Search

Ming Y. Hon

Examiner (ID: 12806, Phone: (571)270-5245 , Office: P/2675 )

Most Active Art Unit
2666
Art Unit(s)
2625, 2666, 2675
Total Applications
838
Issued Applications
670
Pending Applications
56
Abandoned Applications
135

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17188852 [patent_doc_number] => 20210335737 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-28 [patent_title] => MULTI-METAL CONTACT STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/370576 [patent_app_country] => US [patent_app_date] => 2021-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7644 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17370576 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/370576
Multi-metal contact structure Jul 7, 2021 Issued
Array ( [id] => 18562981 [patent_doc_number] => 11728234 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-15 [patent_title] => Electronic package comprising wire inside an electronic component and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/368475 [patent_app_country] => US [patent_app_date] => 2021-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 5742 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17368475 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/368475
Electronic package comprising wire inside an electronic component and manufacturing method thereof Jul 5, 2021 Issued
Array ( [id] => 17318878 [patent_doc_number] => 20210407928 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-30 [patent_title] => QUANTUM DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/357233 [patent_app_country] => US [patent_app_date] => 2021-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7551 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17357233 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/357233
Quantum device including shield part and method of manufacturing the same Jun 23, 2021 Issued
Array ( [id] => 17174167 [patent_doc_number] => 20210327838 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-21 [patent_title] => BONDED ASSEMBLY CONTAINING LOW DIELECTRIC CONSTANT BONDING DIELECTRIC AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/357120 [patent_app_country] => US [patent_app_date] => 2021-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20030 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17357120 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/357120
Bonded assembly containing low dielectric constant bonding dielectric material Jun 23, 2021 Issued
Array ( [id] => 18975296 [patent_doc_number] => 20240055388 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-15 [patent_title] => BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM [patent_app_type] => utility [patent_app_number] => 18/037760 [patent_app_country] => US [patent_app_date] => 2021-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7731 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 249 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18037760 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/037760
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM Jun 21, 2021 Pending
Array ( [id] => 17660958 [patent_doc_number] => 20220181423 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/351683 [patent_app_country] => US [patent_app_date] => 2021-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6833 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17351683 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/351683
Display device with alternating power and data lines Jun 17, 2021 Issued
Array ( [id] => 18205479 [patent_doc_number] => 11587884 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-21 [patent_title] => Patterned ground shield device including multiple pattered ground shield layers [patent_app_type] => utility [patent_app_number] => 17/351387 [patent_app_country] => US [patent_app_date] => 2021-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2863 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17351387 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/351387
Patterned ground shield device including multiple pattered ground shield layers Jun 17, 2021 Issued
Array ( [id] => 18068195 [patent_doc_number] => 20220399283 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-15 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/346068 [patent_app_country] => US [patent_app_date] => 2021-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6210 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17346068 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/346068
Manufacturing process steps of a semiconductor device package Jun 10, 2021 Issued
Array ( [id] => 18061760 [patent_doc_number] => 20220392847 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-08 [patent_title] => SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING OF SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/340089 [patent_app_country] => US [patent_app_date] => 2021-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7779 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17340089 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/340089
Semiconductor package, semiconductor device and shielding housing of semiconductor package Jun 6, 2021 Issued
Array ( [id] => 17886588 [patent_doc_number] => 20220302066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-22 [patent_title] => Integrated Circuit Package and Method [patent_app_type] => utility [patent_app_number] => 17/338872 [patent_app_country] => US [patent_app_date] => 2021-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11394 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17338872 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/338872
Methods of forming integrated circuit packages having adhesion layers over through vias Jun 3, 2021 Issued
Array ( [id] => 17115844 [patent_doc_number] => 20210296441 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-23 [patent_title] => METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/339171 [patent_app_country] => US [patent_app_date] => 2021-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8672 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17339171 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/339171
Method for manufacturing semiconductor device with spacer layer Jun 3, 2021 Issued
Array ( [id] => 18555252 [patent_doc_number] => 20230253269 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/005010 [patent_app_country] => US [patent_app_date] => 2021-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4652 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18005010 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/005010
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME May 25, 2021 Pending
Array ( [id] => 18040082 [patent_doc_number] => 20220384299 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHIELDING AND ANTENNA ELEMENTS [patent_app_type] => utility [patent_app_number] => 17/330336 [patent_app_country] => US [patent_app_date] => 2021-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5449 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17330336 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/330336
Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements May 24, 2021 Issued
Array ( [id] => 19168494 [patent_doc_number] => 11984407 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-14 [patent_title] => Package structure and communications device with suppressed ion migration in bonding material [patent_app_type] => utility [patent_app_number] => 17/329869 [patent_app_country] => US [patent_app_date] => 2021-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 21 [patent_no_of_words] => 7734 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17329869 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/329869
Package structure and communications device with suppressed ion migration in bonding material May 24, 2021 Issued
Array ( [id] => 18456348 [patent_doc_number] => 20230197630 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION [patent_app_type] => utility [patent_app_number] => 18/000130 [patent_app_country] => US [patent_app_date] => 2021-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12293 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18000130 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/000130
Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection May 20, 2021 Issued
Array ( [id] => 17070664 [patent_doc_number] => 20210272881 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-02 [patent_title] => EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS [patent_app_type] => utility [patent_app_number] => 17/323840 [patent_app_country] => US [patent_app_date] => 2021-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13122 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -20 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17323840 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/323840
Embedded bridge with through-silicon vias May 17, 2021 Issued
Array ( [id] => 17893267 [patent_doc_number] => 11456249 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-09-27 [patent_title] => Package structure, package-on-package structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/321525 [patent_app_country] => US [patent_app_date] => 2021-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 6479 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17321525 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/321525
Package structure, package-on-package structure and manufacturing method thereof May 16, 2021 Issued
Array ( [id] => 17070628 [patent_doc_number] => 20210272845 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-02 [patent_title] => METHODS OF FORMING MICROELECTRONIC DEVICES [patent_app_type] => utility [patent_app_number] => 17/320863 [patent_app_country] => US [patent_app_date] => 2021-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10622 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17320863 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/320863
Methods of forming microelectronic devices May 13, 2021 Issued
Array ( [id] => 17055794 [patent_doc_number] => 20210265228 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-26 [patent_title] => Integrated Circuit Package and Method [patent_app_type] => utility [patent_app_number] => 17/315735 [patent_app_country] => US [patent_app_date] => 2021-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8768 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17315735 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/315735
Integrated circuit package and method May 9, 2021 Issued
Array ( [id] => 17993383 [patent_doc_number] => 20220359420 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => Laser-Based Redistribution and Multi-Stacked Packages [patent_app_type] => utility [patent_app_number] => 17/314916 [patent_app_country] => US [patent_app_date] => 2021-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5274 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17314916 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/314916
Laser-based redistribution and multi-stacked packages May 6, 2021 Issued
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