Search

Mark V Prenty

Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2814, 2503, 2822, 2899
Total Applications
2970
Issued Applications
2517
Pending Applications
67
Abandoned Applications
386

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8591833 [patent_doc_number] => 08349710 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-01-08 [patent_title] => 'Shielding techniques for an integrated circuit' [patent_app_type] => utility [patent_app_number] => 12/911171 [patent_app_country] => US [patent_app_date] => 2010-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4835 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12911171 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/911171
Shielding techniques for an integrated circuit Oct 24, 2010 Issued
Array ( [id] => 5985798 [patent_doc_number] => 20110097897 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-28 [patent_title] => 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/908361 [patent_app_country] => US [patent_app_date] => 2010-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 7585 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0097/20110097897.pdf [firstpage_image] =>[orig_patent_app_number] => 12908361 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/908361
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Oct 19, 2010 Abandoned
Array ( [id] => 5985792 [patent_doc_number] => 20110097891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-28 [patent_title] => 'Method of Manufacturing the Semiconductor Device' [patent_app_type] => utility [patent_app_number] => 12/906578 [patent_app_country] => US [patent_app_date] => 2010-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6619 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0097/20110097891.pdf [firstpage_image] =>[orig_patent_app_number] => 12906578 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/906578
Method of manufacturing the semiconductor device Oct 17, 2010 Issued
Array ( [id] => 10518711 [patent_doc_number] => 09245765 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-01-26 [patent_title] => 'Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer' [patent_app_type] => utility [patent_app_number] => 13/394812 [patent_app_country] => US [patent_app_date] => 2010-10-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 12680 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13394812 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/394812
Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer Oct 13, 2010 Issued
Array ( [id] => 8533875 [patent_doc_number] => 08310032 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-13 [patent_title] => 'Wafer and method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/901187 [patent_app_country] => US [patent_app_date] => 2010-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 5257 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12901187 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/901187
Wafer and method of manufacturing semiconductor device Oct 7, 2010 Issued
Array ( [id] => 7762791 [patent_doc_number] => 20120032320 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-02-09 [patent_title] => 'FLEXIBLE MICRO-SYSTEM AND FABRICATION METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/900016 [patent_app_country] => US [patent_app_date] => 2010-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3893 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0032/20120032320.pdf [firstpage_image] =>[orig_patent_app_number] => 12900016 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/900016
Flexible micro-system and fabrication method thereof Oct 6, 2010 Issued
Array ( [id] => 8095019 [patent_doc_number] => 20120083116 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-04-05 [patent_title] => 'Cost-Effective TSV Formation' [patent_app_type] => utility [patent_app_number] => 12/895296 [patent_app_country] => US [patent_app_date] => 2010-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2788 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0083/20120083116.pdf [firstpage_image] =>[orig_patent_app_number] => 12895296 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/895296
Cost-effective TSV formation Sep 29, 2010 Issued
Array ( [id] => 7540262 [patent_doc_number] => 08058105 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-11-15 [patent_title] => 'Method of fabricating a packaging structure' [patent_app_type] => utility [patent_app_number] => 12/893036 [patent_app_country] => US [patent_app_date] => 2010-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 3040 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/058/08058105.pdf [firstpage_image] =>[orig_patent_app_number] => 12893036 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/893036
Method of fabricating a packaging structure Sep 28, 2010 Issued
Array ( [id] => 7564934 [patent_doc_number] => 20110284997 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-24 [patent_title] => 'Chip-Exposed Semiconductor Device and Its Packaging Method' [patent_app_type] => utility [patent_app_number] => 12/894105 [patent_app_country] => US [patent_app_date] => 2010-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5869 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0284/20110284997.pdf [firstpage_image] =>[orig_patent_app_number] => 12894105 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/894105
Chip-exposed semiconductor device and its packaging method Sep 28, 2010 Issued
Array ( [id] => 8538261 [patent_doc_number] => 08313982 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-20 [patent_title] => 'Stacked die assemblies including TSV die' [patent_app_type] => utility [patent_app_number] => 12/885874 [patent_app_country] => US [patent_app_date] => 2010-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 4600 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 206 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12885874 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/885874
