Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 8591833
[patent_doc_number] => 08349710
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[patent_kind] => B2
[patent_issue_date] => 2013-01-08
[patent_title] => 'Shielding techniques for an integrated circuit'
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[patent_app_number] => 12/911171
[patent_app_country] => US
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12911171
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/911171 | Shielding techniques for an integrated circuit | Oct 24, 2010 | Issued |
Array
(
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[patent_kind] => A1
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[patent_title] => 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/908361 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Oct 19, 2010 | Abandoned |
Array
(
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[patent_title] => 'Method of Manufacturing the Semiconductor Device'
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Array
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[patent_issue_date] => 2016-01-26
[patent_title] => 'Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer'
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Array
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Array
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Array
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[patent_title] => 'Cost-Effective TSV Formation'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/895296 | Cost-effective TSV formation | Sep 29, 2010 | Issued |
Array
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[id] => 7540262
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[patent_title] => 'Method of fabricating a packaging structure'
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Array
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[id] => 7564934
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[patent_title] => 'Chip-Exposed Semiconductor Device and Its Packaging Method'
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Array
(
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[patent_title] => 'Stacked die assemblies including TSV die'
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Array
(
[id] => 5976954
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[patent_title] => 'METHOD OF FABRICATING A HIGH-TEMPERATURE COMPATIBLE POWER SEMICONDUCTOR MODULE'
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Array
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Array
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Array
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Array
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Array
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Array
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