Search

Mohammad M Ali

Examiner (ID: 9935, Phone: (571)272-4806 , Office: P/3744 )

Most Active Art Unit
3744
Art Unit(s)
3784, 3744
Total Applications
2900
Issued Applications
2328
Pending Applications
41
Abandoned Applications
531

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18858000 [patent_doc_number] => 11855598 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Variable gain amplifier including impedance ladder circuit with exponentially dependent degeneration resistance [patent_app_type] => utility [patent_app_number] => 17/895771 [patent_app_country] => US [patent_app_date] => 2022-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5622 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17895771 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/895771
Variable gain amplifier including impedance ladder circuit with exponentially dependent degeneration resistance Aug 24, 2022 Issued
Array ( [id] => 19244655 [patent_doc_number] => 12015110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-18 [patent_title] => Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor [patent_app_type] => utility [patent_app_number] => 17/892788 [patent_app_country] => US [patent_app_date] => 2022-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 21 [patent_no_of_words] => 3012 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17892788 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/892788
Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor Aug 21, 2022 Issued
Array ( [id] => 19244655 [patent_doc_number] => 12015110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-18 [patent_title] => Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor [patent_app_type] => utility [patent_app_number] => 17/892788 [patent_app_country] => US [patent_app_date] => 2022-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 21 [patent_no_of_words] => 3012 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17892788 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/892788
Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor Aug 21, 2022 Issued
Array ( [id] => 19244655 [patent_doc_number] => 12015110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-18 [patent_title] => Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor [patent_app_type] => utility [patent_app_number] => 17/892788 [patent_app_country] => US [patent_app_date] => 2022-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 21 [patent_no_of_words] => 3012 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17892788 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/892788
Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor Aug 21, 2022 Issued
Array ( [id] => 19244655 [patent_doc_number] => 12015110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-18 [patent_title] => Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor [patent_app_type] => utility [patent_app_number] => 17/892788 [patent_app_country] => US [patent_app_date] => 2022-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 21 [patent_no_of_words] => 3012 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17892788 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/892788
Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor Aug 21, 2022 Issued
Array ( [id] => 19277303 [patent_doc_number] => 12027435 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-02 [patent_title] => Packages including multiple encapsulated substrate blocks and overlapping redistribution structures [patent_app_type] => utility [patent_app_number] => 17/818742 [patent_app_country] => US [patent_app_date] => 2022-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 37 [patent_no_of_words] => 6628 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17818742 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/818742
Packages including multiple encapsulated substrate blocks and overlapping redistribution structures Aug 9, 2022 Issued
Array ( [id] => 18041034 [patent_doc_number] => 20220385251 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => WIRELESS RECEIVER [patent_app_type] => utility [patent_app_number] => 17/883580 [patent_app_country] => US [patent_app_date] => 2022-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4417 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17883580 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/883580
Wireless receiver Aug 7, 2022 Issued
Array ( [id] => 19582536 [patent_doc_number] => 12148664 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-11-19 [patent_title] => Semiconductor device and method having a through substrate via and an interconnect structure [patent_app_type] => utility [patent_app_number] => 17/874741 [patent_app_country] => US [patent_app_date] => 2022-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 57 [patent_figures_cnt] => 57 [patent_no_of_words] => 12450 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17874741 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/874741
Semiconductor device and method having a through substrate via and an interconnect structure Jul 26, 2022 Issued
Array ( [id] => 18008559 [patent_doc_number] => 20220367326 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => ELECTRONIC COMPONENT APPARATUS HAVING A FIRST LEAD FRAME AND A SECOND LEAD FRAME AND AN ELECTRONIC COMPONENT PROVIDED BETWEEN THE FIRST LEAD FRAME AND THE SECOND LEAD FRAME [patent_app_type] => utility [patent_app_number] => 17/874898 [patent_app_country] => US [patent_app_date] => 2022-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20511 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 238 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17874898 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/874898
Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame Jul 26, 2022 Issued
Array ( [id] => 19260958 [patent_doc_number] => 12021024 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-25 [patent_title] => Semiconductor device including a semiconductor die and a plurality of antenna patterns [patent_app_type] => utility [patent_app_number] => 17/870798 [patent_app_country] => US [patent_app_date] => 2022-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 6435 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17870798 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/870798
