Mark V Prenty
Examiner (ID: 1781, Phone: (571)272-1843 , Office: P/2822 )
Most Active Art Unit | 2822 |
Art Unit(s) | 2814, 2503, 2822, 2899 |
Total Applications | 2970 |
Issued Applications | 2517 |
Pending Applications | 67 |
Abandoned Applications | 386 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5685864
[patent_doc_number] => 20060284179
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-21
[patent_title] => 'Silicon thin film transistor and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/455559
[patent_app_country] => US
[patent_app_date] => 2006-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 4162
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0284/20060284179.pdf
[firstpage_image] =>[orig_patent_app_number] => 11455559
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/455559 | Silicon thin film transistor and method of manufacturing the same | Jun 18, 2006 | Abandoned |
Array
(
[id] => 233113
[patent_doc_number] => 07598540
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-10-06
[patent_title] => 'High performance CMOS devices comprising gapped dual stressors with dielectric gap fillers, and methods of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/451869
[patent_app_country] => US
[patent_app_date] => 2006-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 5861
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 183
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/598/07598540.pdf
[firstpage_image] =>[orig_patent_app_number] => 11451869
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/451869 | High performance CMOS devices comprising gapped dual stressors with dielectric gap fillers, and methods of fabricating the same | Jun 12, 2006 | Issued |
Array
(
[id] => 5165692
[patent_doc_number] => 20070287279
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-13
[patent_title] => 'METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/422988
[patent_app_country] => US
[patent_app_date] => 2006-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3433
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0287/20070287279.pdf
[firstpage_image] =>[orig_patent_app_number] => 11422988
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/422988 | METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF | Jun 7, 2006 | Abandoned |
Array
(
[id] => 5780238
[patent_doc_number] => 20060202333
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-14
[patent_title] => 'PACKAGE OF A SEMICONDUCTOR DEVICE WITH A FLEXIBLE WIRING SUBSTRATE AND METHOD FOR THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/420453
[patent_app_country] => US
[patent_app_date] => 2006-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 4252
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0202/20060202333.pdf
[firstpage_image] =>[orig_patent_app_number] => 11420453
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/420453 | Package of a semiconductor device with a flexible wiring substrate and method for the same | May 24, 2006 | Issued |
Array
(
[id] => 4968624
[patent_doc_number] => 20070108626
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'FLIP-CHIP INTEGRATED CIRCUIT PACKAGING METHOD'
[patent_app_type] => utility
[patent_app_number] => 11/420228
[patent_app_country] => US
[patent_app_date] => 2006-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 1395
[patent_no_of_claims] => 8
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20070108626.pdf
[firstpage_image] =>[orig_patent_app_number] => 11420228
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/420228 | FLIP-CHIP INTEGRATED CIRCUIT PACKAGING METHOD | May 24, 2006 | Abandoned |
Array
(
[id] => 5605612
[patent_doc_number] => 20060267128
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-30
[patent_title] => 'Schottky barrier diode and method of producing the same'
[patent_app_type] => utility
[patent_app_number] => 11/439248
[patent_app_country] => US
[patent_app_date] => 2006-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2526
[patent_no_of_claims] => 4
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0267/20060267128.pdf
[firstpage_image] =>[orig_patent_app_number] => 11439248
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/439248 | Schottky barrier diode and method of producing the same | May 23, 2006 | Abandoned |
Array
(
[id] => 103123
[patent_doc_number] => 07728417
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-01
[patent_title] => 'Integrated circuit package system including shield'
[patent_app_type] => utility
[patent_app_number] => 11/419748
[patent_app_country] => US
[patent_app_date] => 2006-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 6849
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 53
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/728/07728417.pdf
[firstpage_image] =>[orig_patent_app_number] => 11419748
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/419748 | Integrated circuit package system including shield | May 21, 2006 | Issued |
Array
(
[id] => 5751089
[patent_doc_number] => 20060220238
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-05
[patent_title] => 'Multi-functional metal shield case and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 11/438039
[patent_app_country] => US
[patent_app_date] => 2006-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3292
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 6
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0220/20060220238.pdf
[firstpage_image] =>[orig_patent_app_number] => 11438039
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/438039 | Multi-functional metal shield case and method for making the same | May 18, 2006 | Issued |
Array
(
[id] => 5622966
[patent_doc_number] => 20060261471
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/432528
[patent_app_country] => US
[patent_app_date] => 2006-05-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 6488
[patent_no_of_claims] => 19
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0261/20060261471.pdf
[firstpage_image] =>[orig_patent_app_number] => 11432528
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/432528 | SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same | May 11, 2006 | Abandoned |
Array
(
[id] => 5043770
[patent_doc_number] => 20070262441
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-15
