Mong-thuy Thi Tran

Array ( [id] => 19007874 [patent_doc_number] => 20240071945 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/900814 [patent_app_country] => US [patent_app_date] => 2022-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9438 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17900814 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20389350 [patent_doc_number] => 12489085 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-02 [patent_title] => C2C yield and performance optimization in a die stacking platform [patent_app_type] => utility [patent_app_number] => 17/895353 [patent_app_country] => US [patent_app_date] => 2022-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4886 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17895353 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19007961 [patent_doc_number] => 20240072032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE AND A METALLIZATION PORTION [patent_app_type] => utility [patent_app_number] => 17/894043 [patent_app_country] => US [patent_app_date] => 2022-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24950 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -27 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17894043 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18540967 [patent_doc_number] => 20230246079 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/820996 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8441 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 250 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17820996 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18991102 [patent_doc_number] => 20240063071 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMPOSITE STRUCTURES [patent_app_type] => utility [patent_app_number] => 17/891880 [patent_app_country] => US [patent_app_date] => 2022-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10289 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17891880 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18585991 [patent_doc_number] => 20230268256 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/890279 [patent_app_country] => US [patent_app_date] => 2022-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7249 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17890279 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18040144 [patent_doc_number] => 20220384361 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => Semiconductor Device and Method of Compartment Shielding Using Bond Wires [patent_app_type] => utility [patent_app_number] => 17/819271 [patent_app_country] => US [patent_app_date] => 2022-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4882 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17819271 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19943704 [patent_doc_number] => 12315840 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-27 [patent_title] => Microelectronic assemblies [patent_app_type] => utility [patent_app_number] => 17/885048 [patent_app_country] => US [patent_app_date] => 2022-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 51 [patent_figures_cnt] => 57 [patent_no_of_words] => 20685 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17885048 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18040072 [patent_doc_number] => 20220384289 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/884515 [patent_app_country] => US [patent_app_date] => 2022-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6208 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 35 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17884515 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18039981 [patent_doc_number] => 20220384198 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/818135 [patent_app_country] => US [patent_app_date] => 2022-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5445 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17818135 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18617706 [patent_doc_number] => 20230284447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-07 [patent_title] => SEMICONDUCTOR MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 17/883410 [patent_app_country] => US [patent_app_date] => 2022-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20283 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17883410 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19705021 [patent_doc_number] => 12199068 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-14 [patent_title] => Methods of forming microelectronic device assemblies and packages [patent_app_type] => utility [patent_app_number] => 17/817690 [patent_app_country] => US [patent_app_date] => 2022-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 37 [patent_no_of_words] => 23341 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17817690 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18008497 [patent_doc_number] => 20220367264 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SELECTIVE TUNGSTEN DEPOSITION AT LOW TEMPERATURES [patent_app_type] => utility [patent_app_number] => 17/878599 [patent_app_country] => US [patent_app_date] => 2022-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5706 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17878599 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18008565 [patent_doc_number] => 20220367332 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/816264 [patent_app_country] => US [patent_app_date] => 2022-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6987 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17816264 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18008568 [patent_doc_number] => 20220367335 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/816376 [patent_app_country] => US [patent_app_date] => 2022-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17816376 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19314483 [patent_doc_number] => 12040309 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-16 [patent_title] => Bonding through multi-shot laser reflow [patent_app_type] => utility [patent_app_number] => 17/815713 [patent_app_country] => US [patent_app_date] => 2022-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7006 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17815713 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18008843 [patent_doc_number] => 20220367610 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => METAL INSULATOR METAL CAPACITOR STRUCTURE HAVING HIGH CAPACITANCE [patent_app_type] => utility [patent_app_number] => 17/875026 [patent_app_country] => US [patent_app_date] => 2022-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9131 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17875026 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19370447 [patent_doc_number] => 12062541 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-13 [patent_title] => Epitaxies of a chemical compound semiconductor [patent_app_type] => utility [patent_app_number] => 17/873274 [patent_app_country] => US [patent_app_date] => 2022-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2276 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873274 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18008624 [patent_doc_number] => 20220367391 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-17 [patent_title] => SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/873835 [patent_app_country] => US [patent_app_date] => 2022-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8707 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873835 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18967335 [patent_doc_number] => 11901115 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Substrate assembly with encapsulated magnetic feature [patent_app_type] => utility [patent_app_number] => 17/873509 [patent_app_country] => US [patent_app_date] => 2022-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 25 [patent_no_of_words] => 8287 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17873509 [rel_patent_id] =>[rel_patent_doc_number] =>)