
Nema O. Berezny
Examiner (ID: 9201)
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813 |
| Total Applications | 286 |
| Issued Applications | 250 |
| Pending Applications | 5 |
| Abandoned Applications | 31 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1168376
[patent_doc_number] => 06753208
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-06-22
[patent_title] => 'Wafer scale method of packaging integrated circuit die'
[patent_app_type] => B1
[patent_app_number] => 10/224197
[patent_app_country] => US
[patent_app_date] => 2002-08-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 19
[patent_no_of_words] => 3710
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 232
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/753/06753208.pdf
[firstpage_image] =>[orig_patent_app_number] => 10224197
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/224197 | Wafer scale method of packaging integrated circuit die | Aug 18, 2002 | Issued |
Array
(
[id] => 6720954
[patent_doc_number] => 20030054643
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-20
[patent_title] => 'Wafer machining adhesive tape, and its manufacturing method and using method'
[patent_app_type] => new
[patent_app_number] => 10/181726
[patent_app_country] => US
[patent_app_date] => 2002-07-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 17259
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 11
[patent_words_short_claim] => 27
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0054/20030054643.pdf
[firstpage_image] =>[orig_patent_app_number] => 10181726
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/181726 | Wafer machining adhesive tape, and its manufacturing method and using method | Jul 21, 2002 | Abandoned |
Array
(
[id] => 7625540
[patent_doc_number] => 06723629
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-04-20
[patent_title] => 'Method and apparatus for attaching solder members to a substrate'
[patent_app_type] => B2
[patent_app_number] => 10/191473
[patent_app_country] => US
[patent_app_date] => 2002-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 24
[patent_no_of_words] => 7038
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 14
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/723/06723629.pdf
[firstpage_image] =>[orig_patent_app_number] => 10191473
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/191473 | Method and apparatus for attaching solder members to a substrate | Jul 9, 2002 | Issued |
Array
(
[id] => 6111435
[patent_doc_number] => 20020173136
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-11-21
[patent_title] => 'Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 10/191142
[patent_app_country] => US
[patent_app_date] => 2002-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 23
[patent_no_of_words] => 7039
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 34
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0173/20020173136.pdf
[firstpage_image] =>[orig_patent_app_number] => 10191142
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/191142 | Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof | Jul 8, 2002 | Abandoned |
Array
(
[id] => 6111429
[patent_doc_number] => 20020173135
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-11-21
[patent_title] => 'Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 10/191141
[patent_app_country] => US
[patent_app_date] => 2002-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 23
[patent_no_of_words] => 7034
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 34
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0173/20020173135.pdf
[firstpage_image] =>[orig_patent_app_number] => 10191141
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/191141 | Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof | Jul 8, 2002 | Abandoned |
Array
(
[id] => 6447381
[patent_doc_number] => 20020177295
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-11-28
[patent_title] => 'Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 10/191124
[patent_app_country] => US
[patent_app_date] => 2002-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 23
[patent_no_of_words] => 7037
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 34
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0177/20020177295.pdf
[firstpage_image] =>[orig_patent_app_number] => 10191124
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/191124 | Bump transfer plate, manufacturing method thereof, semiconductor device, and manufacturing method thereof | Jul 8, 2002 | Abandoned |
Array
(
[id] => 1047431
[patent_doc_number] => 06864585
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-03-08
[patent_title] => 'Three dimensional device integration method and integrated device'
[patent_app_type] => utility
[patent_app_number] => 10/189014
[patent_app_country] => US
[patent_app_date] => 2002-07-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 52
[patent_no_of_words] => 11678
[patent_no_of_claims] => 99
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/864/06864585.pdf
[firstpage_image] =>[orig_patent_app_number] => 10189014
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/189014 | Three dimensional device integration method and integrated device | Jul 4, 2002 | Issued |
Array
(
[id] => 1387330
[patent_doc_number] => 06555918
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-29
[patent_title] => 'Stacked semiconductor device including improved lead frame arrangement'
[patent_app_type] => B2
[patent_app_number] => 10/103775
[patent_app_country] => US
[patent_app_date] => 2002-03-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 29
[patent_no_of_words] => 17150
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 696
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/555/06555918.pdf
[firstpage_image] =>[orig_patent_app_number] => 10103775
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/103775 | Stacked semiconductor device including improved lead frame arrangement | Mar 24, 2002 | Issued |
Array
(
[id] => 6415339
[patent_doc_number] => 20020125547
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-12
[patent_title] => 'Chip-type composite electronic component and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 10/090806
[patent_app_country] => US
[patent_app_date] => 2002-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4074
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 90
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0125/20020125547.pdf
[firstpage_image] =>[orig_patent_app_number] => 10090806
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/090806 | Chip-type composite electronic component and manufacturing method thereof | Mar 5, 2002 | Issued |
Array
(
[id] => 6081011
[patent_doc_number] => 20020081770
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-27
[patent_title] => 'Package for accommodating electronic parts, semiconductor device and method for manufacturing package'
[patent_app_type] => new
[patent_app_number] => 10/086875
[patent_app_country] => US
