Michael N. Opsasnick

Array ( [id] => 5253385 [patent_doc_number] => 20070134841 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-14 [patent_title] => 'Electrical and thermal contact for use in semiconductor devices and corresponding methods' [patent_app_type] => utility [patent_app_number] => 11/702356 [patent_app_country] => US [patent_app_date] => 2007-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4576 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0134/20070134841.pdf [firstpage_image] =>[orig_patent_app_number] => 11702356 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5139058 [patent_doc_number] => 20070001274 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-04 [patent_title] => 'Multi-part lead frame with dissimilar materials' [patent_app_type] => utility [patent_app_number] => 11/516425 [patent_app_country] => US [patent_app_date] => 2006-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 6450 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20070001274.pdf [firstpage_image] =>[orig_patent_app_number] => 11516425 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5159988 [patent_doc_number] => 20070173032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-26 [patent_title] => 'Wafer dicing by channels and saw' [patent_app_type] => utility [patent_app_number] => 11/338989 [patent_app_country] => US [patent_app_date] => 2006-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1039 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20070173032.pdf [firstpage_image] =>[orig_patent_app_number] => 11338989 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5807902 [patent_doc_number] => 20060094257 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-04 [patent_title] => 'Low thermal budget dielectric stack for SONOS nonvolatile memories' [patent_app_type] => utility [patent_app_number] => 11/267928 [patent_app_country] => US [patent_app_date] => 2005-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3437 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0094/20060094257.pdf [firstpage_image] =>[orig_patent_app_number] => 11267928 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5865643 [patent_doc_number] => 20060099774 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-05-11 [patent_title] => 'Method of laser processing a gallium nitride substrate' [patent_app_type] => utility [patent_app_number] => 11/261599 [patent_app_country] => US [patent_app_date] => 2005-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2485 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0099/20060099774.pdf [firstpage_image] =>[orig_patent_app_number] => 11261599 [rel_patent_id] =>[rel_patent_doc_number] =>)