
Monica Lewis
Supervisory Patent Examiner (ID: 4134, Phone: (571)272-1838 , Office: P/2838 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2838, 2306, 2787, 2894, 2786, 2822 |
| Total Applications | 498 |
| Issued Applications | 294 |
| Pending Applications | 29 |
| Abandoned Applications | 178 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 300233
[patent_doc_number] => 07538437
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-05-26
[patent_title] => 'Infrared receiver chip'
[patent_app_type] => utility
[patent_app_number] => 11/070167
[patent_app_country] => US
[patent_app_date] => 2005-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 2783
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/538/07538437.pdf
[firstpage_image] =>[orig_patent_app_number] => 11070167
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/070167 | Infrared receiver chip | Mar 2, 2005 | Issued |
Array
(
[id] => 338389
[patent_doc_number] => 07504734
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-17
[patent_title] => 'Semiconductor device having improved solder joint and internal lead lifetimes'
[patent_app_type] => utility
[patent_app_number] => 11/063877
[patent_app_country] => US
[patent_app_date] => 2005-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 26
[patent_no_of_words] => 6201
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/504/07504734.pdf
[firstpage_image] =>[orig_patent_app_number] => 11063877
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/063877 | Semiconductor device having improved solder joint and internal lead lifetimes | Feb 23, 2005 | Issued |
Array
(
[id] => 5680934
[patent_doc_number] => 20060197201
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-07
[patent_title] => 'Image sensor structure'
[patent_app_type] => utility
[patent_app_number] => 11/066527
[patent_app_country] => US
[patent_app_date] => 2005-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1164
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0197/20060197201.pdf
[firstpage_image] =>[orig_patent_app_number] => 11066527
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/066527 | Image sensor structure | Feb 22, 2005 | Abandoned |
Array
(
[id] => 397889
[patent_doc_number] => 07294858
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-11-13
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/052257
[patent_app_country] => US
[patent_app_date] => 2005-02-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 19
[patent_no_of_words] => 7596
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/294/07294858.pdf
[firstpage_image] =>[orig_patent_app_number] => 11052257
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/052257 | Semiconductor device and method of manufacturing the same | Feb 7, 2005 | Issued |
Array
(
[id] => 849541
[patent_doc_number] => 07382060
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-06-03
[patent_title] => 'Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts'
[patent_app_type] => utility
[patent_app_number] => 11/052279
[patent_app_country] => US
[patent_app_date] => 2005-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 29
[patent_figures_cnt] => 133
[patent_no_of_words] => 21742
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/382/07382060.pdf
[firstpage_image] =>[orig_patent_app_number] => 11052279
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/052279 | Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts | Feb 6, 2005 | Issued |
Array
(
[id] => 7136851
[patent_doc_number] => 20050181540
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-18
[patent_title] => 'Semiconductor component and system having thinned, encapsulated dice'
[patent_app_type] => utility
[patent_app_number] => 11/052378
[patent_app_country] => US
[patent_app_date] => 2005-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 30
[patent_figures_cnt] => 30
[patent_no_of_words] => 21567
[patent_no_of_claims] => 45
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0181/20050181540.pdf
[firstpage_image] =>[orig_patent_app_number] => 11052378
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/052378 | Wafer level semiconductor component having thinned, encapsulated dice and polymer dam | Feb 6, 2005 | Issued |
Array
(
[id] => 904427
[patent_doc_number] => 07335987
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-02-26
[patent_title] => 'Semiconductor package and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/049867
[patent_app_country] => US
[patent_app_date] => 2005-02-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 3229
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 156
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/335/07335987.pdf
[firstpage_image] =>[orig_patent_app_number] => 11049867
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/049867 | Semiconductor package and method for manufacturing the same | Feb 3, 2005 | Issued |
Array
(
[id] => 5664746
[patent_doc_number] => 20060170096
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-03
[patent_title] => 'Chip scale package and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/047617
[patent_app_country] => US
[patent_app_date] => 2005-02-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 2464
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 5
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0170/20060170096.pdf
[firstpage_image] =>[orig_patent_app_number] => 11047617
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/047617 | Chip scale package and method for manufacturing the same | Feb 1, 2005 | Abandoned |
Array
(
[id] => 911269
[patent_doc_number] => 07329899
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-02-12
[patent_title] => 'Wafer-level redistribution circuit'
[patent_app_type] => utility
[patent_app_number] => 11/048227
[patent_app_country] => US
[patent_app_date] => 2005-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 4830
[patent_no_of_claims] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/329/07329899.pdf
[firstpage_image] =>[orig_patent_app_number] => 11048227
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/048227 | Wafer-level redistribution circuit | Jan 31, 2005 | Issued |
Array
(
[id] => 7197299
