 13/416591
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/416591 | Semiconductor housing and method for the production of a semiconductor housing | Mar 8, 2012 | Issued |
Array
(
[id] => 9031678
[patent_doc_number] => 20130234316
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-09-12
[patent_title] => 'SELF-ALIGNED POLYMER PASSIVATION/ALUMINUM PAD'
[patent_app_type] => utility
[patent_app_number] => 13/415902
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/415902 | Self-aligned polymer passivation/aluminum pad | Mar 8, 2012 | Issued |
Array
(
[id] => 8657111
[patent_doc_number] => 20130037940
[patent_country] => US
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[patent_issue_date] => 2013-02-14
[patent_title] => 'METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/417031 | Method for inhibiting growth of intermetallic compounds | Mar 8, 2012 | Issued |
Array
(
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Array
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[id] => 8414462
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Array
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[id] => 9327863
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/413003 | Package structure, fabricating method thereof, and package-on-package device thereby | Mar 5, 2012 | Issued |
Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/410751 | Protection layers for conductive pads and methods of formation thereof | Mar 1, 2012 | Issued |