
Nga Doan
Examiner (ID: 18754, Phone: (571)270-5356 , Office: P/2817 )
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813, 2817, 4172 |
| Total Applications | 427 |
| Issued Applications | 311 |
| Pending Applications | 0 |
| Abandoned Applications | 119 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8760019
[patent_doc_number] => 08420540
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-04-16
[patent_title] => 'Sub-lithographic printing method'
[patent_app_type] => utility
[patent_app_number] => 13/006412
[patent_app_country] => US
[patent_app_date] => 2011-01-13
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13006412
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/006412 | Sub-lithographic printing method | Jan 12, 2011 | Issued |
Array
(
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[patent_doc_number] => 20110097895
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-04-28
[patent_title] => 'SEMICONDUCTOR DEVICES INCLUDING INTERLAYER CONDUCTIVE CONTACTS AND METHODS OF FORMING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/984838
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/984838 | Semiconductor devices including interlayer conductive contacts and methods of forming the same | Jan 4, 2011 | Issued |
Array
(
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[patent_doc_number] => 20120146202
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[patent_kind] => A1
[patent_issue_date] => 2012-06-14
[patent_title] => 'Top exposed Package and Assembly Method'
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[patent_app_number] => 12/968159
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[patent_app_date] => 2010-12-14
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Array
(
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[patent_issue_date] => 2012-01-05
[patent_title] => 'CHIP-SIZED PACKAGE AND FABRICATION METHOD THEREOF'
[patent_app_type] => utility
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Array
(
[id] => 8802816
[patent_doc_number] => 08441091
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[patent_kind] => B2
[patent_issue_date] => 2013-05-14
[patent_title] => 'Photosensor assembly and method for providing a photosensor assembly'
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Array
(
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[patent_doc_number] => 20110140160
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[patent_issue_date] => 2011-06-16
[patent_title] => 'LIGHT EMITTING DIODE HAVING ELECTRODE PADS'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/963921 | Light emitting diode having electrode pads | Dec 8, 2010 | Issued |
Array
(
[id] => 8237460
[patent_doc_number] => 20120146182
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-06-14
[patent_title] => 'HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS'
[patent_app_type] => utility
[patent_app_number] => 12/964049
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[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/964049 | High density three-dimensional integrated capacitors | Dec 8, 2010 | Issued |
Array
(
[id] => 8981992
[patent_doc_number] => 08513106
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[patent_issue_date] => 2013-08-20
[patent_title] => 'Pseudo butted junction structure for back plane connection'
[patent_app_type] => utility
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Array
(
[id] => 8910036
[patent_doc_number] => 08482103
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[patent_kind] => B2
[patent_issue_date] => 2013-07-09
[patent_title] => 'Nitride semiconductor template and fabricating method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/963650 | Nitride semiconductor template and fabricating method thereof | Dec 8, 2010 | Issued |
Array
(
[id] => 7571029
[patent_doc_number] => 20110266685
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[patent_issue_date] => 2011-11-03
[patent_title] => 'Semiconductor Device Comprising Sophisticated Conductive Elements in a Dielectric Material System Formed by Using a Barrier Layer'
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[patent_app_number] => 12/963707
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Array
(
[id] => 9100210
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Array
(
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Array
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Array
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Array
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Array
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Array
(
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Array
(
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Array
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Array
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