Stacked die assemblies including TSV die Sep 19, 2010 Issued
Array ( [id] => 5976954 [patent_doc_number] => 20110070695 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-03-24 [patent_title] => 'METHOD OF FABRICATING A HIGH-TEMPERATURE COMPATIBLE POWER SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 12/883406 [patent_app_country] => US [patent_app_date] => 2010-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4112 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0070/20110070695.pdf [firstpage_image] =>[orig_patent_app_number] => 12883406 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/883406
Method of fabricating a high-temperature compatible power semiconductor module Sep 15, 2010 Issued
Array ( [id] => 6119682 [patent_doc_number] => 20110076801 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-03-31 [patent_title] => 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/882673 [patent_app_country] => US [patent_app_date] => 2010-09-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6455 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0076/20110076801.pdf [firstpage_image] =>[orig_patent_app_number] => 12882673 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/882673
Method for manufacturing semiconductor device Sep 14, 2010 Issued
Array ( [id] => 8629770 [patent_doc_number] => 08361842 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-01-29 [patent_title] => 'Embedded wafer-level bonding approaches' [patent_app_type] => utility [patent_app_number] => 12/880736 [patent_app_country] => US [patent_app_date] => 2010-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 3001 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12880736 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/880736
Embedded wafer-level bonding approaches Sep 12, 2010 Issued
Array ( [id] => 8275078 [patent_doc_number] => 20120168946 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-07-05 [patent_title] => 'SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR' [patent_app_type] => utility [patent_app_number] => 13/395653 [patent_app_country] => US [patent_app_date] => 2010-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 11612 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13395653 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/395653
Semiconductor device and production method therefor Sep 9, 2010 Issued
Array ( [id] => 9127812 [patent_doc_number] => 08575763 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-11-05 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/878698 [patent_app_country] => US [patent_app_date] => 2010-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 44 [patent_no_of_words] => 16724 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 213 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12878698 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/878698
Semiconductor device and method of manufacturing the same Sep 8, 2010 Issued
Array ( [id] => 9576002 [patent_doc_number] => 08766420 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-01 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/394642 [patent_app_country] => US [patent_app_date] => 2010-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 8198 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13394642 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/394642
Semiconductor device Aug 26, 2010 Issued
Array ( [id] => 9059820 [patent_doc_number] => 08546255 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-10-01 [patent_title] => 'Method for forming vias in a semiconductor substrate and a semiconductor device having the semiconductor substrate' [patent_app_type] => utility [patent_app_number] => 12/849692 [patent_app_country] => US [patent_app_date] => 2010-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 61 [patent_no_of_words] => 5376 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12849692 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/849692
Method for forming vias in a semiconductor substrate and a semiconductor device having the semiconductor substrate Aug 2, 2010 Issued
Array ( [id] => 6624325 [patent_doc_number] => 20100311208 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-09 [patent_title] => 'METHOD AND APPARATUS FOR NO LEAD SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/838252 [patent_app_country] => US [patent_app_date] => 2010-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 8545 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0311/20100311208.pdf [firstpage_image] =>[orig_patent_app_number] => 12838252 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/838252
Method and apparatus for no lead semiconductor package Jul 15, 2010 Issued
Array ( [id] => 6130822 [patent_doc_number] => 20110006442 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-01-13 [patent_title] => 'SEMICONDUCTOR CHIP, FILM SUBSTRATE, AND RELATED SEMICONDUCTOR CHIP PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/836321 [patent_app_country] => US [patent_app_date] => 2010-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5163 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20110006442.pdf [firstpage_image] =>[orig_patent_app_number] => 12836321 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/836321
Semiconductor chip, film substrate, and related semiconductor chip package Jul 13, 2010 Issued
Array ( [id] => 7530324 [patent_doc_number] => 07842546 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-30 [patent_title] => 'Integrated circuit module and method of packaging same' [patent_app_type] => utility [patent_app_number] => 12/827211 [patent_app_country] => US [patent_app_date] => 2010-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 5431 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/842/07842546.pdf [firstpage_image] =>[orig_patent_app_number] => 12827211 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/827211
Integrated circuit module and method of packaging same Jun 29, 2010 Issued
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