
Meiya Li
Examiner (ID: 9342, Phone: (571)270-1572 , Office: P/2811 )
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 1051 |
| Issued Applications | 656 |
| Pending Applications | 104 |
| Abandoned Applications | 324 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5780225
[patent_doc_number] => 20060202320
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-14
[patent_title] => 'Power semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 11/370716
[patent_app_country] => US
[patent_app_date] => 2006-03-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2033
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0202/20060202320.pdf
[firstpage_image] =>[orig_patent_app_number] => 11370716
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/370716 | Power semiconductor package | Mar 7, 2006 | Abandoned |
Array
(
[id] => 5652876
[patent_doc_number] => 20060138611
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-29
[patent_title] => 'IC substrate with over voltage protection function'
[patent_app_type] => utility
[patent_app_number] => 11/363880
[patent_app_country] => US
[patent_app_date] => 2006-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 2958
[patent_no_of_claims] => 5
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0138/20060138611.pdf
[firstpage_image] =>[orig_patent_app_number] => 11363880
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/363880 | IC substrate with over voltage protection function | Feb 27, 2006 | Abandoned |
Array
(
[id] => 5680896
[patent_doc_number] => 20060197163
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-07
[patent_title] => 'Semiconductor device and method for manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/363694
[patent_app_country] => US
[patent_app_date] => 2006-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 29
[patent_no_of_words] => 10079
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0197/20060197163.pdf
[firstpage_image] =>[orig_patent_app_number] => 11363694
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/363694 | Semiconductor device and method for manufacturing semiconductor device | Feb 26, 2006 | Abandoned |
Array
(
[id] => 5168921
[patent_doc_number] => 20070069352
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Bumpless chip package and fabricating process thereof'
[patent_app_type] => utility
[patent_app_number] => 11/360216
[patent_app_country] => US
[patent_app_date] => 2006-02-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2995
[patent_no_of_claims] => 20
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0069/20070069352.pdf
[firstpage_image] =>[orig_patent_app_number] => 11360216
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/360216 | Bumpless chip package and fabricating process thereof | Feb 21, 2006 | Abandoned |
Array
(
[id] => 5627284
[patent_doc_number] => 20060265789
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'Nanotube with a T shaped structure and a field effect transistor, and a method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/355135
[patent_app_country] => US
[patent_app_date] => 2006-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4709
[patent_no_of_claims] => 27
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0265/20060265789.pdf
[firstpage_image] =>[orig_patent_app_number] => 11355135
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/355135 | Nanotube with a T shaped structure and a field effect transistor, and a method of manufacturing the same | Feb 15, 2006 | Abandoned |
Array
(
[id] => 4576897
[patent_doc_number] => 07829982
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-11-09
[patent_title] => 'Lead frame, sensor including lead frame and method of forming sensor including lead frame'
[patent_app_type] => utility
[patent_app_number] => 11/355175
[patent_app_country] => US
[patent_app_date] => 2006-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 18157
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/829/07829982.pdf
[firstpage_image] =>[orig_patent_app_number] => 11355175
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/355175 | Lead frame, sensor including lead frame and method of forming sensor including lead frame | Feb 15, 2006 | Issued |
Array
(
[id] => 33712
[patent_doc_number] => 07791192
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2010-09-07
[patent_title] => 'Circuit for and method of implementing a capacitor in an integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 11/340996
[patent_app_country] => US
[patent_app_date] => 2006-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 21
[patent_no_of_words] => 4899
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 333
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/791/07791192.pdf
[firstpage_image] =>[orig_patent_app_number] => 11340996
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/340996 | Circuit for and method of implementing a capacitor in an integrated circuit | Jan 26, 2006 | Issued |
Array
(
[id] => 5129124
[patent_doc_number] => 20070205521
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-06
[patent_title] => 'Encapsulation of Semiconductor Components'
[patent_app_type] => utility
[patent_app_number] => 11/307225
[patent_app_country] => US
[patent_app_date] => 2006-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3485
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0205/20070205521.pdf
[firstpage_image] =>[orig_patent_app_number] => 11307225
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/307225 | Encapsulation of Semiconductor Components | Jan 26, 2006 | Abandoned |
Array
(
[id] => 5751081
[patent_doc_number] => 20060220230
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-05
