
Megan Cassandra Mcculley
Examiner (ID: 9285, Phone: (571)270-3292 , Office: P/1767 )
| Most Active Art Unit | 1767 |
| Art Unit(s) | 1767, 1796 |
| Total Applications | 866 |
| Issued Applications | 481 |
| Pending Applications | 77 |
| Abandoned Applications | 325 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5524244
[patent_doc_number] => 20090194320
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-08-06
[patent_title] => 'White Prepreg, White Laminated Plate, and Metal Foil Clad White Laminated Plate'
[patent_app_type] => utility
[patent_app_number] => 11/920399
[patent_app_country] => US
[patent_app_date] => 2006-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 5792
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0194/20090194320.pdf
[firstpage_image] =>[orig_patent_app_number] => 11920399
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/920399 | White Prepreg, White Laminated Plate, and Metal Foil Clad White Laminated Plate | May 9, 2006 | Abandoned |
Array
(
[id] => 6548709
[patent_doc_number] => 20100016498
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-21
[patent_title] => 'Epoxy resin composition and cured article thereof'
[patent_app_type] => utility
[patent_app_number] => 11/919587
[patent_app_country] => US
[patent_app_date] => 2006-05-08
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[pdf_file] => publications/A1/0016/20100016498.pdf
[firstpage_image] =>[orig_patent_app_number] => 11919587
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/919587 | Epoxy resin composition and cured article thereof | May 7, 2006 | Abandoned |
Array
(
[id] => 7535343
[patent_doc_number] => 08048969
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-01
[patent_title] => 'Semiconductor encapsulating epoxy resin composition and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/408955
[patent_app_country] => US
[patent_app_date] => 2006-04-24
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/048/08048969.pdf
[firstpage_image] =>[orig_patent_app_number] => 11408955
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/408955 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Apr 23, 2006 | Issued |
Array
(
[id] => 5923117
[patent_doc_number] => 20060240731
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-26
[patent_title] => 'Fire Resisting Composition'
[patent_app_type] => utility
[patent_app_number] => 11/279827
[patent_app_country] => US
[patent_app_date] => 2006-04-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 6554
[patent_no_of_claims] => 26
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[pdf_file] => publications/A1/0240/20060240731.pdf
[firstpage_image] =>[orig_patent_app_number] => 11279827
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/279827 | Fire Resisting Composition | Apr 13, 2006 | Abandoned |
Array
(
[id] => 4839621
[patent_doc_number] => 20080280106
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-13
[patent_title] => 'Method of Reusing Flexible Mold and Microstructure Precursor Composition'
[patent_app_type] => utility
[patent_app_number] => 11/910651
[patent_app_country] => US
[patent_app_date] => 2006-04-13
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[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0280/20080280106.pdf
[firstpage_image] =>[orig_patent_app_number] => 11910651
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/910651 | Method of Reusing Flexible Mold and Microstructure Precursor Composition | Apr 12, 2006 | Abandoned |
Array
(
[id] => 5124588
[patent_doc_number] => 20070236859
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'Organic encapsulant compositions for protection of electronic components'
[patent_app_type] => utility
[patent_app_number] => 11/401149
[patent_app_country] => US
[patent_app_date] => 2006-04-10
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11401149
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/401149 | Organic encapsulant compositions for protection of electronic components | Apr 9, 2006 | Abandoned |
Array
(
[id] => 5248033
[patent_doc_number] => 20070244267
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-18
[patent_title] => 'Hydrophobic crosslinkable compositions for electronic applications'
[patent_app_type] => utility
[patent_app_number] => 11/401150
[patent_app_country] => US
[patent_app_date] => 2006-04-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[patent_no_of_words] => 10702
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0244/20070244267.pdf
[firstpage_image] =>[orig_patent_app_number] => 11401150
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/401150 | Hydrophobic crosslinkable compositions for electronic applications | Apr 9, 2006 | Abandoned |
Array
(
[id] => 5858372
[patent_doc_number] => 20060228562
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-12
[patent_title] => 'Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating'
[patent_app_type] => utility
[patent_app_number] => 11/388791
[patent_app_country] => US
[patent_app_date] => 2006-03-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 13753
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0228/20060228562.pdf
[firstpage_image] =>[orig_patent_app_number] => 11388791
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/388791 | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating | Mar 23, 2006 | Abandoned |
Array
(
[id] => 5699836
[patent_doc_number] => 20060216520
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-28
[patent_title] => 'Semiconductor encapsulating epoxy resin composition and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/386949
[patent_app_country] => US
[patent_app_date] => 2006-03-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0216/20060216520.pdf
[firstpage_image] =>[orig_patent_app_number] => 11386949
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/386949 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Mar 22, 2006 | Abandoned |
Array
(
[id] => 4470832
[patent_doc_number] => 07943706
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-17
[patent_title] => 'Semiconductor encapsulating epoxy resin composition and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/386667
[patent_app_country] => US
[patent_app_date] => 2006-03-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/943/07943706.pdf
[firstpage_image] =>[orig_patent_app_number] => 11386667
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/386667 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Mar 22, 2006 | Issued |
Array
(
[id] => 5331462
[patent_doc_number] => 20090111939
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-04-30
[patent_title] => 'Method for Purifying a Contaminated Solvent and Concurrently Producing a Semi-Finished Product for Use in the Production of Panels'
[patent_app_type] => utility
[patent_app_number] => 12/225153
[patent_app_country] => US
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[pdf_file] => publications/A1/0111/20090111939.pdf
[firstpage_image] =>[orig_patent_app_number] => 12225153
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/225153 | Method for Purifying a Contaminated Solvent and Concurrently Producing a Semi-Finished Product for Use in the Production of Panels | Mar 20, 2006 | Abandoned |
Array
(
[id] => 5022503
[patent_doc_number] => 20070148469
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-28
[patent_title] => 'Encapsulation composition for pressure signal transmission and sensor'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/374697 | Encapsulation composition for pressure signal transmission and sensor | Mar 12, 2006 | Abandoned |
Array
(
[id] => 5011545
[patent_doc_number] => 20070282024
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[patent_issue_date] => 2007-12-06
[patent_title] => 'Process for Producing Porous Object and Porous Object Obtained By the Same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/791192 | Process for Producing Porous Object and Porous Object Obtained By the Same | Mar 9, 2006 | Abandoned |
Array
(
[id] => 5784821
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[patent_issue_date] => 2006-09-14
[patent_title] => 'Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same'
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[patent_app_number] => 11/364327
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Array
(
[id] => 5705015
[patent_doc_number] => 20060194063
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[patent_title] => 'Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/359773 | Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions | Feb 22, 2006 | Abandoned |
Array
(
[id] => 5683653
[patent_doc_number] => 20060199923
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-07
[patent_title] => 'Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device'
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[patent_app_number] => 11/357988
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Array
(
[id] => 4867634
[patent_doc_number] => 20080146693
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[patent_kind] => A1
[patent_issue_date] => 2008-06-19
[patent_title] => 'Energy-Curable Coating Compositions'
[patent_app_type] => utility
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Array
(
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Array
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[patent_title] => 'Mold compositions with high adhesion to metal substrates'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/348505 | Mold compositions with high adhesion to metal substrates | Feb 6, 2006 | Issued |
Array
(
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[patent_title] => 'Epoxy hardener systems based on aminomethylene-ethyleneureas'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/345509 | Epoxy hardener systems based on aminobis(methylene-ethyleneurea) | Jan 31, 2006 | Issued |