| Application number | Title of the application | Filing Date | Status |
|---|
| 07/918876 | STRUCTURES FOR ELECTRICALLY CONDUCTIVE DECALS FILLED WITH INORGANIC INSULATOR MATERIAL | Jul 21, 1992 | Abandoned |
| 07/905499 | STRUCTURES FOR ELECTRICALLY CONDUCTIVE DECALS FILLED WITH ORGANIC INSULATOR MATERIAL | Jun 23, 1992 | Abandoned |
Array
(
[id] => 2934555
[patent_doc_number] => 05233134
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-03
[patent_title] => 'Mounting arrangement for a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/894096
[patent_app_country] => US
[patent_app_date] => 1992-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1812
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/233/05233134.pdf
[firstpage_image] =>[orig_patent_app_number] => 894096
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/894096 | Mounting arrangement for a semiconductor device | Jun 4, 1992 | Issued |
| 07/885059 | CHIP COIL AND MANUFACTURING METHOD THEREOF | May 14, 1992 | Abandoned |
Array
(
[id] => 2900019
[patent_doc_number] => 05245135
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-09-14
[patent_title] => 'Stackable high density interconnection mechanism (SHIM)'
[patent_app_type] => 1
[patent_app_number] => 7/870972
[patent_app_country] => US
[patent_app_date] => 1992-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 1845
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 182
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/245/05245135.pdf
[firstpage_image] =>[orig_patent_app_number] => 870972
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/870972 | Stackable high density interconnection mechanism (SHIM) | Apr 19, 1992 | Issued |
Array
(
[id] => 2987956
[patent_doc_number] => 05250757
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-05
[patent_title] => 'Printed wiring board having a connecting terminal'
[patent_app_type] => 1
[patent_app_number] => 7/869663
[patent_app_country] => US
[patent_app_date] => 1992-04-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 8
[patent_no_of_words] => 1644
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/250/05250757.pdf
[firstpage_image] =>[orig_patent_app_number] => 869663
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/869663 | Printed wiring board having a connecting terminal | Apr 15, 1992 | Issued |
Array
(
[id] => 2937326
[patent_doc_number] => 05229550
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-07-20
[patent_title] => 'Encapsulated circuitized power core alignment and lamination'
[patent_app_type] => 1
[patent_app_number] => 7/847122
[patent_app_country] => US
[patent_app_date] => 1992-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 4152
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 211
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/229/05229550.pdf
[firstpage_image] =>[orig_patent_app_number] => 847122
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/847122 | Encapsulated circuitized power core alignment and lamination | Mar 30, 1992 | Issued |
Array
(
[id] => 2981476
[patent_doc_number] => 05252781
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-12
[patent_title] => 'Substrate member having electric lines and apertured insulating film'
[patent_app_type] => 1
[patent_app_number] => 7/859750
[patent_app_country] => US
[patent_app_date] => 1992-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 13
[patent_no_of_words] => 3734
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 259
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/252/05252781.pdf
[firstpage_image] =>[orig_patent_app_number] => 859750
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/859750 | Substrate member having electric lines and apertured insulating film | Mar 29, 1992 | Issued |
Array
(
[id] => 2977697
[patent_doc_number] => 05182421
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-01-26
[patent_title] => 'Printed wiring board with test pattern for through holes'
[patent_app_type] => 1
[patent_app_number] => 7/845019
[patent_app_country] => US
[patent_app_date] => 1992-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 8
[patent_no_of_words] => 2007
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/182/05182421.pdf
[firstpage_image] =>[orig_patent_app_number] => 845019
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/845019 | Printed wiring board with test pattern for through holes | Mar 2, 1992 | Issued |
Array
(
[id] => 2896015
[patent_doc_number] => 05210379
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-05-11
[patent_title] => 'Printed wiring board with electromagnetic wave shielding layer'
[patent_app_type] => 1
[patent_app_number] => 7/841195
[patent_app_country] => US
[patent_app_date] => 1992-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1454
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/210/05210379.pdf
[firstpage_image] =>[orig_patent_app_number] => 841195
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/841195 | Printed wiring board with electromagnetic wave shielding layer | Feb 23, 1992 | Issued |
Array
(
[id] => 2914496
[patent_doc_number] => 05227589
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-07-13
[patent_title] => 'Plated-through interconnect solder thief'
[patent_app_type] => 1
[patent_app_number] => 7/812486
[patent_app_country] => US
[patent_app_date] => 1991-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 3003
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 155
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/227/05227589.pdf
[firstpage_image] =>[orig_patent_app_number] => 812486
