Search

Mark V Prenty

Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2814, 2503, 2822, 2899
Total Applications
2970
Issued Applications
2517
Pending Applications
67
Abandoned Applications
386

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7801550 [patent_doc_number] => 08129824 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2012-03-06 [patent_title] => 'Shielding for a semiconductor package' [patent_app_type] => utility [patent_app_number] => 12/327716 [patent_app_country] => US [patent_app_date] => 2008-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 19 [patent_no_of_words] => 13993 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/129/08129824.pdf [firstpage_image] =>[orig_patent_app_number] => 12327716 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/327716
Shielding for a semiconductor package Dec 2, 2008 Issued
Array ( [id] => 4597171 [patent_doc_number] => 07982298 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-07-19 [patent_title] => 'Package in package semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/327763 [patent_app_country] => US [patent_app_date] => 2008-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 19 [patent_no_of_words] => 7926 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/982/07982298.pdf [firstpage_image] =>[orig_patent_app_number] => 12327763 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/327763
Package in package semiconductor device Dec 2, 2008 Issued
Array ( [id] => 6240304 [patent_doc_number] => 20100133666 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-06-03 [patent_title] => 'DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS' [patent_app_type] => utility [patent_app_number] => 12/326529 [patent_app_country] => US [patent_app_date] => 2008-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 45 [patent_no_of_words] => 8823 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20100133666.pdf [firstpage_image] =>[orig_patent_app_number] => 12326529 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/326529
Device including a semiconductor chip and metal foils Dec 1, 2008 Issued
Array ( [id] => 4644933 [patent_doc_number] => 08022540 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-20 [patent_title] => 'Chip package' [patent_app_type] => utility [patent_app_number] => 12/325289 [patent_app_country] => US [patent_app_date] => 2008-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1352 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/022/08022540.pdf [firstpage_image] =>[orig_patent_app_number] => 12325289 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/325289
Chip package Nov 30, 2008 Issued
Array ( [id] => 54140 [patent_doc_number] => 07772694 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-10 [patent_title] => 'Integrated circuit module and method of packaging same' [patent_app_type] => utility [patent_app_number] => 12/323780 [patent_app_country] => US [patent_app_date] => 2008-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 5393 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/772/07772694.pdf [firstpage_image] =>[orig_patent_app_number] => 12323780 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/323780
Integrated circuit module and method of packaging same Nov 25, 2008 Issued
Array ( [id] => 5573008 [patent_doc_number] => 20090140369 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-04 [patent_title] => 'SEMICONDUCTOR POWER MODULE PACKAGE WITHOUT TEMPERATURE SENSOR MOUNTED THEREON AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/277699 [patent_app_country] => US [patent_app_date] => 2008-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4806 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20090140369.pdf [firstpage_image] =>[orig_patent_app_number] => 12277699 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/277699
Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same Nov 24, 2008 Issued
Array ( [id] => 6519152 [patent_doc_number] => 20100123226 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-05-20 [patent_title] => 'SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/273559 [patent_app_country] => US [patent_app_date] => 2008-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2625 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0123/20100123226.pdf [firstpage_image] =>[orig_patent_app_number] => 12273559 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/273559
Semiconductor package Nov 18, 2008 Issued
Array ( [id] => 4634993 [patent_doc_number] => 08013447 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-06 [patent_title] => 'Semiconductor device and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 12/271626 [patent_app_country] => US [patent_app_date] => 2008-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 1347 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/013/08013447.pdf [firstpage_image] =>[orig_patent_app_number] => 12271626 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/271626
Semiconductor device and method for fabricating the same Nov 13, 2008 Issued
Array ( [id] => 5275552 [patent_doc_number] => 20090127684 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-21 [patent_title] => 'LEADFRAME FOR LEADLESS PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/262580 [patent_app_country] => US [patent_app_date] => 2008-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1847 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20090127684.pdf [firstpage_image] =>[orig_patent_app_number] => 12262580 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/262580
LEADFRAME FOR LEADLESS PACKAGE Oct 30, 2008 Abandoned
Array ( [id] => 5518651 [patent_doc_number] => 20090026632 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-29 [patent_title] => 'CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF' [patent_app_type] => utility [patent_app_number] => 12/244553 [patent_app_country] => US [patent_app_date] => 2008-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 8313 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0026/20090026632.pdf [firstpage_image] =>[orig_patent_app_number] => 12244553 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/244553
CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF Oct 1, 2008 Abandoned