[patent_title] => 'Heat sink structure for embedded chips and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/430439
[patent_app_country] => US
[patent_app_date] => 2006-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3920
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0262/20070262441.pdf
[firstpage_image] =>[orig_patent_app_number] => 11430439
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/430439 | Heat sink structure for embedded chips and method for fabricating the same | May 8, 2006 | Abandoned |
Array
(
[id] => 5659153
[patent_doc_number] => 20060249749
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-09
[patent_title] => 'Electronic device'
[patent_app_type] => utility
[patent_app_number] => 11/430558
[patent_app_country] => US
[patent_app_date] => 2006-05-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2294
[patent_no_of_claims] => 18
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0249/20060249749.pdf
[firstpage_image] =>[orig_patent_app_number] => 11430558
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/430558 | Electronic device | May 8, 2006 | Abandoned |
Array
(
[id] => 5014085
[patent_doc_number] => 20070257293
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-08
[patent_title] => 'Semiconductor memory device and method for production of the semiconductor memory device'
[patent_app_type] => utility
[patent_app_number] => 11/429929
[patent_app_country] => US
[patent_app_date] => 2006-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0257/20070257293.pdf
[firstpage_image] =>[orig_patent_app_number] => 11429929
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/429929 | Semiconductor memory device and method for production of the semiconductor memory device | May 7, 2006 | Abandoned |
Array
(
[id] => 5139073
[patent_doc_number] => 20070001289
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-01-04
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/416198
[patent_app_country] => US
[patent_app_date] => 2006-05-03
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[patent_drawing_sheets_cnt] => 10
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[pdf_file] => publications/A1/0001/20070001289.pdf
[firstpage_image] =>[orig_patent_app_number] => 11416198
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/416198 | Semiconductor device and method of manufacturing the same | May 2, 2006 | Abandoned |
Array
(
[id] => 162356
[patent_doc_number] => 07670938
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-02
[patent_title] => 'Methods of forming contact openings'
[patent_app_type] => utility
[patent_app_number] => 11/381219
[patent_app_country] => US
[patent_app_date] => 2006-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/670/07670938.pdf
[firstpage_image] =>[orig_patent_app_number] => 11381219
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/381219 | Methods of forming contact openings | May 1, 2006 | Issued |
Array
(
[id] => 9850787
[patent_doc_number] => 08952524
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-02-10
[patent_title] => 'Re-workable heat sink attachment assembly'
[patent_app_type] => utility
[patent_app_number] => 11/380778
[patent_app_country] => US
[patent_app_date] => 2006-04-28
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11380778
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/380778 | Re-workable heat sink attachment assembly | Apr 27, 2006 | Issued |
Array
(
[id] => 5616909
[patent_doc_number] => 20060186441
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-24
[patent_title] => 'Light-emitting device, liquid-crystal display device and method for manufacturing same'
[patent_app_type] => utility
[patent_app_number] => 11/410002
[patent_app_country] => US
[patent_app_date] => 2006-04-25
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[patent_drawing_sheets_cnt] => 15
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0186/20060186441.pdf
[firstpage_image] =>[orig_patent_app_number] => 11410002
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/410002 | Light-emitting device, liquid-crystal display device and method for manufacturing same | Apr 24, 2006 | Issued |
Array
(
[id] => 5675496
[patent_doc_number] => 20060180851
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-17
[patent_title] => 'Non-volatile memory devices and methods of operating the same'
[patent_app_type] => utility
[patent_app_number] => 11/402389
[patent_app_country] => US
[patent_app_date] => 2006-04-12
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0180/20060180851.pdf
[firstpage_image] =>[orig_patent_app_number] => 11402389
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/402389 | Non-volatile memory devices and methods of operating the same | Apr 11, 2006 | Abandoned |
Array
(
[id] => 5754154
[patent_doc_number] => 20060223303
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-05
[patent_title] => 'Semiconductor device and method of manufacturing the same'
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[pdf_file] => publications/A1/0223/20060223303.pdf
[firstpage_image] =>[orig_patent_app_number] => 11396998
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/396998 | Semiconductor device and method of manufacturing the same | Apr 2, 2006 | Issued |
Array
(
[id] => 7692063
[patent_doc_number] => 20070231970
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[patent_kind] => A1
[patent_issue_date] => 2007-10-04
[patent_title] => 'Cured mold compound spacer for stacked-die package'
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[patent_app_country] => US
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[pdf_file] => publications/A1/0231/20070231970.pdf
[firstpage_image] =>[orig_patent_app_number] => 11395628
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/395628 | Cured mold compound spacer for stacked-die package | Mar 30, 2006 | Abandoned |
Array
(
[id] => 7492190
[patent_doc_number] => 08030643
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-10-04
[patent_title] => 'Memory device and manufacturing method the same'
[patent_app_type] => utility
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/030/08030643.pdf
[firstpage_image] =>[orig_patent_app_number] => 11389238
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/389238 | Memory device and manufacturing method the same | Mar 26, 2006 | Issued |