[patent_app_date] => 2002-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3125
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 64
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0081/20020081770.pdf
[firstpage_image] =>[orig_patent_app_number] => 10086875
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/086875 | Package for accommodating electronic parts, semiconductor device and method for manufacturing package | Mar 3, 2002 | Abandoned |
Array
(
[id] => 6081187
[patent_doc_number] => 20020081830
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-27
[patent_title] => 'Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/086210
[patent_app_country] => US
[patent_app_date] => 2002-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5043
[patent_no_of_claims] => 21
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0081/20020081830.pdf
[firstpage_image] =>[orig_patent_app_number] => 10086210
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/086210 | Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device | Feb 26, 2002 | Issued |
Array
(
[id] => 6081009
[patent_doc_number] => 20020081769
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-27
[patent_title] => 'Method of fabricating semiconductor device'
[patent_app_type] => new
[patent_app_number] => 10/080659
[patent_app_country] => US
[patent_app_date] => 2002-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0081/20020081769.pdf
[firstpage_image] =>[orig_patent_app_number] => 10080659
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/080659 | Method of fabricating semiconductor device | Feb 24, 2002 | Abandoned |
Array
(
[id] => 5986231
[patent_doc_number] => 20020098623
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-25
[patent_title] => 'Semiconductor device including leads in communication with contact pads thereof and a stereolithographically fabricated package substantially encapsulating the leads and methods for fabricating the same'
[patent_app_type] => new
[patent_app_number] => 10/080336
[patent_app_country] => US
[patent_app_date] => 2002-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 9708
[patent_no_of_claims] => 42
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 70
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0098/20020098623.pdf
[firstpage_image] =>[orig_patent_app_number] => 10080336
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/080336 | SEMICONDUCTOR DEVICE INCLUDING LEADS IN COMMUNICATION WITH CONTACT PADS THEREOF AND A STEREOLITHOGRAPHICALLY FABRICATED PACKAGE SUBSTANTIALLY ENCAPSULATING THE LEADS AND METHODS FOR FABRICATING THE SAME | Feb 20, 2002 | Issued |
Array
(
[id] => 1096107
[patent_doc_number] => 06821888
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-23
[patent_title] => 'Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding'
[patent_app_type] => B2
[patent_app_number] => 10/076244
[patent_app_country] => US
[patent_app_date] => 2002-02-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1956
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/821/06821888.pdf
[firstpage_image] =>[orig_patent_app_number] => 10076244
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/076244 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Feb 12, 2002 | Issued |
Array
(
[id] => 6740413
[patent_doc_number] => 20030157782
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-21
[patent_title] => 'Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same'
[patent_app_type] => new
[patent_app_number] => 10/066645
[patent_app_country] => US
[patent_app_date] => 2002-02-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20030157782.pdf
[firstpage_image] =>[orig_patent_app_number] => 10066645
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/066645 | Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same | Feb 5, 2002 | Issued |
Array
(
[id] => 6269832
[patent_doc_number] => 20020105095
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-08
[patent_title] => 'Semiconductor package having a substrate including a die-attach aperture and method for packaging a semiconductor die'
[patent_app_type] => new
[patent_app_number] => 10/068585
[patent_app_country] => US
[patent_app_date] => 2002-02-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[pdf_file] => publications/A1/0105/20020105095.pdf
[firstpage_image] =>[orig_patent_app_number] => 10068585
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/068585 | Semiconductor package having a substrate including a die-attach aperture and method for packaging a semiconductor die | Feb 4, 2002 | Abandoned |
Array
(
[id] => 1167902
[patent_doc_number] => 06759723
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-07-06
[patent_title] => 'Light emitting semiconductor package'
[patent_app_type] => B2
[patent_app_number] => 10/040473
[patent_app_country] => US
[patent_app_date] => 2002-01-09
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/759/06759723.pdf
[firstpage_image] =>[orig_patent_app_number] => 10040473
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/040473 | Light emitting semiconductor package | Jan 8, 2002 | Issued |
Array
(
[id] => 6854218
[patent_doc_number] => 20030127719
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-10
[patent_title] => 'Structure and process for packaging multi-chip'
[patent_app_type] => new
[patent_app_number] => 10/036525
[patent_app_country] => US
[patent_app_date] => 2002-01-07
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0127/20030127719.pdf
[firstpage_image] =>[orig_patent_app_number] => 10036525
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/036525 | Structure and process for packaging multi-chip | Jan 6, 2002 | Abandoned |
Array
(
[id] => 7612878
[patent_doc_number] => 06902956
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-06-07
[patent_title] => 'Method and structure for manufacturing improved yield semiconductor packaged devices'
[patent_app_type] => utility
[patent_app_number] => 10/041322
[patent_app_country] => US
[patent_app_date] => 2002-01-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/06/902/06902956.pdf
[firstpage_image] =>[orig_patent_app_number] => 10041322
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/041322 | Method and structure for manufacturing improved yield semiconductor packaged devices | Jan 6, 2002 | Issued |
Array
(
[id] => 5964630
[patent_doc_number] => 20020089058
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-11
[patent_title] => 'Electronic component with flexible bonding pads and method of producing such a component'
[patent_app_type] => new
[patent_app_number] => 10/022226
[patent_app_country] => US
[patent_app_date] => 2001-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4762
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20020089058.pdf
[firstpage_image] =>[orig_patent_app_number] => 10022226
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/022226 | Electronic component with flexible bonding pads and method of producing such a component | Dec 16, 2001 | Issued |