[patent_doc_number] => 20050164489
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-07-28
[patent_title] => 'Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material'
[patent_app_type] => utility
[patent_app_number] => 11/045447
[patent_app_country] => US
[patent_app_date] => 2005-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 2311
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0164/20050164489.pdf
[firstpage_image] =>[orig_patent_app_number] => 11045447
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/045447 | Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material | Jan 26, 2005 | Abandoned |
Array
(
[id] => 6994007
[patent_doc_number] => 20050133783
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-23
[patent_title] => 'Light emitting device and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/041576
[patent_app_country] => US
[patent_app_date] => 2005-01-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[pdf_file] => publications/A1/0133/20050133783.pdf
[firstpage_image] =>[orig_patent_app_number] => 11041576
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/041576 | Light emitting device having stripe form electrodes and auxiliary electrodes | Jan 24, 2005 | Issued |
Array
(
[id] => 7016481
[patent_doc_number] => 20050218498
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-10-06
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/041437
[patent_app_country] => US
[patent_app_date] => 2005-01-25
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[pdf_file] => publications/A1/0218/20050218498.pdf
[firstpage_image] =>[orig_patent_app_number] => 11041437
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/041437 | Semiconductor device | Jan 24, 2005 | Abandoned |
Array
(
[id] => 5228267
[patent_doc_number] => 20070290374
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-20
[patent_title] => 'Component with Encapsulation Suitable for Wlp and Production Method'
[patent_app_type] => utility
[patent_app_number] => 10/591027
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[pdf_file] => publications/A1/0290/20070290374.pdf
[firstpage_image] =>[orig_patent_app_number] => 10591027
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/591027 | Component with Encapsulation Suitable for Wlp and Production Method | Jan 13, 2005 | Abandoned |
Array
(
[id] => 461209
[patent_doc_number] => 07242053
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-07-10
[patent_title] => 'EEPROM device with voltage-limiting charge pump circuit'
[patent_app_type] => utility
[patent_app_number] => 11/036738
[patent_app_country] => US
[patent_app_date] => 2005-01-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => patents/07/242/07242053.pdf
[firstpage_image] =>[orig_patent_app_number] => 11036738
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/036738 | EEPROM device with voltage-limiting charge pump circuit | Jan 13, 2005 | Issued |
Array
(
[id] => 915404
[patent_doc_number] => 07327020
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-02-05
[patent_title] => 'Multi-chip package including at least one semiconductor device enclosed therein'
[patent_app_type] => utility
[patent_app_number] => 11/033997
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/327/07327020.pdf
[firstpage_image] =>[orig_patent_app_number] => 11033997
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/033997 | Multi-chip package including at least one semiconductor device enclosed therein | Jan 12, 2005 | Issued |
Array
(
[id] => 837299
[patent_doc_number] => 07394116
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-01
[patent_title] => 'Semiconductor device including a multi-channel fin field effect transistor including protruding active portions and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/033526
[patent_app_country] => US
[patent_app_date] => 2005-01-12
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/394/07394116.pdf
[firstpage_image] =>[orig_patent_app_number] => 11033526
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/033526 | Semiconductor device including a multi-channel fin field effect transistor including protruding active portions and method of fabricating the same | Jan 11, 2005 | Issued |
Array
(
[id] => 5869097
[patent_doc_number] => 20060163714
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-27
[patent_title] => 'Package structure and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/030097
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[pdf_file] => publications/A1/0163/20060163714.pdf
[firstpage_image] =>[orig_patent_app_number] => 11030097
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/030097 | Package structure and fabrication method thereof | Jan 6, 2005 | Issued |
Array
(
[id] => 5628868
[patent_doc_number] => 20060145336
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-06
[patent_title] => 'Heat sink'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11025947
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/025947 | Heat sink | Jan 2, 2005 | Abandoned |
Array
(
[id] => 447774
[patent_doc_number] => 07253529
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[patent_issue_date] => 2007-08-07
[patent_title] => 'Multi-chip package structure'
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[patent_app_number] => 11/026797
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[pdf_file] => patents/07/253/07253529.pdf
[firstpage_image] =>[orig_patent_app_number] => 11026797
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/026797 | Multi-chip package structure | Dec 30, 2004 | Issued |
Array
(
[id] => 5652732
[patent_doc_number] => 20060138467
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-29
[patent_title] => 'Method of forming a small contact in phase-change memory and a memory cell produced by the method'
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[patent_app_number] => 11/026317
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0138/20060138467.pdf
[firstpage_image] =>[orig_patent_app_number] => 11026317
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/026317 | Method of forming a small contact in phase-change memory and a memory cell produced by the method | Dec 28, 2004 | Abandoned |