
Matthew Van Nguyen
Examiner (ID: 2067, Phone: (571)272-2081 , Office: P/2838 )
| Most Active Art Unit | 2838 |
| Art Unit(s) | 2839, 2111, 2838, 2102 |
| Total Applications | 3253 |
| Issued Applications | 3031 |
| Pending Applications | 87 |
| Abandoned Applications | 143 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19046685
[patent_doc_number] => 11935805
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-03-19
[patent_title] => Package with underfill containment barrier
[patent_app_type] => utility
[patent_app_number] => 18/133868
[patent_app_country] => US
[patent_app_date] => 2023-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 10
[patent_no_of_words] => 5017
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18133868
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/133868 | Package with underfill containment barrier | Apr 11, 2023 | Issued |
Array
(
[id] => 20484269
[patent_doc_number] => 12532750
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-01-20
[patent_title] => Clip for a discrete power semiconductor package
[patent_app_type] => utility
[patent_app_number] => 18/132490
[patent_app_country] => US
[patent_app_date] => 2023-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 0
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18132490
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/132490 | Clip for a discrete power semiconductor package | Apr 9, 2023 | Issued |
Array
(
[id] => 18540913
[patent_doc_number] => 20230246024
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-03
[patent_title] => TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY
[patent_app_type] => utility
[patent_app_number] => 18/298211
[patent_app_country] => US
[patent_app_date] => 2023-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5047
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -6
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18298211
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/298211 | Trench capacitor assembly for high capacitance density | Apr 9, 2023 | Issued |
Array
(
[id] => 18766981
[patent_doc_number] => 11817391
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-11-14
[patent_title] => Power delivery for embedded bridge die utilizing trench structures
[patent_app_type] => utility
[patent_app_number] => 18/128960
[patent_app_country] => US
[patent_app_date] => 2023-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 18
[patent_no_of_words] => 6364
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 121
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18128960
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/128960 | Power delivery for embedded bridge die utilizing trench structures | Mar 29, 2023 | Issued |
Array
(
[id] => 18533233
[patent_doc_number] => 20230238309
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-07-27
[patent_title] => SEMICONDUCTOR DEVICE AND LEAD FRAME
[patent_app_type] => utility
[patent_app_number] => 18/193596
[patent_app_country] => US
[patent_app_date] => 2023-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7886
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18193596
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/193596 | SEMICONDUCTOR DEVICE AND LEAD FRAME | Mar 29, 2023 | Pending |
Array
(
[id] => 18950981
[patent_doc_number] => 11894287
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-02-06
[patent_title] => Adhesive and thermal interface material on a plurality of dies covered by a lid
[patent_app_type] => utility
[patent_app_number] => 18/181552
[patent_app_country] => US
[patent_app_date] => 2023-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 14
[patent_no_of_words] => 7103
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18181552
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/181552 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Mar 9, 2023 | Issued |
Array
(
[id] => 20404471
[patent_doc_number] => 12494452
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-09
[patent_title] => Strap with a notch portion attached to a chip by a joint member
[patent_app_type] => utility
[patent_app_number] => 18/116711
[patent_app_country] => US
[patent_app_date] => 2023-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 5380
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 124
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18116711
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/116711 | Strap with a notch portion attached to a chip by a joint member | Mar 1, 2023 | Issued |
Array
(
[id] => 19071239
[patent_doc_number] => 20240105665
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-28
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/116680
[patent_app_country] => US
[patent_app_date] => 2023-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7171
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -6
[patent_words_short_claim] => 161
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18116680
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/116680 | SEMICONDUCTOR DEVICE | Mar 1, 2023 | Abandoned |
Array
(
[id] => 20483077
[patent_doc_number] => 12531554
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-01-20
[patent_title] => Enhanced solid state circuit breaker structure
[patent_app_type] => utility
[patent_app_number] => 18/114645
[patent_app_country] => US
[patent_app_date] => 2023-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 0
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18114645
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/114645 | Enhanced solid state circuit breaker structure | Feb 26, 2023 | Issued |
Array
(
[id] => 20469472
[patent_doc_number] => 12525515
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-01-13
[patent_title] => Groove portion surrounding the mounting region of a lead frame
[patent_app_type] => utility
[patent_app_number] => 18/174610
[patent_app_country] => US
[patent_app_date] => 2023-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 21
[patent_no_of_words] => 2250
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174610
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/174610 | Groove portion surrounding the mounting region of a lead frame | Feb 24, 2023 | Issued |
