Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5963422
[patent_doc_number] => 20110147895
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[patent_kind] => A1
[patent_issue_date] => 2011-06-23
[patent_title] => 'Apparatus and Method for Controlling Semiconductor Die Warpage'
[patent_app_type] => utility
[patent_app_number] => 12/640111
[patent_app_country] => US
[patent_app_date] => 2009-12-17
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[pdf_file] => publications/A1/0147/20110147895.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/640111 | Apparatus and method for controlling semiconductor die warpage | Dec 16, 2009 | Issued |
Array
(
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[patent_doc_number] => 20110031609
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[patent_kind] => A1
[patent_issue_date] => 2011-02-10
[patent_title] => 'SEMICONDUCTOR PACKAGE HAVING THROUGH ELECTRODES THAT REDUCE LEAKAGE CURRENT AND METHOD FOR MANUFACTURING THE SAME'
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[patent_app_number] => 12/640102
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[pdf_file] => publications/A1/0031/20110031609.pdf
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Array
(
[id] => 8808352
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[patent_kind] => B2
[patent_issue_date] => 2013-05-21
[patent_title] => 'Structures and methods to reduce maximum current density in a solder ball'
[patent_app_type] => utility
[patent_app_number] => 12/640752
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Array
(
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[patent_kind] => A1
[patent_issue_date] => 2010-06-17
[patent_title] => 'SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/639421
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Array
(
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[patent_title] => 'Semiconductor package having an internal cooling system'
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Array
(
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Array
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Array
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[patent_title] => 'CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF'
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Array
(
[id] => 9497180
[patent_doc_number] => 08736002
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[patent_title] => 'Sensor mounted in flip-chip technology at a substrate edge'
[patent_app_type] => utility
[patent_app_number] => 13/498490
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Array
(
[id] => 8462563
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[patent_title] => 'SENSOR MOUNTED IN FLIP-CHIP TECHNOLOGY ON A SUBSTRATE'
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Array
(
[id] => 6295144
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Array
(
[id] => 9074901
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Array
(
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Array
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Array
(
[id] => 5461647
[patent_doc_number] => 20090321847
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[patent_title] => 'HIGH PERFORMANCE CMOS DEVICES COMPRISING GAPPED DUAL STRESSORS WITH DIELECTRIC GAP FILLERS, AND METHODS OF FABRICATING THE SAME'
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Array
(
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[patent_title] => 'METHOD OF FORMING A MOLDED ARRAY PACKAGE DEVICE HAVING AN EXPOSED TAB AND STRUCTURE'
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Array
(
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/489115 | Semiconductor device packages with electromagnetic interference shielding | Jun 21, 2009 | Issued |