Search

Nema O. Berezny

Examiner (ID: 9201)

Most Active Art Unit
2813
Art Unit(s)
2813
Total Applications
286
Issued Applications
250
Pending Applications
5
Abandoned Applications
31

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6758874 [patent_doc_number] => 20030122235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-03 [patent_title] => 'Seal ring structure for radio frequency integrated circuits' [patent_app_type] => new [patent_app_number] => 10/370345 [patent_app_country] => US [patent_app_date] => 2003-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1653 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0122/20030122235.pdf [firstpage_image] =>[orig_patent_app_number] => 10370345 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/370345
Seal ring structure for radio frequency integrated circuits Feb 18, 2003 Issued
Array ( [id] => 6727637 [patent_doc_number] => 20030183827 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-02 [patent_title] => 'Nitride semiconductor, method for manufacturing the same and nitride semiconductor device' [patent_app_type] => new [patent_app_number] => 10/352256 [patent_app_country] => US [patent_app_date] => 2003-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 11604 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20030183827.pdf [firstpage_image] =>[orig_patent_app_number] => 10352256 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/352256
Nitride semiconductor, method for manufacturing the same and nitride semiconductor device Jan 27, 2003 Issued
Array ( [id] => 6696877 [patent_doc_number] => 20030109071 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-12 [patent_title] => 'Method of determining heat treatment conditions' [patent_app_type] => new [patent_app_number] => 10/333585 [patent_app_country] => US [patent_app_date] => 2003-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 23446 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0109/20030109071.pdf [firstpage_image] =>[orig_patent_app_number] => 10333585 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/333585
Determining method of thermal processing condition Jan 23, 2003 Issued
Array ( [id] => 1151655 [patent_doc_number] => 06767753 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-07-27 [patent_title] => 'Image sensor of a quad flat package' [patent_app_type] => B2 [patent_app_number] => 10/341086 [patent_app_country] => US [patent_app_date] => 2003-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 3734 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 316 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/767/06767753.pdf [firstpage_image] =>[orig_patent_app_number] => 10341086 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/341086
Image sensor of a quad flat package Jan 12, 2003 Issued
Array ( [id] => 7427701 [patent_doc_number] => 20040007772 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-15 [patent_title] => 'Power semiconductor device' [patent_app_type] => new [patent_app_number] => 10/339289 [patent_app_country] => US [patent_app_date] => 2003-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3637 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20040007772.pdf [firstpage_image] =>[orig_patent_app_number] => 10339289 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/339289
Power semiconductor device Jan 9, 2003 Issued
Array ( [id] => 7328989 [patent_doc_number] => 20040130007 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-08 [patent_title] => 'Flat lead package for a semiconductor device' [patent_app_type] => new [patent_app_number] => 10/336739 [patent_app_country] => US [patent_app_date] => 2003-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1494 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0130/20040130007.pdf [firstpage_image] =>[orig_patent_app_number] => 10336739 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/336739
Flat lead package for a semiconductor device Jan 5, 2003 Abandoned
Array ( [id] => 6627659 [patent_doc_number] => 20030102530 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-05 [patent_title] => 'Semiconductor wafer, method of manufacturing the same and semiconductor device' [patent_app_type] => new [patent_app_number] => 10/336808 [patent_app_country] => US [patent_app_date] => 2003-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 6749 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20030102530.pdf [firstpage_image] =>[orig_patent_app_number] => 10336808 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/336808
Semiconductor wafer, method of manufacturing the same and semiconductor device Jan 5, 2003 Abandoned
Array ( [id] => 630773 [patent_doc_number] => 07132734 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-11-07 [patent_title] => 'Microelectronic component assemblies and microelectronic component lead frame structures' [patent_app_type] => utility [patent_app_number] => 10/337438 [patent_app_country] => US [patent_app_date] => 2003-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 6129 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/132/07132734.pdf [firstpage_image] =>[orig_patent_app_number] => 10337438 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/337438
Microelectronic component assemblies and microelectronic component lead frame structures Jan 5, 2003 Issued
Array ( [id] => 6656007 [patent_doc_number] => 20030132506 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'CMOS semiconductor device and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/336604 [patent_app_country] => US [patent_app_date] => 2003-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6078 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20030132506.pdf [firstpage_image] =>[orig_patent_app_number] => 10336604 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/336604
CMOS semiconductor device and method of manufacturing the same Jan 2, 2003 Issued
Array ( [id] => 7160806 [patent_doc_number] => 20040075458 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-04-22 [patent_title] => 'Apparatus and method for enhanced voltage contrast analysis' [patent_app_type] => new [patent_app_number] => 10/327398 [patent_app_country] => US [patent_app_date] => 2002-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4003 [patent_no_of_claims] => 49 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0075/20040075458.pdf [firstpage_image] =>[orig_patent_app_number] => 10327398 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/327398
Apparatus and method for enhanced voltage contrast analysis Dec 18, 2002 Issued