Array ( [id] => 5425882 [patent_doc_number] => 20090085192 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-02 [patent_title] => 'Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof' [patent_app_type] => utility [patent_app_number] => 12/285259 [patent_app_country] => US [patent_app_date] => 2008-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3158 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0085/20090085192.pdf [firstpage_image] =>[orig_patent_app_number] => 12285259 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/285259
Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof Sep 30, 2008 Abandoned
Array ( [id] => 5389038 [patent_doc_number] => 20090206350 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-20 [patent_title] => 'LED chip package structure with different LED spacings and a method for making the same' [patent_app_type] => utility [patent_app_number] => 12/285190 [patent_app_country] => US [patent_app_date] => 2008-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4281 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0206/20090206350.pdf [firstpage_image] =>[orig_patent_app_number] => 12285190 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/285190
LED chip package structure with different LED spacings and a method for making the same Sep 29, 2008 Issued
Array ( [id] => 92969 [patent_doc_number] => 07737477 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-06-15 [patent_title] => 'CMOS image sensor and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/232752 [patent_app_country] => US [patent_app_date] => 2008-09-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 5194 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/737/07737477.pdf [firstpage_image] =>[orig_patent_app_number] => 12232752 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/232752
CMOS image sensor and method for manufacturing the same Sep 22, 2008 Issued
Array ( [id] => 8533912 [patent_doc_number] => 08310069 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-13 [patent_title] => 'Semiconductor package having marking layer' [patent_app_type] => utility [patent_app_number] => 12/211274 [patent_app_country] => US [patent_app_date] => 2008-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 4531 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12211274 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/211274
Semiconductor package having marking layer Sep 15, 2008 Issued
Array ( [id] => 5493430 [patent_doc_number] => 20090261458 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-22 [patent_title] => 'THROUGH-ELECTRODE, CIRCUIT BOARD HAVING A THROUGH-ELECTRODE, SEMICONDUCTOR PACKAGE HAVING A THROUGH-ELECTRODE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SEMICONDUCTOR CHIP OR PACKAGE HAVING A THROUGH-ELECTRODE' [patent_app_type] => utility [patent_app_number] => 12/209584 [patent_app_country] => US [patent_app_date] => 2008-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5422 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0261/20090261458.pdf [firstpage_image] =>[orig_patent_app_number] => 12209584 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/209584
Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode Sep 11, 2008 Issued
Array ( [id] => 5549886 [patent_doc_number] => 20090283872 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-19 [patent_title] => 'PACKAGE STRUCTURE OF THREE-DIMENSIONAL STACKING DICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/205443 [patent_app_country] => US [patent_app_date] => 2008-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4849 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20090283872.pdf [firstpage_image] =>[orig_patent_app_number] => 12205443 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/205443
Package structure of three-dimensional stacking dice and method for manufacturing the same Sep 4, 2008 Issued
Array ( [id] => 5461689 [patent_doc_number] => 20090321889 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-31 [patent_title] => 'Scribe Seal Connection' [patent_app_type] => utility [patent_app_number] => 12/201394 [patent_app_country] => US [patent_app_date] => 2008-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6040 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0321/20090321889.pdf [firstpage_image] =>[orig_patent_app_number] => 12201394 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/201394
Scribe seal connection Aug 28, 2008 Issued
Array ( [id] => 4756689 [patent_doc_number] => 20080308914 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-18 [patent_title] => 'CHIP PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/198517 [patent_app_country] => US [patent_app_date] => 2008-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2971 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0308/20080308914.pdf [firstpage_image] =>[orig_patent_app_number] => 12198517 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/198517
CHIP PACKAGE Aug 25, 2008 Abandoned
Array ( [id] => 7540864 [patent_doc_number] => 08058708 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-11-15 [patent_title] => 'Through hole interconnection structure for semiconductor wafer' [patent_app_type] => utility [patent_app_number] => 12/194670 [patent_app_country] => US [patent_app_date] => 2008-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 42 [patent_no_of_words] => 11223 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/058/08058708.pdf [firstpage_image] =>[orig_patent_app_number] => 12194670 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/194670
Through hole interconnection structure for semiconductor wafer Aug 19, 2008 Issued
Array ( [id] => 6448483 [patent_doc_number] => 20100038801 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-02-18 [patent_title] => 'Corrosion Control of Stacked Integrated Circuits' [patent_app_type] => utility [patent_app_number] => 12/192514 [patent_app_country] => US [patent_app_date] => 2008-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2431 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20100038801.pdf [firstpage_image] =>[orig_patent_app_number] => 12192514 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/192514
Corrosion control of stacked integrated circuits Aug 14, 2008 Issued
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