
Michael Bernshteyn
Examiner (ID: 11766, Phone: (571)272-2411 , Office: P/1762 )
| Most Active Art Unit | 1762 |
| Art Unit(s) | 1762, 1764, 1796, 1713 |
| Total Applications | 1884 |
| Issued Applications | 1528 |
| Pending Applications | 44 |
| Abandoned Applications | 322 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 65108
[patent_doc_number] => 07759790
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-07-20
[patent_title] => 'Lidless semiconductor cooling'
[patent_app_type] => utility
[patent_app_number] => 11/707327
[patent_app_country] => US
[patent_app_date] => 2007-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 9
[patent_no_of_words] => 3661
[patent_no_of_claims] => 9
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[patent_words_short_claim] => 243
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/759/07759790.pdf
[firstpage_image] =>[orig_patent_app_number] => 11707327
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/707327 | Lidless semiconductor cooling | Feb 15, 2007 | Issued |
Array
(
[id] => 5082980
[patent_doc_number] => 20070273031
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-29
[patent_title] => 'Method of wire bonding over active area of a semiconductor circuit'
[patent_app_type] => utility
[patent_app_number] => 11/707827
[patent_app_country] => US
[patent_app_date] => 2007-02-16
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[patent_drawing_sheets_cnt] => 7
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[firstpage_image] =>[orig_patent_app_number] => 11707827
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/707827 | Method of wire bonding over active area of a semiconductor circuit | Feb 15, 2007 | Issued |
Array
(
[id] => 360042
[patent_doc_number] => 07485921
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-02-03
[patent_title] => 'Trench gate type MOS transistor semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/674337
[patent_app_country] => US
[patent_app_date] => 2007-02-13
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[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/07/485/07485921.pdf
[firstpage_image] =>[orig_patent_app_number] => 11674337
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/674337 | Trench gate type MOS transistor semiconductor device | Feb 12, 2007 | Issued |
Array
(
[id] => 311450
[patent_doc_number] => 07528482
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-05-05
[patent_title] => 'Embedded chip package with improved heat dissipation performance and method of making the same'
[patent_app_type] => utility
[patent_app_number] => 11/672507
[patent_app_country] => US
[patent_app_date] => 2007-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
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[patent_no_of_words] => 2452
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[firstpage_image] =>[orig_patent_app_number] => 11672507
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/672507 | Embedded chip package with improved heat dissipation performance and method of making the same | Feb 6, 2007 | Issued |
Array
(
[id] => 93147
[patent_doc_number] => 07732913
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-08
[patent_title] => 'Semiconductor package substrate'
[patent_app_type] => utility
[patent_app_number] => 11/701767
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[patent_app_date] => 2007-02-02
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/732/07732913.pdf
[firstpage_image] =>[orig_patent_app_number] => 11701767
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/701767 | Semiconductor package substrate | Feb 1, 2007 | Issued |
Array
(
[id] => 4952591
[patent_doc_number] => 20080185615
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-07
[patent_title] => 'Method and Apparatus for Double-Sided Biasing of Nonvolatile Memory'
[patent_app_type] => utility
[patent_app_number] => 11/670677
[patent_app_country] => US
[patent_app_date] => 2007-02-02
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[firstpage_image] =>[orig_patent_app_number] => 11670677
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/670677 | Method and apparatus for double-sided biasing of nonvolatile memory | Feb 1, 2007 | Issued |
Array
(
[id] => 5113078
[patent_doc_number] => 20070196993
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-23
[patent_title] => 'Semiconductor element'
[patent_app_type] => utility
[patent_app_number] => 11/701327
[patent_app_country] => US
[patent_app_date] => 2007-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0196/20070196993.pdf
[firstpage_image] =>[orig_patent_app_number] => 11701327
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/701327 | Semiconductor element | Jan 31, 2007 | Abandoned |
Array
(
[id] => 4843607
[patent_doc_number] => 20080180015
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[patent_kind] => A1
[patent_issue_date] => 2008-07-31
[patent_title] => 'Heat-sink module of light-emitting diode'
[patent_app_type] => utility
[patent_app_number] => 11/699247
[patent_app_country] => US
[patent_app_date] => 2007-01-29
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[patent_no_of_words] => 1248
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[pdf_file] => publications/A1/0180/20080180015.pdf
[firstpage_image] =>[orig_patent_app_number] => 11699247
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/699247 | Heat-sink module of light-emitting diode | Jan 28, 2007 | Abandoned |
Array
(
[id] => 4974687
[patent_doc_number] => 20070215917
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-20
[patent_title] => 'Semiconductor integrated circuit device and a method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/698877
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/698877 | Semiconductor integrated circuit device and a method of manufacturing the same | Jan 28, 2007 | Abandoned |
Array
(
[id] => 5176329
[patent_doc_number] => 20070177388
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-02
[patent_title] => 'Light-enhancing structure'
[patent_app_type] => utility
[patent_app_number] => 11/655537
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[patent_app_date] => 2007-01-19
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11655537
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/655537 | Light-enhancing structure | Jan 18, 2007 | Abandoned |
Array
(
[id] => 5157431
[patent_doc_number] => 20070170475
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'MOUNTING STRUCTURE OF IMAGE PICKUP DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/623457
[patent_app_country] => US
[patent_app_date] => 2007-01-16
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/623457 | MOUNTING STRUCTURE OF IMAGE PICKUP DEVICE | Jan 15, 2007 | Abandoned |
Array
(
[id] => 5157505
[patent_doc_number] => 20070170549
[patent_country] => US
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[patent_issue_date] => 2007-07-26
[patent_title] => 'Semiconductor device having IGBT and diode'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/649367 | Semiconductor device having IGBT and diode | Jan 3, 2007 | Issued |
Array
(
[id] => 4941715
[patent_doc_number] => 20080079038
[patent_country] => US
[patent_kind] => A1
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[patent_title] => 'Semiconductor devices with gate insulation layers having different thicknesses and methods of forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/646127
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/646127 | Semiconductor devices with gate insulation layers having different thicknesses and methods of forming the same | Dec 26, 2006 | Abandoned |
Array
(
[id] => 5488300
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[patent_title] => 'SWITCHING ELEMENT AND METHOD OF MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/097468 | SWITCHING ELEMENT AND METHOD OF MANUFACTURING THE SAME | Dec 14, 2006 | Abandoned |
Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/095663 | Semiconductor device and method of manufacturing the same | Nov 30, 2006 | Issued |
Array
(
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[patent_title] => 'WAFER LEVEL PACKAGE STRUCTURE, AND SENSOR DEVICE OBTAINED FROM THE SAME PACKAGE STRUCTURE'
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/550793 | Method and apparatus for integrated-circuit battery devices | Oct 17, 2006 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/089497 | Semiconductor Substrate and Method for Manufacturing the Same | Oct 4, 2006 | Abandoned |