
Nema O. Berezny
Examiner (ID: 9201)
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813 |
| Total Applications | 286 |
| Issued Applications | 250 |
| Pending Applications | 5 |
| Abandoned Applications | 31 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6224586
[patent_doc_number] => 20020004257
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-10
[patent_title] => 'Semiconductor device and process for fabricating the same'
[patent_app_type] => new
[patent_app_number] => 09/816055
[patent_app_country] => US
[patent_app_date] => 2001-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5469
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 42
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0004/20020004257.pdf
[firstpage_image] =>[orig_patent_app_number] => 09816055
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/816055 | Semiconductor device and process for fabricating the same | Mar 22, 2001 | Abandoned |
Array
(
[id] => 1594253
[patent_doc_number] => 06383840
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'Semiconductor device, method of manufacture thereof, circuit board, and electronic device'
[patent_app_type] => B1
[patent_app_number] => 09/787736
[patent_app_country] => US
[patent_app_date] => 2001-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 22
[patent_no_of_words] => 7163
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/383/06383840.pdf
[firstpage_image] =>[orig_patent_app_number] => 09787736
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/787736 | Semiconductor device, method of manufacture thereof, circuit board, and electronic device | Mar 21, 2001 | Issued |
Array
(
[id] => 1422832
[patent_doc_number] => 06518674
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-02-11
[patent_title] => 'Temporary attach article and method for temporary attach of devices to a substrate'
[patent_app_type] => B2
[patent_app_number] => 09/805596
[patent_app_country] => US
[patent_app_date] => 2001-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2880
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/518/06518674.pdf
[firstpage_image] =>[orig_patent_app_number] => 09805596
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/805596 | Temporary attach article and method for temporary attach of devices to a substrate | Mar 12, 2001 | Issued |
Array
(
[id] => 1102817
[patent_doc_number] => 06815830
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-09
[patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board and electronic instrument'
[patent_app_type] => B2
[patent_app_number] => 09/794666
[patent_app_country] => US
[patent_app_date] => 2001-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 5939
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/815/06815830.pdf
[firstpage_image] =>[orig_patent_app_number] => 09794666
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/794666 | Semiconductor device and method of manufacturing the same, circuit board and electronic instrument | Feb 27, 2001 | Issued |
Array
(
[id] => 6886586
[patent_doc_number] => 20010019855
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-09-06
[patent_title] => 'Method for manufacturing integrated circuits and semiconductor wafer which has integrated circuits'
[patent_app_type] => new
[patent_app_number] => 09/790025
[patent_app_country] => US
[patent_app_date] => 2001-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2949
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0019/20010019855.pdf
[firstpage_image] =>[orig_patent_app_number] => 09790025
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/790025 | Method for manufacturing integrated circuits and semiconductor wafer which has integrated circuits | Feb 20, 2001 | Issued |
Array
(
[id] => 6894006
[patent_doc_number] => 20010016372
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-08-23
[patent_title] => 'Mounting method and apparatus of bare chips'
[patent_app_type] => new
[patent_app_number] => 09/785965
[patent_app_country] => US
[patent_app_date] => 2001-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5808
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0016/20010016372.pdf
[firstpage_image] =>[orig_patent_app_number] => 09785965
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/785965 | Mounting method and apparatus of bare chips | Feb 15, 2001 | Abandoned |
Array
(
[id] => 1212625
[patent_doc_number] => 06709890
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-03-23
[patent_title] => 'Method of manufacturing semiconductor integrated circuit device'
[patent_app_type] => B2
[patent_app_number] => 09/783605
[patent_app_country] => US
[patent_app_date] => 2001-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 39
[patent_no_of_words] => 10900
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/709/06709890.pdf
[firstpage_image] =>[orig_patent_app_number] => 09783605
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/783605 | Method of manufacturing semiconductor integrated circuit device | Feb 14, 2001 | Issued |
Array
(
[id] => 6892068
[patent_doc_number] => 20010018230
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-08-30
[patent_title] => 'Flip chip C4 extension structure and process'
[patent_app_type] => new
[patent_app_number] => 09/782471
[patent_app_country] => US
[patent_app_date] => 2001-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 12367
[patent_no_of_claims] => 39
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0018/20010018230.pdf
[firstpage_image] =>[orig_patent_app_number] => 09782471
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/782471 | Flip chip C4 extension structure and process | Feb 11, 2001 | Issued |
Array
(
[id] => 6277217
[patent_doc_number] => 20020106893
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-08
[patent_title] => 'STRUCTURE AND PROCESS FOR MULTI-CHIP CHIP ATTACH WITH REDUCED RISK OF ELECTROSTATIC DISCHARGE DAMAGE'
[patent_app_type] => new
[patent_app_number] => 09/779215
[patent_app_country] => US
[patent_app_date] => 2001-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3225
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0106/20020106893.pdf
[firstpage_image] =>[orig_patent_app_number] => 09779215
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/779215 | Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damage | Feb 6, 2001 | Issued |
| 09/701146 | Method for making a portable electronic device comprising at least an integrated circuit chip | Feb 4, 2001 | Abandoned |
Array
(
[id] => 7630964
[patent_doc_number] => 06635968
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-10-21
[patent_title] => 'Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal'