Semiconductor device including a semiconductor die and a plurality of antenna patterns Jul 20, 2022 Issued
Array ( [id] => 17993333 [patent_doc_number] => 20220359370 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => Redistribution Layer Layouts on Integrated Circuits and Methods for Manufacturing the Same [patent_app_type] => utility [patent_app_number] => 17/869196 [patent_app_country] => US [patent_app_date] => 2022-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13866 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17869196 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/869196
Redistribution Layer Layouts on Integrated Circuits and Methods for Manufacturing the Same Jul 19, 2022 Pending
Array ( [id] => 18759928 [patent_doc_number] => 11810968 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2023-11-07 [patent_title] => Method for induced quantum dots for material characterization, qubits, and quantum computers [patent_app_type] => utility [patent_app_number] => 17/864617 [patent_app_country] => US [patent_app_date] => 2022-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 8028 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17864617 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/864617
Method for induced quantum dots for material characterization, qubits, and quantum computers Jul 13, 2022 Issued
Array ( [id] => 19108702 [patent_doc_number] => 11961816 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-16 [patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar [patent_app_type] => utility [patent_app_number] => 17/860291 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 35 [patent_no_of_words] => 11157 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 261 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/860291
Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar Jul 7, 2022 Issued
Array ( [id] => 19108702 [patent_doc_number] => 11961816 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-16 [patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar [patent_app_type] => utility [patent_app_number] => 17/860291 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 35 [patent_no_of_words] => 11157 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 261 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/860291
Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar Jul 7, 2022 Issued
Array ( [id] => 19108702 [patent_doc_number] => 11961816 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-16 [patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar [patent_app_type] => utility [patent_app_number] => 17/860291 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 35 [patent_no_of_words] => 11157 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 261 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/860291
Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar Jul 7, 2022 Issued
Array ( [id] => 19108702 [patent_doc_number] => 11961816 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-16 [patent_title] => Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar [patent_app_type] => utility [patent_app_number] => 17/860291 [patent_app_country] => US [patent_app_date] => 2022-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 35 [patent_no_of_words] => 11157 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 261 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17860291 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/860291
Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer and a concave portion formed at one end surface of the copper pillar Jul 7, 2022 Issued
Array ( [id] => 17949385 [patent_doc_number] => 20220336404 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-20 [patent_title] => SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 17/857035 [patent_app_country] => US [patent_app_date] => 2022-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8024 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17857035 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/857035
Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer Jul 2, 2022 Issued
Array ( [id] => 19199043 [patent_doc_number] => 11996291 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-28 [patent_title] => Method for manufacturing semiconductor device including annealing a germanium layer to diffuse germanium atoms into a silicon substrate [patent_app_type] => utility [patent_app_number] => 17/850867 [patent_app_country] => US [patent_app_date] => 2022-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 46 [patent_figures_cnt] => 46 [patent_no_of_words] => 7825 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17850867 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/850867
Method for manufacturing semiconductor device including annealing a germanium layer to diffuse germanium atoms into a silicon substrate Jun 26, 2022 Issued
Array ( [id] => 17933188 [patent_doc_number] => 20220328314 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-13 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/850857 [patent_app_country] => US [patent_app_date] => 2022-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7956 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17850857 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/850857
Semiconductor device including a semiconductor fin comprising a silicon germanium portion and an isolation structure at a sidewall of the silicon germanium portion Jun 26, 2022 Issued
Array ( [id] => 17933247 [patent_doc_number] => 20220328373 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-13 [patent_title] => METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/850221 [patent_app_country] => US [patent_app_date] => 2022-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7139 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 229 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17850221 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/850221
Method of manufacturing semiconductor device including cutting a molding member and a redistribution wiring layer and a cutting region of a base substrate Jun 26, 2022 Issued
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