Monica Lewis

Array ( [id] => 6934497 [patent_doc_number] => 20010055841 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-27 [patent_title] => 'Light emitting device and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 09/832867 [patent_app_country] => US [patent_app_date] => 2001-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 17256 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0055/20010055841.pdf [firstpage_image] =>[orig_patent_app_number] => 09832867 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1031464 [patent_doc_number] => 06879015 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-04-12 [patent_title] => 'Semiconductor device with isolated intermetal dielectrics' [patent_app_type] => utility [patent_app_number] => 09/829797 [patent_app_country] => US [patent_app_date] => 2001-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 1685 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/879/06879015.pdf [firstpage_image] =>[orig_patent_app_number] => 09829797 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1364897 [patent_doc_number] => 06573600 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-06-03 [patent_title] => 'Multilayer wiring substrate having differential signal wires and a general signal wire in different planes' [patent_app_type] => B2 [patent_app_number] => 09/817787 [patent_app_country] => US [patent_app_date] => 2001-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 8 [patent_no_of_words] => 6195 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/573/06573600.pdf [firstpage_image] =>[orig_patent_app_number] => 09817787 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5840318 [patent_doc_number] => 20020130371 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-19 [patent_title] => 'Printhead integrated circuit' [patent_app_type] => new [patent_app_number] => 09/813087 [patent_app_country] => US [patent_app_date] => 2001-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4753 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0130/20020130371.pdf [firstpage_image] =>[orig_patent_app_number] => 09813087 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7619816 [patent_doc_number] => 06943369 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-09-13 [patent_title] => 'Substrate for integrating and forming a thin film semiconductor device thereon' [patent_app_type] => utility [patent_app_number] => 09/808957 [patent_app_country] => US [patent_app_date] => 2001-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 3799 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/943/06943369.pdf [firstpage_image] =>[orig_patent_app_number] => 09808957 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6415377 [patent_doc_number] => 20020125550 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Dual stacked die package' [patent_app_type] => new [patent_app_number] => 09/805597 [patent_app_country] => US [patent_app_date] => 2001-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1451 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0125/20020125550.pdf [firstpage_image] =>[orig_patent_app_number] => 09805597 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6435202 [patent_doc_number] => 20020127846 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Copper to aluminum interlayer interconnect using stud and via liner' [patent_app_type] => new [patent_app_number] => 09/805027 [patent_app_country] => US [patent_app_date] => 2001-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2521 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20020127846.pdf [firstpage_image] =>[orig_patent_app_number] => 09805027 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6366270 [patent_doc_number] => 20020117740 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-29 [patent_title] => 'Lead frame for plastic molded type semiconductor package' [patent_app_type] => new [patent_app_number] => 09/794147 [patent_app_country] => US [patent_app_date] => 2001-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1993 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20020117740.pdf [firstpage_image] =>[orig_patent_app_number] => 09794147 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6075937 [patent_doc_number] => 20020079505 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-27 [patent_title] => 'Semiconductor light unit and method for production of the same' [patent_app_type] => new [patent_app_number] => 09/791757 [patent_app_country] => US [patent_app_date] => 2001-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1979 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20020079505.pdf [firstpage_image] =>[orig_patent_app_number] => 09791757 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6899622 [patent_doc_number] => 20010009298 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-07-26 [patent_title] => 'Chip scale surface mount packages for semiconductor device' [patent_app_type] => new [patent_app_number] => 09/792217 [patent_app_country] => US [patent_app_date] => 2001-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 4401 [patent_no_of_claims] => 70 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0009/20010009298.pdf [firstpage_image] =>[orig_patent_app_number] => 09792217 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5885897 [patent_doc_number] => 20020011678 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-31 [patent_title] => 'Method and system for providing a robust alignment mark at thin oxide layers' [patent_app_type] => new [patent_app_number] => 09/784907 [patent_app_country] => US [patent_app_date] => 2001-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3126 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0011/20020011678.pdf [firstpage_image] =>[orig_patent_app_number] => 09784907 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5982015 [patent_doc_number] => 20020096742 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-07-25 [patent_title] => 'ESD robust silicon germanium transistor with emitter NP-block mask extrinsic base ballasting resistor with doped facet region' [patent_app_type] => new [patent_app_number] => 09/769667 [patent_app_country] => US [patent_app_date] => 2001-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3149 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20020096742.pdf [firstpage_image] =>[orig_patent_app_number] => 09769667 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6208528 [patent_doc_number] => 20020071935 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-13 [patent_title] => 'Passive element solder pad free of solder ball' [patent_app_type] => new [patent_app_number] => 09/757597 [patent_app_country] => US [patent_app_date] => 2001-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2415 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0071/20020071935.pdf [firstpage_image] =>[orig_patent_app_number] => 09757597 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 746719 [patent_doc_number] => 07026710 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-11 [patent_title] => 'Molded package for micromechanical devices and method of fabrication' [patent_app_type] => utility [patent_app_number] => 09/760517 [patent_app_country] => US [patent_app_date] => 2001-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 20 [patent_no_of_words] => 6423 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/026/07026710.pdf [firstpage_image] =>[orig_patent_app_number] => 09760517 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5964636 [patent_doc_number] => 20020089064 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-07-11 [patent_title] => 'Flexible lead surface-mount semiconductor package' [patent_app_type] => new [patent_app_number] => 09/756007 [patent_app_country] => US [patent_app_date] => 2001-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 1182 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 46 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20020089064.pdf [firstpage_image] =>[orig_patent_app_number] => 09756007 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 503186 [patent_doc_number] => 07205626 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2007-04-17 [patent_title] => 'Light-emitting or light-receiving with plurality of particle-shaped semiconductor devices having light-emitting or light-receiving properties' [patent_app_type] => utility [patent_app_number] => 10/169017 [patent_app_country] => US [patent_app_date] => 2000-10-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 34 [patent_no_of_words] => 8047 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/205/07205626.pdf [firstpage_image] =>[orig_patent_app_number] => 10169017 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1300316 [patent_doc_number] => 06627996 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-30 [patent_title] => 'Semiconductor device having fluorine containing silicon oxide layer as dielectric for wiring pattern having anti-reflective layer and insulating layer thereon' [patent_app_type] => B1 [patent_app_number] => 09/680437 [patent_app_country] => US [patent_app_date] => 2000-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 5309 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/627/06627996.pdf [firstpage_image] =>[orig_patent_app_number] => 09680437 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 717053 [patent_doc_number] => 07053419 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2006-05-30 [patent_title] => 'Light emitting diodes with improved light extraction efficiency' [patent_app_type] => utility [patent_app_number] => 09/660317 [patent_app_country] => US [patent_app_date] => 2000-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 6674 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/053/07053419.pdf [firstpage_image] =>[orig_patent_app_number] => 09660317 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1002728 [patent_doc_number] => 06909185 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-06-21 [patent_title] => 'Composite material including copper and cuprous oxide and application thereof' [patent_app_type] => utility [patent_app_number] => 09/485227 [patent_app_country] => US [patent_app_date] => 1998-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 26 [patent_no_of_words] => 9581 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/909/06909185.pdf [firstpage_image] =>[orig_patent_app_number] => 09485227 [rel_patent_id] =>[rel_patent_doc_number] =>)