Mikado Ryan Buiz
Examiner (ID: 12419, Phone: (571)272-6578 , Office: P/3600 )
Most Active Art Unit | 3506 |
Art Unit(s) | 3731, 2899, 3506 |
Total Applications | 2305 |
Issued Applications | 2195 |
Pending Applications | 18 |
Abandoned Applications | 92 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 263713
[patent_doc_number] => 07569477
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-08-04
[patent_title] => 'Method for fabricating fine pattern in semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/824362
[patent_app_country] => US
[patent_app_date] => 2007-06-29
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[pdf_file] => patents/07/569/07569477.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/824362 | Method for fabricating fine pattern in semiconductor device | Jun 28, 2007 | Issued |
Array
(
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[patent_doc_number] => 07648904
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[patent_kind] => B2
[patent_issue_date] => 2010-01-19
[patent_title] => 'Metal line in semiconductor device and method for forming the same'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11770681
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/770681 | Metal line in semiconductor device and method for forming the same | Jun 27, 2007 | Issued |
Array
(
[id] => 4849676
[patent_doc_number] => 20080315418
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[patent_kind] => A1
[patent_issue_date] => 2008-12-25
[patent_title] => 'Methods of post-contact back end of line through-hole via integration'
[patent_app_type] => utility
[patent_app_number] => 11/820811
[patent_app_country] => US
[patent_app_date] => 2007-06-20
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[pdf_file] => publications/A1/0315/20080315418.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/820811 | Methods of post-contact back end of the line through-hole via integration | Jun 19, 2007 | Issued |
Array
(
[id] => 337970
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[patent_issue_date] => 2009-03-17
[patent_title] => 'Structure and method of integrating compound and elemental semiconductors for high-performance CMOS'
[patent_app_type] => utility
[patent_app_number] => 11/762376
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[patent_app_date] => 2007-06-13
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/762376 | Structure and method of integrating compound and elemental semiconductors for high-performance CMOS | Jun 12, 2007 | Issued |
Array
(
[id] => 4564234
[patent_doc_number] => 07846760
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[patent_issue_date] => 2010-12-07
[patent_title] => 'Doped plug for CCD gaps'
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[firstpage_image] =>[orig_patent_app_number] => 11807911
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/807911 | Doped plug for CCD gaps | May 29, 2007 | Issued |
Array
(
[id] => 170592
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[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-02-16
[patent_title] => 'Method of forming dual damascene pattern'
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[pdf_file] => patents/07/662/07662711.pdf
[firstpage_image] =>[orig_patent_app_number] => 11752625
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/752625 | Method of forming dual damascene pattern | May 22, 2007 | Issued |
Array
(
[id] => 81585
[patent_doc_number] => 07745325
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[patent_kind] => B2
[patent_issue_date] => 2010-06-29
[patent_title] => 'Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memory device'
[patent_app_type] => utility
[patent_app_number] => 11/798715
[patent_app_country] => US
[patent_app_date] => 2007-05-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[pdf_file] => patents/07/745/07745325.pdf
[firstpage_image] =>[orig_patent_app_number] => 11798715
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/798715 | Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memory device | May 15, 2007 | Issued |
Array
(
[id] => 4764835
[patent_doc_number] => 20080176046
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-24
[patent_title] => 'MICROSTRUCTURE, MICROMACHINE, AND MANUFACTURING METHOD OF MICROSTRUCTURE AND MICROMACHINE'
[patent_app_type] => utility
[patent_app_number] => 11/748183
[patent_app_country] => US
[patent_app_date] => 2007-05-14
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[patent_drawing_sheets_cnt] => 39
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[firstpage_image] =>[orig_patent_app_number] => 11748183
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/748183 | Microstructure, micromachine, and manufacturing method of microstructure and micromachine | May 13, 2007 | Issued |
Array
(
[id] => 5536867
[patent_doc_number] => 20090218672
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-03
[patent_title] => 'SOLDER RESIST MATERIAL, WIRING BOARD USING THE SOLDER RESIST MATERIAL, AND SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/298706
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[pdf_file] => publications/A1/0218/20090218672.pdf
[firstpage_image] =>[orig_patent_app_number] => 12298706
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/298706 | Solder resist material, wiring board using the solder resist material, and semiconductor package | Apr 25, 2007 | Issued |
Array
(
[id] => 4883793
[patent_doc_number] => 20080258125
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-23
[patent_title] => 'Resistive memory cell fabrication methods and devices'
[patent_app_type] => utility
[patent_app_number] => 11/785391
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[patent_app_date] => 2007-04-17
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/785391 | Resistive memory cell fabrication methods and devices | Apr 16, 2007 | Issued |
Array
(
[id] => 9139137
[patent_doc_number] => 08579592
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-11-12
[patent_title] => 'Turbofan engine'
[patent_app_type] => utility
[patent_app_number] => 12/307535
[patent_app_country] => US
[patent_app_date] => 2007-04-06
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/307535 | Turbofan engine | Apr 5, 2007 | Issued |
Array
(
[id] => 204417
[patent_doc_number] => 07629184
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[patent_issue_date] => 2009-12-08
[patent_title] => 'RFID temperature sensing wafer, system and method'
[patent_app_type] => utility
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[pdf_file] => patents/07/629/07629184.pdf
[firstpage_image] =>[orig_patent_app_number] => 11688421
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/688421 | RFID temperature sensing wafer, system and method | Mar 19, 2007 | Issued |
Array
(
[id] => 4723918
[patent_doc_number] => 20080203459
[patent_country] => US
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[patent_issue_date] => 2008-08-28
[patent_title] => 'Method of manufacturing a semiconductor device and semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/711486 | Method of manufacturing a semiconductor device and semiconductor device | Feb 26, 2007 | Abandoned |
Array
(
[id] => 5574836
[patent_doc_number] => 20090142197
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[patent_issue_date] => 2009-06-04
[patent_title] => 'Wind Turbine Rotor Blade'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 12226073
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/226073 | Wind turbine rotor blade | Feb 25, 2007 | Issued |
Array
(
[id] => 6270854
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[patent_title] => 'Welded Repair of Defects Lying on the Inside of Components'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/526797 | Welded repair of defects lying on the inside of components | Feb 12, 2007 | Issued |
Array
(
[id] => 4810615
[patent_doc_number] => 20080191246
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[patent_issue_date] => 2008-08-14
[patent_title] => 'Method to Improve Writer Leakage in a SiGe Bipolar Device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/673645 | Method to improve writer leakage in a SiGe bipolar device | Feb 11, 2007 | Issued |
Array
(
[id] => 281762
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[patent_title] => 'Method for forming metal silicide layer'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/673145 | Method for forming metal silicide layer | Feb 8, 2007 | Issued |
Array
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Array
(
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Array
(
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[patent_title] => 'Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/619235 | Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same | Jan 2, 2007 | Issued |