
Nema O. Berezny
Examiner (ID: 9201)
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813 |
| Total Applications | 286 |
| Issued Applications | 250 |
| Pending Applications | 5 |
| Abandoned Applications | 31 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4326318
[patent_doc_number] => 06319753
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[patent_kind] => NA
[patent_issue_date] => 2001-11-20
[patent_title] => 'Semiconductor device having lead terminals bent in J-shape'
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[patent_app_number] => 9/417745
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Array
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[patent_issue_date] => 2002-05-21
[patent_title] => 'Lead frame and manufacturing method thereof'
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Array
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[patent_issue_date] => 2001-09-18
[patent_title] => 'Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip'
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[patent_app_number] => 9/409896
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Array
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[patent_title] => 'Lead frame chip scale package'
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Array
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[patent_issue_date] => 2001-11-13
[patent_title] => 'Adhesion enhanced semiconductor die for mold compound packaging'
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Array
(
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Array
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[patent_title] => 'Method for fabricating a dual-chip package and package formed'
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Array
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[patent_title] => 'Method and structure for manufacturing improved yield semiconductor packaged devices'
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Array
(
[id] => 4380559
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[patent_issue_date] => 2001-07-17
[patent_title] => 'Method and apparatus for sealing a chip carrier and lid'
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Array
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[patent_issue_date] => 2002-01-29
[patent_title] => 'Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate'
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[patent_app_number] => 09/346735
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Array
(
[id] => 1474389
[patent_doc_number] => 06387731
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[patent_title] => 'Method and apparatus for reducing BGA warpage caused by encapsulation'
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Array
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[patent_doc_number] => 20020034834
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[patent_title] => 'OPTOELECTRONIC ASSEMBLY AND METHOD OF MAKING THE SAME'
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Array
(
[id] => 4267361
[patent_doc_number] => 06306749
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[patent_title] => 'Bond pad with pad edge strengthening structure'
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Array
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Array
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Array
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Array
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Array
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Array
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