Search

Nema O. Berezny

Examiner (ID: 9201)

Most Active Art Unit
2813
Art Unit(s)
2813
Total Applications
286
Issued Applications
250
Pending Applications
5
Abandoned Applications
31

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1168376 [patent_doc_number] => 06753208 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-06-22 [patent_title] => 'Wafer scale method of packaging integrated circuit die' [patent_app_type] => B1 [patent_app_number] => 10/224197 [patent_app_country] => US [patent_app_date] => 2002-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 19 [patent_no_of_words] => 3710 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 232 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/753/06753208.pdf [firstpage_image] =>[orig_patent_app_number] => 10224197 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/224197
Wafer scale method of packaging integrated circuit die Aug 18, 2002 Issued
Array ( [id] => 6720954 [patent_doc_number] => 20030054643 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-20 [patent_title] => 'Wafer machining adhesive tape, and its manufacturing method and using method' [patent_app_type] => new [patent_app_number] => 10/181726 [patent_app_country] => US [patent_app_date] => 2002-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 17259 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 11 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20030054643.pdf [firstpage_image] =>[orig_patent_app_number] => 10181726 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/181726
Wafer machining adhesive tape, and its manufacturing method and using method Jul 21, 2002 Abandoned
Array ( [id] => 7625540 [patent_doc_number] => 06723629 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-04-20 [patent_title] => 'Method and apparatus for attaching solder members to a substrate' [patent_app_type] => B2 [patent_app_number] => 10/191473 [patent_app_country] => US [patent_app_date] => 2002-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 24 [patent_no_of_words] => 7038 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 14 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/723/06723629.pdf [firstpage_image] =>[orig_patent_app_number] => 10191473 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/191473
Method and apparatus for attaching solder members to a substrate Jul 9, 2002 Issued
Array ( [id] => 6111435 [patent_doc_number] => 20020173136 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-21 [patent_title] => 'Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 10/191142 [patent_app_country] => US [patent_app_date] => 2002-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7039 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20020173136.pdf [firstpage_image] =>[orig_patent_app_number] => 10191142 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/191142
Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof Jul 8, 2002 Abandoned
Array ( [id] => 6111429 [patent_doc_number] => 20020173135 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-21 [patent_title] => 'Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 10/191141 [patent_app_country] => US [patent_app_date] => 2002-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7034 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20020173135.pdf [firstpage_image] =>[orig_patent_app_number] => 10191141 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/191141
Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof Jul 8, 2002 Abandoned
Array ( [id] => 6447381 [patent_doc_number] => 20020177295 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-28 [patent_title] => 'Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 10/191124 [patent_app_country] => US [patent_app_date] => 2002-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7037 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0177/20020177295.pdf [firstpage_image] =>[orig_patent_app_number] => 10191124 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/191124
Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof Jul 8, 2002 Abandoned
Array ( [id] => 1047431 [patent_doc_number] => 06864585 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-03-08 [patent_title] => 'Three dimensional device integration method and integrated device' [patent_app_type] => utility [patent_app_number] => 10/189014 [patent_app_country] => US [patent_app_date] => 2002-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 52 [patent_no_of_words] => 11678 [patent_no_of_claims] => 99 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/864/06864585.pdf [firstpage_image] =>[orig_patent_app_number] => 10189014 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/189014
Three dimensional device integration method and integrated device Jul 4, 2002 Issued
Array ( [id] => 1387330 [patent_doc_number] => 06555918 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-04-29 [patent_title] => 'Stacked semiconductor device including improved lead frame arrangement' [patent_app_type] => B2 [patent_app_number] => 10/103775 [patent_app_country] => US [patent_app_date] => 2002-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 29 [patent_no_of_words] => 17150 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 696 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/555/06555918.pdf [firstpage_image] =>[orig_patent_app_number] => 10103775 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/103775
Stacked semiconductor device including improved lead frame arrangement Mar 24, 2002 Issued
Array ( [id] => 6415339 [patent_doc_number] => 20020125547 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Chip-type composite electronic component and manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 10/090806 [patent_app_country] => US [patent_app_date] => 2002-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4074 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0125/20020125547.pdf [firstpage_image] =>[orig_patent_app_number] => 10090806 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/090806
Chip-type composite electronic component and manufacturing method thereof Mar 5, 2002 Issued
Array ( [id] => 6081011 [patent_doc_number] => 20020081770 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-27 [patent_title] => 'Package for accommodating electronic parts, semiconductor device and method for manufacturing package' [patent_app_type] => new [patent_app_number] => 10/086875 [patent_app_country] => US [patent_app_date] => 2002-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3125 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0081/20020081770.pdf [firstpage_image] =>[orig_patent_app_number] => 10086875 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/086875
Package for accommodating electronic parts, semiconductor device and method for manufacturing package Mar 3, 2002 Abandoned
