Search

Neil R. Prasad

Examiner (ID: 15244)

Most Active Art Unit
2897
Art Unit(s)
2897, 4134, 2822
Total Applications
774
Issued Applications
633
Pending Applications
54
Abandoned Applications
109

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19229644 [patent_doc_number] => 12009288 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => Interconnection structure and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 17/230511 [patent_app_country] => US [patent_app_date] => 2021-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 9541 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17230511 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/230511
Interconnection structure and semiconductor package including the same Apr 13, 2021 Issued
Array ( [id] => 18704759 [patent_doc_number] => 11791276 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-17 [patent_title] => Package comprising passive component between substrates for improved power distribution network (PDN) performance [patent_app_type] => utility [patent_app_number] => 17/225949 [patent_app_country] => US [patent_app_date] => 2021-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 10330 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17225949 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/225949
Package comprising passive component between substrates for improved power distribution network (PDN) performance Apr 7, 2021 Issued
Array ( [id] => 16966182 [patent_doc_number] => 20210217681 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-15 [patent_title] => Packaging structure of a SiC MOSFET power module and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 17/219788 [patent_app_country] => US [patent_app_date] => 2021-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3010 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -1 [patent_words_short_claim] => 291 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17219788 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/219788
Packaging structure of a SiC MOSFET power module and manufacturing method thereof Mar 30, 2021 Issued
Array ( [id] => 17373739 [patent_doc_number] => 20220028791 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-27 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/208798 [patent_app_country] => US [patent_app_date] => 2021-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10144 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17208798 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/208798
Semiconductor package Mar 21, 2021 Issued
Array ( [id] => 19016372 [patent_doc_number] => 11923314 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-05 [patent_title] => Semiconductor package including a trench in a passivation layer [patent_app_type] => utility [patent_app_number] => 17/203312 [patent_app_country] => US [patent_app_date] => 2021-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 9942 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 161 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17203312 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/203312
Semiconductor package including a trench in a passivation layer Mar 15, 2021 Issued
Array ( [id] => 16920526 [patent_doc_number] => 20210193618 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-24 [patent_title] => Redistribution Layers in Semiconductor Packages and Methods of Forming Same [patent_app_type] => utility [patent_app_number] => 17/195903 [patent_app_country] => US [patent_app_date] => 2021-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10415 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17195903 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/195903
Redistribution layers in semiconductor packages and methods of forming same Mar 8, 2021 Issued
Array ( [id] => 17347134 [patent_doc_number] => 20220013465 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-13 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/195823 [patent_app_country] => US [patent_app_date] => 2021-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8699 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17195823 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/195823
Semiconductor package Mar 8, 2021 Issued
Array ( [id] => 17389407 [patent_doc_number] => 20220037259 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-03 [patent_title] => FAN-OUT SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/194438 [patent_app_country] => US [patent_app_date] => 2021-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10382 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17194438 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/194438
Fan-out semiconductor package Mar 7, 2021 Issued
Array ( [id] => 17855274 [patent_doc_number] => 20220285317 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-08 [patent_title] => PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/192903 [patent_app_country] => US [patent_app_date] => 2021-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11279 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17192903 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/192903
Package structure and method of forming the same Mar 4, 2021 Issued
Array ( [id] => 17971393 [patent_doc_number] => 11488942 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-11-01 [patent_title] => Package structure [patent_app_type] => utility [patent_app_number] => 17/179969 [patent_app_country] => US [patent_app_date] => 2021-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 7140 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17179969 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/179969
Package structure Feb 18, 2021 Issued
Array ( [id] => 18857394 [patent_doc_number] => 11854989 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Semiconductor package substrate and semiconductor package including the same [patent_app_type] => utility [patent_app_number] => 17/167789 [patent_app_country] => US [patent_app_date] => 2021-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 12119 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17167789 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/167789
Semiconductor package substrate and semiconductor package including the same Feb 3, 2021 Issued
Array ( [id] => 17010973 [patent_doc_number] => 20210242134 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-05 [patent_title] => COMPONENT-EMBEDDED SUBSTRATE [patent_app_type] => utility [patent_app_number] => 17/165040 [patent_app_country] => US [patent_app_date] => 2021-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14436 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17165040 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/165040
Component-embedded substrate Feb 1, 2021 Issued
Array ( [id] => 19277335 [patent_doc_number] => 12027467 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-02 [patent_title] => Semiconductor device package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/163213 [patent_app_country] => US [patent_app_date] => 2021-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 17 [patent_no_of_words] => 5592 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17163213 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/163213
Semiconductor device package and method of manufacturing the same Jan 28, 2021 Issued
Array ( [id] => 17373790 [patent_doc_number] => 20220028842 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-27 [patent_title] => HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME [patent_app_type] => utility [patent_app_number] => 17/157520 [patent_app_country] => US [patent_app_date] => 2021-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12711 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17157520 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/157520
Heat dissipation in semiconductor packages and methods of forming same Jan 24, 2021 Issued
Array ( [id] => 17752775 [patent_doc_number] => 20220230980 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-21 [patent_title] => PACKAGE [patent_app_type] => utility [patent_app_number] => 17/155044 [patent_app_country] => US [patent_app_date] => 2021-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10140 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17155044 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/155044
Package Jan 20, 2021 Issued
Array ( [id] => 18579073 [patent_doc_number] => 11735613 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-22 [patent_title] => Photoelectric conversion apparatus and equipment [patent_app_type] => utility [patent_app_number] => 17/153261 [patent_app_country] => US [patent_app_date] => 2021-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 18 [patent_no_of_words] => 9458 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17153261 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/153261
Photoelectric conversion apparatus and equipment Jan 19, 2021 Issued
Array ( [id] => 17347133 [patent_doc_number] => 20220013464 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-13 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/150232 [patent_app_country] => US [patent_app_date] => 2021-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7976 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17150232 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/150232
Semiconductor package including interposer and method of manufacturing the semiconductor package Jan 14, 2021 Issued
Array ( [id] => 18563027 [patent_doc_number] => 11728280 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-15 [patent_title] => Semiconductor devices and methods of manufacturing semiconductor devices [patent_app_type] => utility [patent_app_number] => 17/150537 [patent_app_country] => US [patent_app_date] => 2021-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 20 [patent_no_of_words] => 7363 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17150537 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/150537
Semiconductor devices and methods of manufacturing semiconductor devices Jan 14, 2021 Issued
Array ( [id] => 16858457 [patent_doc_number] => 20210159202 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-05-27 [patent_title] => ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS [patent_app_type] => utility [patent_app_number] => 17/145071 [patent_app_country] => US [patent_app_date] => 2021-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10163 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17145071 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/145071
Electronic substrate and electronic apparatus Jan 7, 2021 Issued
Array ( [id] => 18137276 [patent_doc_number] => 11562965 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-01-24 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 17/134602 [patent_app_country] => US [patent_app_date] => 2020-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 27 [patent_no_of_words] => 7218 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17134602 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/134602
Semiconductor package Dec 27, 2020 Issued
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