Array ( [id] => 1190041 [patent_doc_number] => 06734569 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-11 [patent_title] => 'Die attachment with reduced adhesive bleed-out' [patent_app_type] => B2 [patent_app_number] => 10/316267 [patent_app_country] => US [patent_app_date] => 2002-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 4870 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 238 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/734/06734569.pdf [firstpage_image] =>[orig_patent_app_number] => 10316267 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/316267
Die attachment with reduced adhesive bleed-out Dec 11, 2002 Issued
Array ( [id] => 7356862 [patent_doc_number] => 20040004216 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-08 [patent_title] => 'Test assembly including a test die for testing a semiconductor product die' [patent_app_type] => new [patent_app_number] => 10/317486 [patent_app_country] => US [patent_app_date] => 2002-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 29 [patent_no_of_words] => 16841 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0004/20040004216.pdf [firstpage_image] =>[orig_patent_app_number] => 10317486 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/317486
Test assembly including a test die for testing a semiconductor product die Dec 10, 2002 Issued
Array ( [id] => 7286515 [patent_doc_number] => 20040108583 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-10 [patent_title] => 'Thin scale outline package stack' [patent_app_type] => new [patent_app_number] => 10/310368 [patent_app_country] => US [patent_app_date] => 2002-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2924 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20040108583.pdf [firstpage_image] =>[orig_patent_app_number] => 10310368 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/310368
Thin scale outline package stack Dec 4, 2002 Abandoned
Array ( [id] => 6870160 [patent_doc_number] => 20030082849 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-01 [patent_title] => 'Adhesion enhanced semiconductor die for mold compound packaging' [patent_app_type] => new [patent_app_number] => 10/309643 [patent_app_country] => US [patent_app_date] => 2002-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1928 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0082/20030082849.pdf [firstpage_image] =>[orig_patent_app_number] => 10309643 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/309643
Adhesion enhanced semiconductor die for mold compound packaging Dec 2, 2002 Issued
Array ( [id] => 6655887 [patent_doc_number] => 20030132477 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Substrate for electronic device, method for manufacturing substrate for electronic device, and electronic device' [patent_app_type] => new [patent_app_number] => 10/303955 [patent_app_country] => US [patent_app_date] => 2002-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 10663 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20030132477.pdf [firstpage_image] =>[orig_patent_app_number] => 10303955 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/303955
Substrate for electronic device, method for manufacturing substrate for electronic device, and electronic device Nov 25, 2002 Issued
Array ( [id] => 7352782 [patent_doc_number] => 20040048419 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-03-11 [patent_title] => 'Production method for semiconductor chip' [patent_app_type] => new [patent_app_number] => 10/250916 [patent_app_country] => US [patent_app_date] => 2003-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4284 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0048/20040048419.pdf [firstpage_image] =>[orig_patent_app_number] => 10250916 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/250916
Production method for semiconductor chip Nov 14, 2002 Issued
Array ( [id] => 6816126 [patent_doc_number] => 20030067084 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-04-10 [patent_title] => 'Semiconductor device and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 10/293441 [patent_app_country] => US [patent_app_date] => 2002-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 10421 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0067/20030067084.pdf [firstpage_image] =>[orig_patent_app_number] => 10293441 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/293441
Method of making semiconductor device with flip chip mounting Nov 13, 2002 Issued
Array ( [id] => 1066336 [patent_doc_number] => 06847114 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-01-25 [patent_title] => 'Micro-scale interconnect device with internal heat spreader and method for fabricating same' [patent_app_type] => utility [patent_app_number] => 10/291146 [patent_app_country] => US [patent_app_date] => 2002-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4933 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/847/06847114.pdf [firstpage_image] =>[orig_patent_app_number] => 10291146 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/291146
Micro-scale interconnect device with internal heat spreader and method for fabricating same Nov 7, 2002 Issued
Array ( [id] => 1053763 [patent_doc_number] => 06858910 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-22 [patent_title] => 'Method of fabricating a molded package for micromechanical devices' [patent_app_type] => utility [patent_app_number] => 10/271815 [patent_app_country] => US [patent_app_date] => 2002-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 16 [patent_no_of_words] => 7543 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/858/06858910.pdf [firstpage_image] =>[orig_patent_app_number] => 10271815 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/271815
Method of fabricating a molded package for micromechanical devices Oct 15, 2002 Issued
Array ( [id] => 6683415 [patent_doc_number] => 20030119279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-26 [patent_title] => 'Three dimensional device integration method and integrated device' [patent_app_type] => new [patent_app_number] => 10/270318 [patent_app_country] => US [patent_app_date] => 2002-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 11780 [patent_no_of_claims] => 88 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0119/20030119279.pdf [firstpage_image] =>[orig_patent_app_number] => 10270318 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/270318
Three dimensional device integration method and integrated device Oct 14, 2002 Issued
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