Search

Matthew Van Nguyen

Examiner (ID: 2067, Phone: (571)272-2081 , Office: P/2838 )

Most Active Art Unit
2838
Art Unit(s)
2839, 2111, 2838, 2102
Total Applications
3253
Issued Applications
3031
Pending Applications
87
Abandoned Applications
143

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18528676 [patent_doc_number] => 11715678 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-01 [patent_title] => Roughened conductive components [patent_app_type] => utility [patent_app_number] => 17/157557 [patent_app_country] => US [patent_app_date] => 2021-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 21 [patent_no_of_words] => 5078 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17157557 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/157557
Roughened conductive components Jan 24, 2021 Issued
Array ( [id] => 16827795 [patent_doc_number] => 20210143088 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-13 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/155696 [patent_app_country] => US [patent_app_date] => 2021-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11947 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 220 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17155696 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/155696
Semiconductor device including a semiconductor chip connected with a plurality of main terminals Jan 21, 2021 Issued
Array ( [id] => 17660807 [patent_doc_number] => 20220181272 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => STEM FOR SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/153004 [patent_app_country] => US [patent_app_date] => 2021-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3348 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17153004 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/153004
Stem for semiconductor package Jan 19, 2021 Issued
Array ( [id] => 19932929 [patent_doc_number] => 12306132 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-20 [patent_title] => Aerosol jet printed flexible graphene circuits for electrochemical sensing and biosensing [patent_app_type] => utility [patent_app_number] => 17/248211 [patent_app_country] => US [patent_app_date] => 2021-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 49 [patent_figures_cnt] => 81 [patent_no_of_words] => 25462 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17248211 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/248211
Aerosol jet printed flexible graphene circuits for electrochemical sensing and biosensing Jan 13, 2021 Issued
Array ( [id] => 17738123 [patent_doc_number] => 20220223585 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-14 [patent_title] => TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY [patent_app_type] => utility [patent_app_number] => 17/144411 [patent_app_country] => US [patent_app_date] => 2021-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5007 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17144411 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/144411
Trench capacitor assembly for high capacitance density Jan 7, 2021 Issued
Array ( [id] => 17745662 [patent_doc_number] => 11393744 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-19 [patent_title] => Metal powder layers between substrate, semiconductor chip and conductor [patent_app_type] => utility [patent_app_number] => 17/144057 [patent_app_country] => US [patent_app_date] => 2021-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4101 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17144057 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/144057
Metal powder layers between substrate, semiconductor chip and conductor Jan 6, 2021 Issued
Array ( [id] => 18120643 [patent_doc_number] => 11552042 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-10 [patent_title] => Solder material with two different size nickel particles [patent_app_type] => utility [patent_app_number] => 17/118008 [patent_app_country] => US [patent_app_date] => 2020-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 26 [patent_no_of_words] => 11586 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17118008 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/118008
Solder material with two different size nickel particles Dec 9, 2020 Issued
Array ( [id] => 18113221 [patent_doc_number] => 20230006101 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE COMPRISING SAME [patent_app_type] => utility [patent_app_number] => 17/757223 [patent_app_country] => US [patent_app_date] => 2020-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 29266 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17757223 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/757223
Light emitting element having a semiconductor main body core with a first end inclined and second end width smaller than the core Dec 6, 2020 Issued
Array ( [id] => 16717616 [patent_doc_number] => 20210084763 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-03-18 [patent_title] => METHODS OF MANUFACTURING CIRCUIT SUBSTRATE AND COMPONENT-MOUNTED SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/107953 [patent_app_country] => US [patent_app_date] => 2020-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8147 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17107953 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/107953
Sn--Bi and copper powder conductive paste in through hole of insulating substrate Nov 30, 2020 Issued
Array ( [id] => 17638117 [patent_doc_number] => 11348851 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-05-31 [patent_title] => Case with a plurality of pair case components for a semiconductor device [patent_app_type] => utility [patent_app_number] => 17/106636 [patent_app_country] => US [patent_app_date] => 2020-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 15 [patent_no_of_words] => 4300 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17106636 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/106636
Case with a plurality of pair case components for a semiconductor device Nov 29, 2020 Issued
