
Mary Ann Calabrese
Examiner (ID: 18530, Phone: (571)272-8704 , Office: P/2913 )
| Most Active Art Unit | 2913 |
| Art Unit(s) | 2931, 2913 |
| Total Applications | 4141 |
| Issued Applications | 3855 |
| Pending Applications | 21 |
| Abandoned Applications | 276 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6983504
[patent_doc_number] => 20050153574
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-07-14
[patent_title] => 'Very low dielectric constant plasma-enhanced CVD films'
[patent_app_type] => utility
[patent_app_number] => 11/001761
[patent_app_country] => US
[patent_app_date] => 2004-12-02
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[pdf_file] => publications/A1/0153/20050153574.pdf
[firstpage_image] =>[orig_patent_app_number] => 11001761
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/001761 | Very low dielectric constant plasma-enhanced CVD films | Dec 1, 2004 | Issued |
Array
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[id] => 865187
[patent_doc_number] => RE040275
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[patent_issue_date] => 2008-04-29
[patent_title] => 'Method for producing a memory cell'
[patent_app_type] => reissue
[patent_app_number] => 11/000495
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/000495 | Method for producing a memory cell | Nov 28, 2004 | Issued |
Array
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[patent_doc_number] => 20050095772
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[patent_issue_date] => 2005-05-05
[patent_title] => 'Method of fabricating semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 10998920
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/998920 | Method of fabricating semiconductor device | Nov 28, 2004 | Issued |
Array
(
[id] => 480151
[patent_doc_number] => 07224049
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-05-29
[patent_title] => 'Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same'
[patent_app_type] => utility
[patent_app_number] => 10/988551
[patent_app_country] => US
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[pdf_file] => patents/07/224/07224049.pdf
[firstpage_image] =>[orig_patent_app_number] => 10988551
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/988551 | Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same | Nov 15, 2004 | Issued |
Array
(
[id] => 6912465
[patent_doc_number] => 20050176223
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[patent_issue_date] => 2005-08-11
[patent_title] => 'Substrate processing method'
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Array
(
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[patent_issue_date] => 2006-05-18
[patent_title] => 'Device and method for fabricating double-sided SOI wafer scale package with through via connections'
[patent_app_type] => utility
[patent_app_number] => 10/990252
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/990252 | Device and method for fabricating double-sided SOI wafer scale package with through via connections | Nov 15, 2004 | Issued |
Array
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[id] => 609452
[patent_doc_number] => 07151018
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[patent_title] => 'Method and apparatus for transistor sidewall salicidation'
[patent_app_type] => utility
[patent_app_number] => 10/989911
[patent_app_country] => US
[patent_app_date] => 2004-11-15
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[pdf_file] => patents/07/151/07151018.pdf
[firstpage_image] =>[orig_patent_app_number] => 10989911
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/989911 | Method and apparatus for transistor sidewall salicidation | Nov 14, 2004 | Issued |
Array
(
[id] => 5865656
[patent_doc_number] => 20060099787
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[patent_kind] => A1
[patent_issue_date] => 2006-05-11
[patent_title] => 'Method for damascene formation using plug materials having varied etching rates'
[patent_app_type] => utility
[patent_app_number] => 10/983681
[patent_app_country] => US
[patent_app_date] => 2004-11-09
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[patent_drawing_sheets_cnt] => 5
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/983681 | Method for damascene formation using plug materials having varied etching rates | Nov 8, 2004 | Issued |
Array
(
[id] => 5865657
[patent_doc_number] => 20060099788
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[patent_issue_date] => 2006-05-11
[patent_title] => 'Injection molded metal bonding tray for integrated circuit device fabrication'
[patent_app_type] => utility
[patent_app_number] => 10/984042
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[patent_app_date] => 2004-11-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/984042 | Injection molded metal bonding tray for integrated circuit device fabrication | Nov 7, 2004 | Issued |
Array
(
[id] => 7161791
[patent_doc_number] => 20050084986
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Semiconductor test board having laser patterned conductors'
[patent_app_type] => utility
[patent_app_number] => 10/983111
[patent_app_country] => US
[patent_app_date] => 2004-11-05
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 10983111
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/983111 | Semiconductor test board having laser patterned conductors | Nov 4, 2004 | Issued |
Array
(
[id] => 654642
[patent_doc_number] => 07109127
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[patent_issue_date] => 2006-09-19
[patent_title] => 'Manufacturing method of semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/981662 | Manufacturing method of semiconductor device | Nov 4, 2004 | Issued |
Array
(
[id] => 7003783
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[patent_title] => 'PAA- based etchant, methods of using same, and resultant structures'
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Array
(
[id] => 6918249
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[patent_title] => 'Manufacturing method of thin film device substrate'
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Array
(
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Array
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Array
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Array
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Array
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