
Nema O. Berezny
Examiner (ID: 9201)
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813 |
| Total Applications | 286 |
| Issued Applications | 250 |
| Pending Applications | 5 |
| Abandoned Applications | 31 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4312095
[patent_doc_number] => 06242286
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-05
[patent_title] => 'Multilayer high density micro circuit module and method of manufacturing same'
[patent_app_type] => 1
[patent_app_number] => 9/275055
[patent_app_country] => US
[patent_app_date] => 1999-03-23
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[pdf_file] => patents/06/242/06242286.pdf
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Array
(
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[patent_doc_number] => 06440836
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-27
[patent_title] => 'Method for forming solder bumps on flip chips and devices formed'
[patent_app_type] => B1
[patent_app_number] => 09/268785
[patent_app_country] => US
[patent_app_date] => 1999-03-16
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Array
(
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[patent_doc_number] => 06043108
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[patent_issue_date] => 2000-03-28
[patent_title] => 'Lead frame with lead-securing tape bonded to the inner lead sections of plural leads and a method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 9/270185
[patent_app_country] => US
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[pdf_file] => patents/06/043/06043108.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/270185 | Lead frame with lead-securing tape bonded to the inner lead sections of plural leads and a method of manufacturing the same | Mar 14, 1999 | Issued |
Array
(
[id] => 4188766
[patent_doc_number] => 06153506
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-11-28
[patent_title] => 'Integrated circuit having reduced probability of wire-bond failure'
[patent_app_type] => 1
[patent_app_number] => 9/263075
[patent_app_country] => US
[patent_app_date] => 1999-03-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/263075 | Integrated circuit having reduced probability of wire-bond failure | Mar 7, 1999 | Issued |
Array
(
[id] => 4357259
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[patent_issue_date] => 2001-01-16
[patent_title] => 'Partial semiconductor wafer processing with multiple cuts of random sizes'
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[patent_app_number] => 9/262265
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[patent_app_date] => 1999-03-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/262265 | Partial semiconductor wafer processing with multiple cuts of random sizes | Mar 3, 1999 | Issued |
Array
(
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[patent_issue_date] => 2000-12-05
[patent_title] => 'Partial semiconductor wafer processing using wafermap display'
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Array
(
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[patent_issue_date] => 2003-09-30
[patent_title] => 'Method for mounting an electronic component'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/260795 | Method for mounting an electronic component | Feb 28, 1999 | Issued |
Array
(
[id] => 4155990
[patent_doc_number] => 06156626
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[patent_kind] => NA
[patent_issue_date] => 2000-12-05
[patent_title] => 'Electromigration bonding process and system'
[patent_app_type] => 1
[patent_app_number] => 9/259744
[patent_app_country] => US
[patent_app_date] => 1999-02-27
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[pdf_file] => patents/06/156/06156626.pdf
[firstpage_image] =>[orig_patent_app_number] => 259744
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/259744 | Electromigration bonding process and system | Feb 26, 1999 | Issued |
Array
(
[id] => 6898580
[patent_doc_number] => 20010046745
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-11-29
[patent_title] => 'BITLINE DIFFUSION WITH HALO FOR IMPROVED ARRAY THRESHOLD VOLTAGE CONTROL'
[patent_app_type] => new
[patent_app_number] => 09/257817
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[firstpage_image] =>[orig_patent_app_number] => 09257817
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/257817 | Bitline diffusion with halo for improved array threshold voltage control | Feb 24, 1999 | Issued |
Array
(
[id] => 1545362
[patent_doc_number] => 06444563
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Method and apparatus for extending fatigue life of solder joints in a semiconductor device'
[patent_app_type] => B1
[patent_app_number] => 09/253876
[patent_app_country] => US
[patent_app_date] => 1999-02-22
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/253876 | Method and apparatus for extending fatigue life of solder joints in a semiconductor device | Feb 21, 1999 | Issued |
Array
(
[id] => 4357274
[patent_doc_number] => 06174789
[patent_country] => US
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[patent_issue_date] => 2001-01-16
[patent_title] => 'Method of dividing a compound semiconductor wafer into pellets by utilizing extremely narrow scribe regions'
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Array
(
[id] => 4155647
[patent_doc_number] => 06114240
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[patent_title] => 'Method for fabricating semiconductor components using focused laser beam'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/250289 | Method for fabricating semiconductor components using focused laser beam | Feb 11, 1999 | Issued |
Array
(
[id] => 4141417
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[patent_title] => 'Self-aligned connector for stacked chip module'
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Array
(
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Array
(
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Array
(
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[patent_title] => 'Method of fabricating a flip chip mold injected package'
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Array
(
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/180896 | Method of making semiconductor device, and film carrier tape | Jan 14, 1999 | Issued |