Array ( [id] => 6081187 [patent_doc_number] => 20020081830 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-27 [patent_title] => 'Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device' [patent_app_type] => new [patent_app_number] => 10/086210 [patent_app_country] => US [patent_app_date] => 2002-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5043 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0081/20020081830.pdf [firstpage_image] =>[orig_patent_app_number] => 10086210 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/086210
Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device Feb 26, 2002 Issued
Array ( [id] => 6081009 [patent_doc_number] => 20020081769 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-06-27 [patent_title] => 'Method of fabricating semiconductor device' [patent_app_type] => new [patent_app_number] => 10/080659 [patent_app_country] => US [patent_app_date] => 2002-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3408 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0081/20020081769.pdf [firstpage_image] =>[orig_patent_app_number] => 10080659 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/080659
Method of fabricating semiconductor device Feb 24, 2002 Abandoned
Array ( [id] => 5986231 [patent_doc_number] => 20020098623 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-07-25 [patent_title] => 'Semiconductor device including leads in communication with contact pads thereof and a stereolithographically fabricated package substantially encapsulating the leads and methods for fabricating the same' [patent_app_type] => new [patent_app_number] => 10/080336 [patent_app_country] => US [patent_app_date] => 2002-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 9708 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20020098623.pdf [firstpage_image] =>[orig_patent_app_number] => 10080336 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/080336
SEMICONDUCTOR DEVICE INCLUDING LEADS IN COMMUNICATION WITH CONTACT PADS THEREOF AND A STEREOLITHOGRAPHICALLY FABRICATED PACKAGE SUBSTANTIALLY ENCAPSULATING THE LEADS AND METHODS FOR FABRICATING THE SAME Feb 20, 2002 Issued
Array ( [id] => 1096107 [patent_doc_number] => 06821888 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-23 [patent_title] => 'Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding' [patent_app_type] => B2 [patent_app_number] => 10/076244 [patent_app_country] => US [patent_app_date] => 2002-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1956 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/821/06821888.pdf [firstpage_image] =>[orig_patent_app_number] => 10076244 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/076244
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding Feb 12, 2002 Issued
Array ( [id] => 6740413 [patent_doc_number] => 20030157782 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-21 [patent_title] => 'Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same' [patent_app_type] => new [patent_app_number] => 10/066645 [patent_app_country] => US [patent_app_date] => 2002-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3333 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20030157782.pdf [firstpage_image] =>[orig_patent_app_number] => 10066645 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/066645
Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same Feb 5, 2002 Issued
Array ( [id] => 6269832 [patent_doc_number] => 20020105095 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-08 [patent_title] => 'Semiconductor package having a substrate including a die-attach aperture and method for packaging a semiconductor die' [patent_app_type] => new [patent_app_number] => 10/068585 [patent_app_country] => US [patent_app_date] => 2002-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2408 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0105/20020105095.pdf [firstpage_image] =>[orig_patent_app_number] => 10068585 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/068585
Semiconductor package having a substrate including a die-attach aperture and method for packaging a semiconductor die Feb 4, 2002 Abandoned
Array ( [id] => 1167902 [patent_doc_number] => 06759723 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-07-06 [patent_title] => 'Light emitting semiconductor package' [patent_app_type] => B2 [patent_app_number] => 10/040473 [patent_app_country] => US [patent_app_date] => 2002-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 31 [patent_no_of_words] => 5223 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/759/06759723.pdf [firstpage_image] =>[orig_patent_app_number] => 10040473 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/040473
Light emitting semiconductor package Jan 8, 2002 Issued
Array ( [id] => 6854218 [patent_doc_number] => 20030127719 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-10 [patent_title] => 'Structure and process for packaging multi-chip' [patent_app_type] => new [patent_app_number] => 10/036525 [patent_app_country] => US [patent_app_date] => 2002-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3030 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20030127719.pdf [firstpage_image] =>[orig_patent_app_number] => 10036525 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/036525
Structure and process for packaging multi-chip Jan 6, 2002 Abandoned
Array ( [id] => 7612878 [patent_doc_number] => 06902956 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-06-07 [patent_title] => 'Method and structure for manufacturing improved yield semiconductor packaged devices' [patent_app_type] => utility [patent_app_number] => 10/041322 [patent_app_country] => US [patent_app_date] => 2002-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3210 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/902/06902956.pdf [firstpage_image] =>[orig_patent_app_number] => 10041322 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/041322
Method and structure for manufacturing improved yield semiconductor packaged devices Jan 6, 2002 Issued
Array ( [id] => 5964630 [patent_doc_number] => 20020089058 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-07-11 [patent_title] => 'Electronic component with flexible bonding pads and method of producing such a component' [patent_app_type] => new [patent_app_number] => 10/022226 [patent_app_country] => US [patent_app_date] => 2001-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4762 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20020089058.pdf [firstpage_image] =>[orig_patent_app_number] => 10022226 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/022226
Electronic component with flexible bonding pads and method of producing such a component Dec 16, 2001 Issued
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