Array
(
[id] => 19407165
[patent_doc_number] => 20240290676
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-29
[patent_title] => SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
[patent_app_type] => utility
[patent_app_number] => 18/174039
[patent_app_country] => US
[patent_app_date] => 2023-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5171
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 53
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174039
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/174039 | SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES | Feb 23, 2023 | Pending |
Array
(
[id] => 18456622
[patent_doc_number] => 20230197904
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-22
[patent_title] => LIGHT-EMITTING DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/113344
[patent_app_country] => US
[patent_app_date] => 2023-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 21378
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 236
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18113344
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/113344 | Light-emitting device with a plurality of concave parts on the edge of the semiconductor mesa | Feb 22, 2023 | Issued |
Array
(
[id] => 20532299
[patent_doc_number] => 12550753
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-02-10
[patent_title] => Semiconductor device including a lead connector having a plurality of protruding portions
[patent_app_type] => utility
[patent_app_number] => 18/113123
[patent_app_country] => US
[patent_app_date] => 2023-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 1113
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 279
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18113123
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/113123 | SEMICONDUCTOR DEVICE | Feb 22, 2023 | Issued |
Array
(
[id] => 19392843
[patent_doc_number] => 20240282713
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-22
[patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/173027
[patent_app_country] => US
[patent_app_date] => 2023-02-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 23053
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18173027
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/173027 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Feb 21, 2023 | Pending |
Array
(
[id] => 18585990
[patent_doc_number] => 20230268255
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-24
[patent_title] => Power Semiconductor Device
[patent_app_type] => utility
[patent_app_number] => 18/111242
[patent_app_country] => US
[patent_app_date] => 2023-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4759
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 206
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18111242
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/111242 | Power Semiconductor Device | Feb 16, 2023 | Pending |
Array
(
[id] => 20540577
[patent_doc_number] => 12557667
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-02-17
[patent_title] => Semiconductor device with lead frame having an offset portion on a die pad
[patent_app_type] => utility
[patent_app_number] => 18/170159
[patent_app_country] => US
[patent_app_date] => 2023-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 28
[patent_no_of_words] => 3583
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 252
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18170159
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/170159 | SEMICONDUCTOR DEVICE | Feb 15, 2023 | Issued |
Array
(
[id] => 18572688
[patent_doc_number] => 20230263026
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-17
[patent_title] => LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/109274
[patent_app_country] => US
[patent_app_date] => 2023-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9050
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -13
[patent_words_short_claim] => 81
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18109274
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/109274 | LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE | Feb 13, 2023 | Pending |
Array
(
[id] => 18473423
[patent_doc_number] => 20230207711
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-29
[patent_title] => MULTI-DIMENSIONAL PHOTONIC INTEGRATED CIRCUITS AND MEMORY STRUCTURE FOR PHOTONIC INTEGRATED CIRCUITS AND ASSOCIATED SYSTEMS AND METHODS
[patent_app_type] => utility
[patent_app_number] => 18/109291
[patent_app_country] => US
[patent_app_date] => 2023-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10631
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 59
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18109291
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/109291 | Multi-dimensional photonic integrated circuits and memory structure having optical components mounted on multiple planes of a multi-dimensional package | Feb 13, 2023 | Issued |
Array
(
[id] => 18600207
[patent_doc_number] => 20230275008
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-31
[patent_title] => SEMICONDUCTOR PACKAGE WITH OVERLAPPING LEADS AND DIE PAD
[patent_app_type] => utility
[patent_app_number] => 18/169146
[patent_app_country] => US
[patent_app_date] => 2023-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5788
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169146
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/169146 | SEMICONDUCTOR PACKAGE WITH OVERLAPPING LEADS AND DIE PAD | Feb 13, 2023 | Pending |
Array
(
[id] => 20305410
[patent_doc_number] => 12451410
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-10-21
[patent_title] => Semiconductor package module including vertical terminals
[patent_app_type] => utility
[patent_app_number] => 18/109190
[patent_app_country] => US
[patent_app_date] => 2023-02-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 19
[patent_no_of_words] => 0
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 193
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18109190
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/109190 | Semiconductor package module including vertical terminals | Feb 12, 2023 | Issued |