
Nema O. Berezny
Examiner (ID: 9201)
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813 |
| Total Applications | 286 |
| Issued Applications | 250 |
| Pending Applications | 5 |
| Abandoned Applications | 31 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6758874
[patent_doc_number] => 20030122235
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-03
[patent_title] => 'Seal ring structure for radio frequency integrated circuits'
[patent_app_type] => new
[patent_app_number] => 10/370345
[patent_app_country] => US
[patent_app_date] => 2003-02-19
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[pdf_file] => publications/A1/0122/20030122235.pdf
[firstpage_image] =>[orig_patent_app_number] => 10370345
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/370345 | Seal ring structure for radio frequency integrated circuits | Feb 18, 2003 | Issued |
Array
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[patent_doc_number] => 20030183827
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-10-02
[patent_title] => 'Nitride semiconductor, method for manufacturing the same and nitride semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/352256
[patent_app_country] => US
[patent_app_date] => 2003-01-28
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[firstpage_image] =>[orig_patent_app_number] => 10352256
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/352256 | Nitride semiconductor, method for manufacturing the same and nitride semiconductor device | Jan 27, 2003 | Issued |
Array
(
[id] => 6696877
[patent_doc_number] => 20030109071
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[patent_kind] => A1
[patent_issue_date] => 2003-06-12
[patent_title] => 'Method of determining heat treatment conditions'
[patent_app_type] => new
[patent_app_number] => 10/333585
[patent_app_country] => US
[patent_app_date] => 2003-01-24
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[patent_drawing_sheets_cnt] => 26
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[firstpage_image] =>[orig_patent_app_number] => 10333585
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/333585 | Determining method of thermal processing condition | Jan 23, 2003 | Issued |
Array
(
[id] => 1151655
[patent_doc_number] => 06767753
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-07-27
[patent_title] => 'Image sensor of a quad flat package'
[patent_app_type] => B2
[patent_app_number] => 10/341086
[patent_app_country] => US
[patent_app_date] => 2003-01-13
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[firstpage_image] =>[orig_patent_app_number] => 10341086
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/341086 | Image sensor of a quad flat package | Jan 12, 2003 | Issued |
Array
(
[id] => 7427701
[patent_doc_number] => 20040007772
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-15
[patent_title] => 'Power semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/339289
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[patent_app_date] => 2003-01-10
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[pdf_file] => publications/A1/0007/20040007772.pdf
[firstpage_image] =>[orig_patent_app_number] => 10339289
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/339289 | Power semiconductor device | Jan 9, 2003 | Issued |
Array
(
[id] => 7328989
[patent_doc_number] => 20040130007
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-08
[patent_title] => 'Flat lead package for a semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/336739
[patent_app_country] => US
[patent_app_date] => 2003-01-06
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[pdf_file] => publications/A1/0130/20040130007.pdf
[firstpage_image] =>[orig_patent_app_number] => 10336739
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/336739 | Flat lead package for a semiconductor device | Jan 5, 2003 | Abandoned |
Array
(
[id] => 6627659
[patent_doc_number] => 20030102530
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-05
[patent_title] => 'Semiconductor wafer, method of manufacturing the same and semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/336808
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[patent_app_date] => 2003-01-06
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[pdf_file] => publications/A1/0102/20030102530.pdf
[firstpage_image] =>[orig_patent_app_number] => 10336808
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/336808 | Semiconductor wafer, method of manufacturing the same and semiconductor device | Jan 5, 2003 | Abandoned |
Array
(
[id] => 630773
[patent_doc_number] => 07132734
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-11-07
[patent_title] => 'Microelectronic component assemblies and microelectronic component lead frame structures'
[patent_app_type] => utility
[patent_app_number] => 10/337438
[patent_app_country] => US
[patent_app_date] => 2003-01-06
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/132/07132734.pdf
[firstpage_image] =>[orig_patent_app_number] => 10337438
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/337438 | Microelectronic component assemblies and microelectronic component lead frame structures | Jan 5, 2003 | Issued |
Array
(
[id] => 6656007
[patent_doc_number] => 20030132506
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-17
[patent_title] => 'CMOS semiconductor device and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/336604
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[patent_app_date] => 2003-01-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/336604 | CMOS semiconductor device and method of manufacturing the same | Jan 2, 2003 | Issued |
Array
(
[id] => 7160806
[patent_doc_number] => 20040075458
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-22
[patent_title] => 'Apparatus and method for enhanced voltage contrast analysis'
[patent_app_type] => new
[patent_app_number] => 10/327398
[patent_app_country] => US
[patent_app_date] => 2002-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => publications/A1/0075/20040075458.pdf
[firstpage_image] =>[orig_patent_app_number] => 10327398
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/327398 | Apparatus and method for enhanced voltage contrast analysis | Dec 18, 2002 | Issued |
Array
(
[id] => 1190041
[patent_doc_number] => 06734569
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-05-11
[patent_title] => 'Die attachment with reduced adhesive bleed-out'
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[patent_app_number] => 10/316267
[patent_app_country] => US
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[pdf_file] => patents/06/734/06734569.pdf
[firstpage_image] =>[orig_patent_app_number] => 10316267
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/316267 | Die attachment with reduced adhesive bleed-out | Dec 11, 2002 | Issued |
Array
(
[id] => 7356862
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[patent_title] => 'Test assembly including a test die for testing a semiconductor product die'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/317486 | Test assembly including a test die for testing a semiconductor product die | Dec 10, 2002 | Issued |
Array
(
[id] => 7286515
[patent_doc_number] => 20040108583
[patent_country] => US
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[patent_title] => 'Thin scale outline package stack'
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[firstpage_image] =>[orig_patent_app_number] => 10310368
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/310368 | Thin scale outline package stack | Dec 4, 2002 | Abandoned |
Array
(
[id] => 6870160
[patent_doc_number] => 20030082849
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[patent_kind] => A1
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[patent_title] => 'Adhesion enhanced semiconductor die for mold compound packaging'
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[firstpage_image] =>[orig_patent_app_number] => 10309643
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/309643 | Adhesion enhanced semiconductor die for mold compound packaging | Dec 2, 2002 | Issued |
Array
(
[id] => 6655887
[patent_doc_number] => 20030132477
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[patent_title] => 'Substrate for electronic device, method for manufacturing substrate for electronic device, and electronic device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/303955 | Substrate for electronic device, method for manufacturing substrate for electronic device, and electronic device | Nov 25, 2002 | Issued |
Array
(
[id] => 7352782
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/293441 | Method of making semiconductor device with flip chip mounting | Nov 13, 2002 | Issued |
Array
(
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Array
(
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Array
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