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Mohammed S Haque

Examiner (ID: 15293)

Most Active Art Unit
2186
Art Unit(s)
2186
Total Applications
6
Issued Applications
4
Pending Applications
0
Abandoned Applications
2

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17100126 [patent_doc_number] => 20210287917 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => CHIP MOLDING STRUCTURE, WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/331133 [patent_app_country] => US [patent_app_date] => 2021-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4601 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17331133 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/331133
CHIP MOLDING STRUCTURE, WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF May 25, 2021 Pending
Array ( [id] => 18207161 [patent_doc_number] => 20230053417 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-23 [patent_title] => FILM DEPOSITION METHODS IN FURNACE TUBE, AND SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/438831 [patent_app_country] => US [patent_app_date] => 2021-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4145 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17438831 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/438831
FILM DEPOSITION METHODS IN FURNACE TUBE, AND SEMICONDUCTOR DEVICES May 23, 2021 Pending
Array ( [id] => 17085703 [patent_doc_number] => 20210280710 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-09 [patent_title] => DEVICE OF DIELECTRIC LAYER [patent_app_type] => utility [patent_app_number] => 17/327737 [patent_app_country] => US [patent_app_date] => 2021-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8596 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17327737 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/327737
Device of dielectric layer May 22, 2021 Issued
Array ( [id] => 17070715 [patent_doc_number] => 20210272932 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-02 [patent_title] => SEMICONDUCTOR DEVICE HAVING LATERALLY OFFSET STACKED SEMICONDUCTOR DIES [patent_app_type] => utility [patent_app_number] => 17/320116 [patent_app_country] => US [patent_app_date] => 2021-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8469 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17320116 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/320116
Semiconductor device having laterally offset stacked semiconductor dies May 12, 2021 Issued
Array ( [id] => 18964068 [patent_doc_number] => 11897817 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Ceramic sintered body and substrate for semiconductor device [patent_app_type] => utility [patent_app_number] => 17/317986 [patent_app_country] => US [patent_app_date] => 2021-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 6954 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 251 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17317986 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/317986
Ceramic sintered body and substrate for semiconductor device May 11, 2021 Issued
Array ( [id] => 17204069 [patent_doc_number] => 20210344164 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-04 [patent_title] => MANUFACTURABLE MULTI-EMITTER LASER DIODE [patent_app_type] => utility [patent_app_number] => 17/318896 [patent_app_country] => US [patent_app_date] => 2021-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 36329 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17318896 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/318896
Manufacturable multi-emitter laser diode May 11, 2021 Issued
Array ( [id] => 17055897 [patent_doc_number] => 20210265331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-26 [patent_title] => DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRATED PHOTONICS [patent_app_type] => utility [patent_app_number] => 17/318344 [patent_app_country] => US [patent_app_date] => 2021-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6721 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17318344 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/318344
DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRATED PHOTONICS May 11, 2021 Pending
Array ( [id] => 17993242 [patent_doc_number] => 20220359279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES [patent_app_type] => utility [patent_app_number] => 17/316649 [patent_app_country] => US [patent_app_date] => 2021-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10197 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17316649 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/316649
METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES May 9, 2021 Pending
Array ( [id] => 18236033 [patent_doc_number] => 11600600 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-07 [patent_title] => Semiconductor package including stacked semiconductor chips [patent_app_type] => utility [patent_app_number] => 17/308710 [patent_app_country] => US [patent_app_date] => 2021-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 10580 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17308710 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/308710
Semiconductor package including stacked semiconductor chips May 4, 2021 Issued
Array ( [id] => 18608189 [patent_doc_number] => 11749667 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-05 [patent_title] => Semiconductor manufacturing apparatus [patent_app_type] => utility [patent_app_number] => 17/233937 [patent_app_country] => US [patent_app_date] => 2021-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 30 [patent_no_of_words] => 12033 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17233937 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/233937
Semiconductor manufacturing apparatus Apr 18, 2021 Issued
Array ( [id] => 17359932 [patent_doc_number] => 20220020728 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-20 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/216142 [patent_app_country] => US [patent_app_date] => 2021-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17216142 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/216142
Semiconductor package Mar 28, 2021 Issued
Array ( [id] => 19229700 [patent_doc_number] => 12009344 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => Semiconductor package including stacked semiconductor chips [patent_app_type] => utility [patent_app_number] => 17/200063 [patent_app_country] => US [patent_app_date] => 2021-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 16 [patent_no_of_words] => 16987 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17200063 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/200063
Semiconductor package including stacked semiconductor chips Mar 11, 2021 Issued
Array ( [id] => 16936594 [patent_doc_number] => 20210202483 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-01 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/200272 [patent_app_country] => US [patent_app_date] => 2021-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6840 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17200272 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/200272
Semiconductor device and method for forming the same Mar 11, 2021 Issued
Array ( [id] => 18343518 [patent_doc_number] => 11641002 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-02 [patent_title] => Optical transmission/reception circuit [patent_app_type] => utility [patent_app_number] => 17/199180 [patent_app_country] => US [patent_app_date] => 2021-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 17 [patent_no_of_words] => 4401 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17199180 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/199180
Optical transmission/reception circuit Mar 10, 2021 Issued
Array ( [id] => 17347146 [patent_doc_number] => 20220013477 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-13 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/189718 [patent_app_country] => US [patent_app_date] => 2021-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16035 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17189718 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/189718
Semiconductor device and manufacturing method thereof Mar 1, 2021 Issued
Array ( [id] => 16888952 [patent_doc_number] => 20210175149 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-10 [patent_title] => THERMALLY CONDUCTIVE ELECTRONIC PACKAGING [patent_app_type] => utility [patent_app_number] => 17/179030 [patent_app_country] => US [patent_app_date] => 2021-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5544 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17179030 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/179030
THERMALLY CONDUCTIVE ELECTRONIC PACKAGING Feb 17, 2021 Pending
Array ( [id] => 17485977 [patent_doc_number] => 20220093481 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-24 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE [patent_app_type] => utility [patent_app_number] => 17/177725 [patent_app_country] => US [patent_app_date] => 2021-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6394 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17177725 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/177725
Semiconductor package and method of manufacture Feb 16, 2021 Issued
Array ( [id] => 17692261 [patent_doc_number] => 20220199554 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-23 [patent_title] => MULTI-DIE MEMORY DEVICE WITH PEAK CURRENT REDUCTION [patent_app_type] => utility [patent_app_number] => 17/176787 [patent_app_country] => US [patent_app_date] => 2021-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10085 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17176787 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/176787
Multi-die memory device with peak current reduction Feb 15, 2021 Issued
Array ( [id] => 16858393 [patent_doc_number] => 20210159138 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-27 [patent_title] => THREE-DIMENSIONAL MEMORY DEVICES HAVING HYDROGEN BLOCKING LAYER AND FABRICATION METHODS THEREOF [patent_app_type] => utility [patent_app_number] => 17/168160 [patent_app_country] => US [patent_app_date] => 2021-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12519 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17168160 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/168160
Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof Feb 3, 2021 Issued
Array ( [id] => 18249162 [patent_doc_number] => 11605762 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-14 [patent_title] => Light emitting device including RGB light emitting diodes and phosphor [patent_app_type] => utility [patent_app_number] => 17/164753 [patent_app_country] => US [patent_app_date] => 2021-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 4666 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17164753 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/164753
Light emitting device including RGB light emitting diodes and phosphor Jan 31, 2021 Issued
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