[patent_title] => 'Semiconductor device and method of manufacturing thereof'
[patent_app_type] => utility
[patent_app_number] => 11/341005
[patent_app_country] => US
[patent_app_date] => 2006-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 6823
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[pdf_file] => publications/A1/0220/20060220230.pdf
[firstpage_image] =>[orig_patent_app_number] => 11341005
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/341005 | Semiconductor device and method of manufacturing thereof | Jan 26, 2006 | Issued |
Array
(
[id] => 5664755
[patent_doc_number] => 20060170105
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-03
[patent_title] => 'Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area'
[patent_app_type] => utility
[patent_app_number] => 11/340695
[patent_app_country] => US
[patent_app_date] => 2006-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[patent_no_of_words] => 10582
[patent_no_of_claims] => 21
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[pdf_file] => publications/A1/0170/20060170105.pdf
[firstpage_image] =>[orig_patent_app_number] => 11340695
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/340695 | Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area | Jan 26, 2006 | Abandoned |
Array
(
[id] => 5157555
[patent_doc_number] => 20070170599
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'Flip-attached and underfilled stacked semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 11/337985
[patent_app_country] => US
[patent_app_date] => 2006-01-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 4523
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0170/20070170599.pdf
[firstpage_image] =>[orig_patent_app_number] => 11337985
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/337985 | Flip-attached and underfilled stacked semiconductor devices | Jan 23, 2006 | Abandoned |
Array
(
[id] => 9216734
[patent_doc_number] => 08629537
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-01-14
[patent_title] => 'Padless die support integrated circuit package system'
[patent_app_type] => utility
[patent_app_number] => 11/339176
[patent_app_country] => US
[patent_app_date] => 2006-01-23
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/339176 | Padless die support integrated circuit package system | Jan 22, 2006 | Issued |
Array
(
[id] => 5616987
[patent_doc_number] => 20060186519
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-24
[patent_title] => 'Semiconductor device and unit equipped with the same'
[patent_app_type] => utility
[patent_app_number] => 11/334106
[patent_app_country] => US
[patent_app_date] => 2006-01-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[firstpage_image] =>[orig_patent_app_number] => 11334106
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/334106 | Semiconductor device and unit equipped with the same | Jan 16, 2006 | Abandoned |
Array
(
[id] => 5664737
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[patent_country] => US
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[patent_issue_date] => 2006-08-03
[patent_title] => 'Semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 11332256
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/332256 | Semiconductor device | Jan 16, 2006 | Abandoned |
Array
(
[id] => 5593927
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[patent_title] => 'Stacked semiconductor package having interposing print circuit board'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/332185 | Stacked semiconductor package having interposing print circuit board | Jan 16, 2006 | Abandoned |
Array
(
[id] => 5593919
[patent_doc_number] => 20060157835
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-20
[patent_title] => 'Semiconductor device and method of fabricating same'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2006-01-12
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[firstpage_image] =>[orig_patent_app_number] => 11330095
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/330095 | Semiconductor device and method of fabricating same | Jan 11, 2006 | Abandoned |
Array
(
[id] => 5219903
[patent_doc_number] => 20070161214
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'High k gate stack on III-V compound semiconductors'
[patent_app_type] => utility
[patent_app_number] => 11/327675
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11327675
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/327675 | High k gate stack on III-V compound semiconductors | Jan 5, 2006 | Abandoned |
Array
(
[id] => 5180663
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[patent_country] => US
[patent_kind] => A1
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[patent_title] => 'Flash memory and a method of manufacturing the same'
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[firstpage_image] =>[orig_patent_app_number] => 11320606
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/320606 | Flash memory and a method of manufacturing the same | Dec 29, 2005 | Issued |
Array
(
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[patent_title] => 'Semiconductor package device having reduced mounting height and method for manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/320616 | Semiconductor package device having reduced mounting height and method for manufacturing the same | Dec 29, 2005 | Abandoned |
Array
(
[id] => 5680936
[patent_doc_number] => 20060197203
[patent_country] => US
[patent_kind] => A1
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[patent_title] => 'Die structure of package and method of manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/320635 | Die structure of package and method of manufacturing the same | Dec 29, 2005 | Abandoned |