
Matthew E. Warren
Examiner (ID: 9293)
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2817, 2815 |
| Total Applications | 1867 |
| Issued Applications | 1521 |
| Pending Applications | 123 |
| Abandoned Applications | 248 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 11539435
[patent_doc_number] => 09613851
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-04-04
[patent_title] => 'Method for manufacturing interconnect structures incorporating air gap spacers'
[patent_app_type] => utility
[patent_app_number] => 14/846800
[patent_app_country] => US
[patent_app_date] => 2015-09-06
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14846800
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Array
(
[id] => 11660076
[patent_doc_number] => 09673087
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[patent_issue_date] => 2017-06-06
[patent_title] => 'Interconnect structures incorporating air-gap spacers'
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[patent_app_number] => 14/846801
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/846801 | Interconnect structures incorporating air-gap spacers | Sep 5, 2015 | Issued |
Array
(
[id] => 10479432
[patent_doc_number] => 20150364449
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[patent_kind] => A1
[patent_issue_date] => 2015-12-17
[patent_title] => 'Bonding Package Components Through Plating'
[patent_app_type] => utility
[patent_app_number] => 14/833840
[patent_app_country] => US
[patent_app_date] => 2015-08-24
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[patent_drawing_sheets_cnt] => 12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/833840 | Bonding package components through plating | Aug 23, 2015 | Issued |
Array
(
[id] => 10440416
[patent_doc_number] => 20150325428
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-11-12
[patent_title] => 'NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR WAFER'
[patent_app_type] => utility
[patent_app_number] => 14/805141
[patent_app_country] => US
[patent_app_date] => 2015-07-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
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[patent_no_of_words] => 14848
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14805141
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/805141 | Nitride semiconductor wafer, nitride semiconductor element, and method for manufacturing nitride semiconductor wafer | Jul 20, 2015 | Issued |
Array
(
[id] => 10738320
[patent_doc_number] => 20160084472
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-03-24
[patent_title] => 'LIGHT DIFFUSION MEMBER, AND LIGHT EMITTING DEVICE, AND DISPLAY DEVICE USING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/755191
[patent_app_country] => US
[patent_app_date] => 2015-06-30
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14755191
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/755191 | Light diffusion member, and light emitting device, and display device using the same | Jun 29, 2015 | Issued |
Array
(
[id] => 11187700
[patent_doc_number] => 09419111
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-08-16
[patent_title] => 'Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods'
[patent_app_type] => utility
[patent_app_number] => 14/748270
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/748270 | Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods | Jun 23, 2015 | Issued |
Array
(
[id] => 11890938
[patent_doc_number] => 09761503
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[patent_issue_date] => 2017-09-12
[patent_title] => 'Packaging mechanisms for dies with different sizes of connectors'
[patent_app_type] => utility
[patent_app_number] => 14/728608
[patent_app_country] => US
[patent_app_date] => 2015-06-02
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/728608 | Packaging mechanisms for dies with different sizes of connectors | Jun 1, 2015 | Issued |
Array
(
[id] => 11265911
[patent_doc_number] => 09490213
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[patent_issue_date] => 2016-11-08
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 14/702507
[patent_app_country] => US
[patent_app_date] => 2015-05-01
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/702507 | Semiconductor device and manufacturing method thereof | Apr 30, 2015 | Issued |
Array
(
[id] => 10351000
[patent_doc_number] => 20150236006
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-08-20
[patent_title] => 'NOVEL LATCH-UP IMMUNITY NLDMOS'
[patent_app_type] => utility
[patent_app_number] => 14/696986
[patent_app_country] => US
[patent_app_date] => 2015-04-27
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/696986 | Latch-up immunity nLDMOS | Apr 26, 2015 | Issued |
Array
(
[id] => 10329072
[patent_doc_number] => 20150214076
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[patent_kind] => A1
[patent_issue_date] => 2015-07-30
[patent_title] => 'SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND MOBILE TELEPHONE'
[patent_app_type] => utility
[patent_app_number] => 14/682233
[patent_app_country] => US
[patent_app_date] => 2015-04-09
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/682233 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND MOBILE TELEPHONE | Apr 8, 2015 | Abandoned |
Array
(
[id] => 10377833
[patent_doc_number] => 20150262840
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[patent_kind] => A1
[patent_issue_date] => 2015-09-17
[patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/663772
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/663772 | Semiconductor package and method for fabricating base for semiconductor package | Mar 19, 2015 | Issued |
Array
(
[id] => 11346515
[patent_doc_number] => 09530931
[patent_country] => US
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[patent_issue_date] => 2016-12-27
[patent_title] => 'Light-emitting semiconductor chip'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/662037 | Light-emitting semiconductor chip | Mar 17, 2015 | Issued |
Array
(
[id] => 10638672
[patent_doc_number] => 09356186
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[patent_kind] => B2
[patent_issue_date] => 2016-05-31
[patent_title] => 'Method for manufacturing LED chip with groove'
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[patent_app_number] => 14/621393
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/621393 | Method for manufacturing LED chip with groove | Feb 12, 2015 | Issued |
Array
(
[id] => 11781782
[patent_doc_number] => 09390981
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[patent_issue_date] => 2016-07-12
[patent_title] => 'Method of forming a complementary metal oxide semiconductor structure with N-type and P-type field effect transistors having symmetric source/drain junctions and optional dual silicides'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/614489 | Method of forming a complementary metal oxide semiconductor structure with N-type and P-type field effect transistors having symmetric source/drain junctions and optional dual silicides | Feb 4, 2015 | Issued |
Array
(
[id] => 11831824
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[patent_title] => 'Backside illuminated image sensor and method of manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/600684 | Backside illuminated image sensor and method of manufacturing the same | Jan 19, 2015 | Issued |
Array
(
[id] => 11014342
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[patent_title] => 'BLUE ENHANCED IMAGE SENSOR'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/601010 | Blue enhanced image sensor | Jan 19, 2015 | Issued |
Array
(
[id] => 10241003
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[patent_title] => 'METAL BUMPS FOR COOLING DEVICE CONNECTION'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/593617 | Method of forming conductive bumps for cooling device connection | Jan 8, 2015 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/586847 | Display panel integrated with photoelectric device | Dec 29, 2014 | Issued |