Array ( [id] => 17630668 [patent_doc_number] => 20220165683 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-26 [patent_title] => ASSEMBLY STRUCTURE AND METHODS FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/105277 [patent_app_country] => US [patent_app_date] => 2020-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6605 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17105277 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/105277
Method for manufacturing assembly structure by using frame structure on substrate Nov 24, 2020 Issued
Array ( [id] => 17787989 [patent_doc_number] => 11411127 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-09 [patent_title] => Multi-dimensional integrated circuits having semiconductors mounted on multi-dimensional planes and multi-dimensional memory structure [patent_app_type] => utility [patent_app_number] => 17/102928 [patent_app_country] => US [patent_app_date] => 2020-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 18 [patent_no_of_words] => 7376 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17102928 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/102928
Multi-dimensional integrated circuits having semiconductors mounted on multi-dimensional planes and multi-dimensional memory structure Nov 23, 2020 Issued
Array ( [id] => 16858462 [patent_doc_number] => 20210159207 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-27 [patent_title] => METHOD FOR BONDING SEMICONDUCTOR COMPONENTS [patent_app_type] => utility [patent_app_number] => 17/102249 [patent_app_country] => US [patent_app_date] => 2020-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3534 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 15 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17102249 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/102249
Method of direct bonding semiconductor components Nov 22, 2020 Issued
Array ( [id] => 17772409 [patent_doc_number] => 11404361 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-08-02 [patent_title] => Method for fabricating package structure having encapsulate sensing chip [patent_app_type] => utility [patent_app_number] => 17/096359 [patent_app_country] => US [patent_app_date] => 2020-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 2640 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17096359 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/096359
Method for fabricating package structure having encapsulate sensing chip Nov 11, 2020 Issued
Array ( [id] => 19029933 [patent_doc_number] => 11929297 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-12 [patent_title] => Conductive thermal management architecture for electronic devices [patent_app_type] => utility [patent_app_number] => 17/092542 [patent_app_country] => US [patent_app_date] => 2020-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 3943 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17092542 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/092542
Conductive thermal management architecture for electronic devices Nov 8, 2020 Issued
Array ( [id] => 17582957 [patent_doc_number] => 20220139812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/088449 [patent_app_country] => US [patent_app_date] => 2020-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6525 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17088449 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/088449
Semiconductor package structure including an encapsulant having a cavity exposing an interposer Nov 2, 2020 Issued
Array ( [id] => 17410265 [patent_doc_number] => 11251163 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-02-15 [patent_title] => Semiconductor device having circuit board interposed between two conductor layers [patent_app_type] => utility [patent_app_number] => 17/084413 [patent_app_country] => US [patent_app_date] => 2020-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 35 [patent_no_of_words] => 18615 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17084413 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/084413
Semiconductor device having circuit board interposed between two conductor layers Oct 28, 2020 Issued
Array ( [id] => 17544393 [patent_doc_number] => 11309529 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-19 [patent_title] => Photolithographic patterning of organic electronic devices [patent_app_type] => utility [patent_app_number] => 17/082655 [patent_app_country] => US [patent_app_date] => 2020-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 45 [patent_no_of_words] => 18793 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 247 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17082655 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/082655
Photolithographic patterning of organic electronic devices Oct 27, 2020 Issued
Array ( [id] => 19245670 [patent_doc_number] => 12016133 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-18 [patent_title] => Circuit board with a conductive bump mounted on an adhesive layer [patent_app_type] => utility [patent_app_number] => 17/083271 [patent_app_country] => US [patent_app_date] => 2020-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 13 [patent_no_of_words] => 3767 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17083271 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/083271
Circuit board with a conductive bump mounted on an adhesive layer Oct 27, 2020 Issued
Array ( [id] => 16601591 [patent_doc_number] => 20210028122 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-01-28 [patent_title] => EMI Shielding for Flip Chip Package with Exposed Die Backside [patent_app_type] => utility [patent_app_number] => 17/068482 [patent_app_country] => US [patent_app_date] => 2020-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6131 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17068482 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/068482
EMI shielding for flip chip package with exposed die backside Oct 11, 2020 Issued
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