
Monique R. Jackson
Examiner (ID: 9204, Phone: (571)272-1508 , Office: P/1787 )
| Most Active Art Unit | |
| Art Unit(s) | |
| Total Applications | |
| Issued Applications | |
| Pending Applications | |
| Abandoned Applications |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
| 18/135091 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | Apr 13, 2023 | Pending |
| 18/131828 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | Apr 5, 2023 | Pending |
| 18/125556 | Three dimensional semiconductor memory including pillars having joint portions between columnar sections | Mar 22, 2023 | Issued |
| 18/119527 | Semiconductor device including gate pattern having pad region | Mar 8, 2023 | Issued |
| 90/015206 | METHOD FOR OPERATING AN ADSORPTION DEVICE AND A CONTROL UNIT | Mar 2, 2023 | Issued |
| 90/015205 | STRUCTURE FOR INCREASING DRIVE CURRENT IN A MEMORY ARRAY AND RELATED METHOD | Mar 2, 2023 | Issued |
| 18/115484 | Vertical-type non-volatile memory devices having dummy channel holes | Feb 27, 2023 | Issued |
| 18/100693 | SOLID STATE IMAGING DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPARATUS | Jan 30, 2023 | Issued |
| 90/015190 | FABRICATION LAYOUT DEVICE AND METHOD | Jan 10, 2023 | Issued |
| 18/077349 | FIELD EFFECT TRANSISTOR HAVING FIN BASE AND AT LEAST ONE FIN PROTRUDING FROM FIN BASE | Dec 7, 2022 | Abandoned |
| 90/015156 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURE | Nov 6, 2022 | Issued |
| 90/015155 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURE | Nov 6, 2022 | Issued |
| 17/954718 | Semiconductor module and portable apparatus provided with semiconductor module | Sep 27, 2022 | Issued |
| 17/895893 | RADIATION-TOLERANT UNIT MOSFET HARDENED AGAINST SINGLE EVENT EFFECT AND TOTAL IONIZING DOSE EFFECT | Aug 24, 2022 | Pending |
| 17/895885 | Radiation-tolerant unit MOSFET hardened against single event effect and total ionization dose effect | Aug 24, 2022 | Issued |
| 17/892183 | Three-dimensional semiconductor device | Aug 21, 2022 | Issued |
| 90/015059 | SEMICONDUCTOR HETEROSTRUCTURE WITH IMPROVED LIGHT EMISSION | Jun 16, 2022 | Issued |
| 17/730974 | Semiconductor package having spacer layer | Apr 26, 2022 | Issued |
| 17/718228 | FLEXIBLE LED ASSEMBLIES AND LED LIGHT BULBS | Apr 10, 2022 | Pending |
| 17/710394 | Structure and process to tuck fin tips self-aligned to gates | Mar 30, 2022 | Issued |