[patent_app_type] => B2
[patent_app_number] => 09/775546
[patent_app_country] => US
[patent_app_date] => 2001-02-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 31
[patent_no_of_words] => 4986
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 5
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/635/06635968.pdf
[firstpage_image] =>[orig_patent_app_number] => 09775546
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/775546 | Semiconductor device having improved alignment of an electrode terminal on a semiconductor chip and a conductor coupled to the electrode terminal | Feb 4, 2001 | Issued |
Array
(
[id] => 1534474
[patent_doc_number] => 06489178
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-12-03
[patent_title] => 'Method of fabricating a molded package for micromechanical devices'
[patent_app_type] => B2
[patent_app_number] => 09/766195
[patent_app_country] => US
[patent_app_date] => 2001-01-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 16
[patent_no_of_words] => 7497
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 234
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/489/06489178.pdf
[firstpage_image] =>[orig_patent_app_number] => 09766195
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/766195 | Method of fabricating a molded package for micromechanical devices | Jan 18, 2001 | Issued |
Array
(
[id] => 6877964
[patent_doc_number] => 20010002119
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-05-31
[patent_title] => 'Method of producing a pressure sensor component'
[patent_app_type] => new-utility
[patent_app_number] => 09/761235
[patent_app_country] => US
[patent_app_date] => 2001-01-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 4026
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0002/20010002119.pdf
[firstpage_image] =>[orig_patent_app_number] => 09761235
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/761235 | Method of producing a pressure sensor component | Jan 16, 2001 | Abandoned |
Array
(
[id] => 6882688
[patent_doc_number] => 20010049160
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-12-06
[patent_title] => 'Semiconductor chip removing and conveying method and device'
[patent_app_type] => new
[patent_app_number] => 09/746066
[patent_app_country] => US
[patent_app_date] => 2000-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 6249
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0049/20010049160.pdf
[firstpage_image] =>[orig_patent_app_number] => 09746066
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/746066 | Semiconductor chip removing and conveying method and device | Dec 25, 2000 | Issued |
Array
(
[id] => 1314518
[patent_doc_number] => 06614110
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-02
[patent_title] => 'Module with bumps for connection and support'
[patent_app_type] => B1
[patent_app_number] => 09/745966
[patent_app_country] => US
[patent_app_date] => 2000-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 12
[patent_no_of_words] => 6438
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/614/06614110.pdf
[firstpage_image] =>[orig_patent_app_number] => 09745966
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/745966 | Module with bumps for connection and support | Dec 21, 2000 | Issued |
Array
(
[id] => 6876677
[patent_doc_number] => 20010006830
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-07-05
[patent_title] => 'Method of producing a semiconductor device'
[patent_app_type] => new-utility
[patent_app_number] => 09/737056
[patent_app_country] => US
[patent_app_date] => 2000-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 2196
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20010006830.pdf
[firstpage_image] =>[orig_patent_app_number] => 09737056
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/737056 | Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing material | Dec 13, 2000 | Issued |
Array
(
[id] => 1466918
[patent_doc_number] => 06458628
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-01
[patent_title] => 'Methods of encapsulating a semiconductor chip using a settable encapsulant'
[patent_app_type] => B1
[patent_app_number] => 09/712635
[patent_app_country] => US
[patent_app_date] => 2000-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 19
[patent_no_of_words] => 5543
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/458/06458628.pdf
[firstpage_image] =>[orig_patent_app_number] => 09712635
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/712635 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Nov 13, 2000 | Issued |
Array
(
[id] => 1519047
[patent_doc_number] => 06501169
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-12-31
[patent_title] => 'Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise'
[patent_app_type] => B1
[patent_app_number] => 09/708379
[patent_app_country] => US
[patent_app_date] => 2000-11-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 36
[patent_no_of_words] => 7226
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/501/06501169.pdf
[firstpage_image] =>[orig_patent_app_number] => 09708379
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/708379 | Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise | Nov 7, 2000 | Issued |
Array
(
[id] => 1384099
[patent_doc_number] => 06559487
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-05-06
[patent_title] => 'High-vacuum packaged microgyroscope and method for manufacturing the same'
[patent_app_type] => B1
[patent_app_number] => 09/702846
[patent_app_country] => US
[patent_app_date] => 2000-11-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 3954
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 189
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/559/06559487.pdf
[firstpage_image] =>[orig_patent_app_number] => 09702846
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/702846 | High-vacuum packaged microgyroscope and method for manufacturing the same | Oct 31, 2000 | Issued |
Array
(
[id] => 1197827
[patent_doc_number] => 06727580
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-04-27
[patent_title] => 'Microelectronic spring contact elements'
[patent_app_type] => B1
[patent_app_number] => 09/694205
[patent_app_country] => US
[patent_app_date] => 2000-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 14
[patent_no_of_words] => 5589
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 173
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/727/06727580.pdf
[firstpage_image] =>[orig_patent_app_number] => 09694205
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/694205 | Microelectronic spring contact elements | Oct 19, 2000 | Issued |