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/812486 | Plated-through interconnect solder thief | Dec 22, 1991 | Issued |
Array
(
[id] => 2915113
[patent_doc_number] => 05237130
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-17
[patent_title] => 'Flip chip technology using electrically conductive polymers and dielectrics'
[patent_app_type] => 1
[patent_app_number] => 7/810513
[patent_app_country] => US
[patent_app_date] => 1991-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 10
[patent_no_of_words] => 2509
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/237/05237130.pdf
[firstpage_image] =>[orig_patent_app_number] => 810513
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/810513 | Flip chip technology using electrically conductive polymers and dielectrics | Dec 18, 1991 | Issued |
| 07/809126 | MULTILAYER WIRING BOARD, INTERLEVEL CONNECTOR, AND METHOD FOR MAKING SAME | Dec 17, 1991 | Abandoned |
Array
(
[id] => 2940786
[patent_doc_number] => 05260518
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-09
[patent_title] => 'Multilayer circuit board for mounting ICs and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 7/778178
[patent_app_country] => US
[patent_app_date] => 1991-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 27
[patent_no_of_words] => 5388
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 204
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/260/05260518.pdf
[firstpage_image] =>[orig_patent_app_number] => 778178
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/778178 | Multilayer circuit board for mounting ICs and method of manufacturing the same | Dec 12, 1991 | Issued |
Array
(
[id] => 2895304
[patent_doc_number] => 05270493
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-12-14
[patent_title] => 'Printed circuit board having electromagnetic wave shield layer and self-contained printed resistor'
[patent_app_type] => 1
[patent_app_number] => 7/789972
[patent_app_country] => US
[patent_app_date] => 1991-11-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 6112
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/270/05270493.pdf
[firstpage_image] =>[orig_patent_app_number] => 789972
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/789972 | Printed circuit board having electromagnetic wave shield layer and self-contained printed resistor | Nov 11, 1991 | Issued |
Array
(
[id] => 2953354
[patent_doc_number] => 05262596
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-16
[patent_title] => 'Printed wiring board shielded from electromagnetic wave'
[patent_app_type] => 1
[patent_app_number] => 7/776633
[patent_app_country] => US
[patent_app_date] => 1991-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 680
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 27
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/262/05262596.pdf
[firstpage_image] =>[orig_patent_app_number] => 776633
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/776633 | Printed wiring board shielded from electromagnetic wave | Oct 14, 1991 | Issued |
Array
(
[id] => 2979898
[patent_doc_number] => 05256836
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-26
[patent_title] => 'Thick film hybrid circuit board device and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 7/764062
[patent_app_country] => US
[patent_app_date] => 1991-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3402
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/256/05256836.pdf
[firstpage_image] =>[orig_patent_app_number] => 764062
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/764062 | Thick film hybrid circuit board device and method of manufacturing the same | Sep 23, 1991 | Issued |
Array
(
[id] => 2989781
[patent_doc_number] => 05266745
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-30
[patent_title] => 'Thick film hybrid arrangement with outer contacts'
[patent_app_type] => 1
[patent_app_number] => 7/760692
[patent_app_country] => US
[patent_app_date] => 1991-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 1088
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/266/05266745.pdf
[firstpage_image] =>[orig_patent_app_number] => 760692
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/760692 | Thick film hybrid arrangement with outer contacts | Sep 15, 1991 | Issued |
Array
(
[id] => 2900039
[patent_doc_number] => 05245136
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-09-14
[patent_title] => 'Hermetic package for an electronic device'
[patent_app_type] => 1
[patent_app_number] => 7/757747
[patent_app_country] => US
[patent_app_date] => 1991-09-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 5728
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/245/05245136.pdf
[firstpage_image] =>[orig_patent_app_number] => 757747
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/757747 | Hermetic package for an electronic device | Sep 10, 1991 | Issued |
Array
(
[id] => 2939122
[patent_doc_number] => 05189386
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-02-23
[patent_title] => 'Aluminum-stabilized superconductor and superconducting coil, and method of manufacturing the superconductor'
[patent_app_type] => 1
[patent_app_number] => 7/754230
[patent_app_country] => US
[patent_app_date] => 1991-08-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 8373
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 22
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/189/05189386.pdf
[firstpage_image] =>[orig_patent_app_number] => 754230
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/754230 | Aluminum-stabilized superconductor and superconducting coil, and method of manufacturing the superconductor | Aug 27, 1991 | Issued |