Miranda Le

Array ( [id] => 17203702 [patent_doc_number] => 20210343797 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-04 [patent_title] => DISPLAY SCREEN, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 16/954662 [patent_app_country] => US [patent_app_date] => 2020-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3061 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16954662 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17583189 [patent_doc_number] => 20220140044 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 16/956547 [patent_app_country] => US [patent_app_date] => 2020-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3284 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16956547 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16774110 [patent_doc_number] => 10985233 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-04-20 [patent_title] => Display device [patent_app_type] => utility [patent_app_number] => 16/846170 [patent_app_country] => US [patent_app_date] => 2020-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 33 [patent_no_of_words] => 18161 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16846170 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18333203 [patent_doc_number] => 20230125151 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => Bonding Wire and Method for Manufacturing the Same [patent_app_type] => utility [patent_app_number] => 17/912392 [patent_app_country] => US [patent_app_date] => 2020-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2639 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17912392 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17529916 [patent_doc_number] => 11302615 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-04-12 [patent_title] => Semiconductor package with isolated heat spreader [patent_app_type] => utility [patent_app_number] => 16/840407 [patent_app_country] => US [patent_app_date] => 2020-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 15 [patent_no_of_words] => 8139 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16840407 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17590733 [patent_doc_number] => 11329010 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-05-10 [patent_title] => Integrated circuit shield [patent_app_type] => utility [patent_app_number] => 16/838577 [patent_app_country] => US [patent_app_date] => 2020-04-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5889 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16838577 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17326643 [patent_doc_number] => 11217669 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-01-04 [patent_title] => Semiconductor devices [patent_app_type] => utility [patent_app_number] => 16/837408 [patent_app_country] => US [patent_app_date] => 2020-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 26 [patent_no_of_words] => 10143 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16837408 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16631656 [patent_doc_number] => 20210050309 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-02-18 [patent_title] => SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/835884 [patent_app_country] => US [patent_app_date] => 2020-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8679 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16835884 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17130418 [patent_doc_number] => 20210305187 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-30 [patent_title] => PROCESS FOR REMOVING BOND FILM FROM CAVITIES IN PRINTED CIRCUIT BOARDS [patent_app_type] => utility [patent_app_number] => 16/836470 [patent_app_country] => US [patent_app_date] => 2020-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3989 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16836470 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17196066 [patent_doc_number] => 11164833 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-11-02 [patent_title] => Semiconductor device using wires and stacked semiconductor package [patent_app_type] => utility [patent_app_number] => 16/835980 [patent_app_country] => US [patent_app_date] => 2020-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6358 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16835980 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16179347 [patent_doc_number] => 20200226315 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-16 [patent_title] => MEMORY CELL LAYOUT FOR LOW CURRENT FIELD-INDUCED MRAM [patent_app_type] => utility [patent_app_number] => 16/834016 [patent_app_country] => US [patent_app_date] => 2020-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1627 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16834016 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17730778 [patent_doc_number] => 11387179 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-07-12 [patent_title] => IC package with half-bridge power module [patent_app_type] => utility [patent_app_number] => 16/827455 [patent_app_country] => US [patent_app_date] => 2020-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 7842 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16827455 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17115715 [patent_doc_number] => 20210296312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-23 [patent_title] => INTEGRATION OF MULTIPLE FIN STUCTURES ON A SINGLE SUBSTRATE [patent_app_type] => utility [patent_app_number] => 16/823581 [patent_app_country] => US [patent_app_date] => 2020-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 17730 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823581 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17683402 [patent_doc_number] => 11367667 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-06-21 [patent_title] => Build-up package for integrated circuit devices, and methods of making same [patent_app_type] => utility [patent_app_number] => 16/819486 [patent_app_country] => US [patent_app_date] => 2020-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 2547 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16819486 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18364724 [patent_doc_number] => 20230146315 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => AL BONDING WIRE [patent_app_type] => utility [patent_app_number] => 17/911090 [patent_app_country] => US [patent_app_date] => 2020-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6492 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17911090 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17652745 [patent_doc_number] => 11355485 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-06-07 [patent_title] => Semiconductor die and semiconductor package [patent_app_type] => utility [patent_app_number] => 16/818426 [patent_app_country] => US [patent_app_date] => 2020-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 26 [patent_no_of_words] => 7159 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16818426 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17085684 [patent_doc_number] => 20210280691 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-09 [patent_title] => Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells [patent_app_type] => utility [patent_app_number] => 16/807388 [patent_app_country] => US [patent_app_date] => 2020-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6921 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16807388 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17456063 [patent_doc_number] => 11270930 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-03-08 [patent_title] => Laminate stacked on die for high voltage isolation capacitor [patent_app_type] => utility [patent_app_number] => 16/806362 [patent_app_country] => US [patent_app_date] => 2020-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3716 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806362 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17456063 [patent_doc_number] => 11270930 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-03-08 [patent_title] => Laminate stacked on die for high voltage isolation capacitor [patent_app_type] => utility [patent_app_number] => 16/806362 [patent_app_country] => US [patent_app_date] => 2020-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3716 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806362 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17456063 [patent_doc_number] => 11270930 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-03-08 [patent_title] => Laminate stacked on die for high voltage isolation capacitor [patent_app_type] => utility [patent_app_number] => 16/806362 [patent_app_country] => US [patent_app_date] => 2020-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3716 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16806362 [rel_patent_id] =>[rel_patent_doc_number] =>)