Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 7480535
[patent_doc_number] => 20110233545
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-09-29
[patent_title] => 'Semiconductor Chip Having Double Bump Structure And Smart Card Including The Same'
[patent_app_type] => utility
[patent_app_number] => 12/986801
[patent_app_country] => US
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[pdf_file] => publications/A1/0233/20110233545.pdf
[firstpage_image] =>[orig_patent_app_number] => 12986801
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/986801 | Semiconductor chip having double bump structure and smart card including the same | Jan 6, 2011 | Issued |
Array
(
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[patent_doc_number] => 20120146207
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[patent_kind] => A1
[patent_issue_date] => 2012-06-14
[patent_title] => 'STACKED STRUCTURE AND STACKED METHOD FOR THREE-DIMENSIONAL CHIP'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/986184 | Stacked structure and stacked method for three-dimensional chip | Jan 6, 2011 | Issued |
Array
(
[id] => 8287440
[patent_doc_number] => 20120175772
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-07-12
[patent_title] => 'ALTERNATIVE SURFACE FINISHES FOR FLIP-CHIP BALL GRID ARRAYS'
[patent_app_type] => utility
[patent_app_number] => 12/986584
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Array
(
[id] => 8287437
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[patent_kind] => A1
[patent_issue_date] => 2012-07-12
[patent_title] => 'INTEGRATED CIRCUIT PACKAGING INCLUDING AUXILIARY CIRCUITRY'
[patent_app_type] => utility
[patent_app_number] => 12/985484
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Array
(
[id] => 8287451
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[patent_issue_date] => 2012-07-12
[patent_title] => 'WARPAGE CONTROL FEATURES ON THE BOTTOMSIDE OF TSV DIE LATERAL TO PROTRUDING BOTTOMSIDE TIPS'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/985823 | Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips | Jan 5, 2011 | Issued |
Array
(
[id] => 10870934
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[patent_kind] => B2
[patent_issue_date] => 2014-11-25
[patent_title] => 'Encapsulation film, package structure utilizing the same, and method for forming the package structure'
[patent_app_type] => utility
[patent_app_number] => 12/984542
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Array
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[patent_app_number] => 12/978944
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978944 | Manufacturing method of semiconductor device and semiconductor device | Dec 26, 2010 | Issued |
Array
(
[id] => 8664998
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[patent_title] => 'Method of batch trimming circuit elements'
[patent_app_type] => utility
[patent_app_number] => 12/978492
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/978492 | Method of batch trimming circuit elements | Dec 23, 2010 | Issued |
Array
(
[id] => 6153699
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Array
(
[id] => 7656907
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[patent_issue_date] => 2011-12-15
[patent_title] => 'ALIGNMENT MARK FOR OPAQUE LAYER'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/964430 | Alignment mark for opaque layer | Dec 8, 2010 | Issued |
Array
(
[id] => 8064779
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Array
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[id] => 6119684
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Array
(
[id] => 7711212
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Array
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Array
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Array
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Array
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