
Nema O. Berezny
Examiner (ID: 9201)
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813 |
| Total Applications | 286 |
| Issued Applications | 250 |
| Pending Applications | 5 |
| Abandoned Applications | 31 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1202728
[patent_doc_number] => 06720257
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-04-13
[patent_title] => 'Bump with basic metallization and method for manufacturing the basic metallization'
[patent_app_type] => B1
[patent_app_number] => 09/937955
[patent_app_country] => US
[patent_app_date] => 2001-09-28
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/720/06720257.pdf
[firstpage_image] =>[orig_patent_app_number] => 09937955
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/937955 | Bump with basic metallization and method for manufacturing the basic metallization | Sep 27, 2001 | Issued |
Array
(
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[patent_doc_number] => 20030049411
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-13
[patent_title] => 'No-flow underfill material and underfill method for flip chip devices'
[patent_app_type] => new
[patent_app_number] => 09/949556
[patent_app_country] => US
[patent_app_date] => 2001-09-10
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0049/20030049411.pdf
[firstpage_image] =>[orig_patent_app_number] => 09949556
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/949556 | No-flow underfill material and underfill method for flip chip devices | Sep 9, 2001 | Issued |
Array
(
[id] => 1165084
[patent_doc_number] => 06756251
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-06-29
[patent_title] => 'Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture'
[patent_app_type] => B2
[patent_app_number] => 09/944465
[patent_app_country] => US
[patent_app_date] => 2001-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/06/756/06756251.pdf
[firstpage_image] =>[orig_patent_app_number] => 09944465
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/944465 | Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill aperture | Aug 29, 2001 | Issued |
Array
(
[id] => 6476712
[patent_doc_number] => 20020024126
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-28
[patent_title] => 'Integrated circuit, casting mold for producing an integrated module, method of producing an integrated circuit, and method of testing an integrated circuit'
[patent_app_type] => new
[patent_app_number] => 09/940089
[patent_app_country] => US
[patent_app_date] => 2001-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0024/20020024126.pdf
[firstpage_image] =>[orig_patent_app_number] => 09940089
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/940089 | Integrated circuit, casting mold for producing an integrated module, method of producing an integrated circuit, and method of testing an integrated circuit | Aug 26, 2001 | Abandoned |
Array
(
[id] => 6016143
[patent_doc_number] => 20020102745
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[patent_kind] => A1
[patent_issue_date] => 2002-08-01
[patent_title] => 'Process for modifying chip assembly substrates'
[patent_app_type] => new
[patent_app_number] => 09/921346
[patent_app_country] => US
[patent_app_date] => 2001-08-02
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 09921346
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/921346 | Process for modifying chip assembly substrates | Aug 1, 2001 | Abandoned |
Array
(
[id] => 1345820
[patent_doc_number] => 06582979
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-06-24
[patent_title] => 'Structure and method for fabrication of a leadless chip carrier with embedded antenna'
[patent_app_type] => B2
[patent_app_number] => 09/916666
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[patent_app_date] => 2001-07-26
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[pdf_file] => patents/06/582/06582979.pdf
[firstpage_image] =>[orig_patent_app_number] => 09916666
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/916666 | Structure and method for fabrication of a leadless chip carrier with embedded antenna | Jul 25, 2001 | Issued |
Array
(
[id] => 1341165
[patent_doc_number] => 06586277
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[patent_issue_date] => 2003-07-01
[patent_title] => 'Method and structure for manufacturing improved yield semiconductor packaged devices'
[patent_app_type] => B2
[patent_app_number] => 09/681839
[patent_app_country] => US
[patent_app_date] => 2001-07-26
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[firstpage_image] =>[orig_patent_app_number] => 09681839
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/681839 | Method and structure for manufacturing improved yield semiconductor packaged devices | Jul 25, 2001 | Issued |
Array
(
[id] => 6884913
[patent_doc_number] => 20010039075
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-11-08
[patent_title] => 'Method for Capacitively Coupling Electronic Devices'
[patent_app_type] => new
[patent_app_number] => 09/908016
[patent_app_country] => US
[patent_app_date] => 2001-07-17
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 09908016
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/908016 | Method for capacitively coupling electronic devices | Jul 16, 2001 | Issued |
Array
(
[id] => 6473982
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[patent_issue_date] => 2002-02-21
[patent_title] => 'Semiconductor device, method for fabricating the same, circuit board and electronic device'
[patent_app_type] => new
[patent_app_number] => 09/893406
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[firstpage_image] =>[orig_patent_app_number] => 09893406
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/893406 | System and method for fabricating a semiconductor device | Jun 28, 2001 | Issued |
Array
(
[id] => 6616099
[patent_doc_number] => 20020016022
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[patent_issue_date] => 2002-02-07
[patent_title] => 'Semiconductor device and manufacturing method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/886035 | Semiconductor device and manufacturing method thereof | Jun 21, 2001 | Abandoned |
Array
(
[id] => 6880261
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[patent_title] => 'Method for forming chip scale package'
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Array
(
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Array
(
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Array
(
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Array
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Array
(
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Array
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Array
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Array
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Array
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