Mark V Prenty

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Array ( [id] => 5353070 [patent_doc_number] => 20090184414 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-07-23 [patent_title] => 'WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/347020 [patent_app_country] => US [patent_app_date] => 2008-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6709 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0184/20090184414.pdf [firstpage_image] =>[orig_patent_app_number] => 12347020 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6393312 [patent_doc_number] => 20100164076 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-07-01 [patent_title] => 'STACKED SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/346429 [patent_app_country] => US [patent_app_date] => 2008-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1946 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0164/20100164076.pdf [firstpage_image] =>[orig_patent_app_number] => 12346429 [rel_patent_id] =>[rel_patent_doc_number] =>)

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