
Nha T. Nguyen
Examiner (ID: 5164, Phone: (571)270-1405 , Office: P/2851 )
| Most Active Art Unit | 2851 |
| Art Unit(s) | 2851, 2825 |
| Total Applications | 1201 |
| Issued Applications | 1005 |
| Pending Applications | 63 |
| Abandoned Applications | 146 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1335753
[patent_doc_number] => 06596945
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-07-22
[patent_title] => 'Superconducting cable'
[patent_app_type] => B1
[patent_app_number] => 09/392278
[patent_app_country] => US
[patent_app_date] => 1999-09-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 5674
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/596/06596945.pdf
[firstpage_image] =>[orig_patent_app_number] => 09392278
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/392278 | Superconducting cable | Sep 8, 1999 | Issued |
Array
(
[id] => 1455040
[patent_doc_number] => 06462283
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-08
[patent_title] => 'Semiconductor package with central circuit pattern'
[patent_app_type] => B1
[patent_app_number] => 09/390024
[patent_app_country] => US
[patent_app_date] => 1999-09-03
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[firstpage_image] =>[orig_patent_app_number] => 09390024
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/390024 | Semiconductor package with central circuit pattern | Sep 2, 1999 | Issued |
Array
(
[id] => 1515879
[patent_doc_number] => 06420661
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-16
[patent_title] => 'Connector element for connecting microelectronic elements'
[patent_app_type] => B1
[patent_app_number] => 09/388718
[patent_app_country] => US
[patent_app_date] => 1999-09-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[firstpage_image] =>[orig_patent_app_number] => 09388718
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/388718 | Connector element for connecting microelectronic elements | Sep 1, 1999 | Issued |
Array
(
[id] => 4276572
[patent_doc_number] => 06323439
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-27
[patent_title] => 'Metal core multilayer resin wiring board with thin portion and method for manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 9/386334
[patent_app_country] => US
[patent_app_date] => 1999-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 7814
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[pdf_file] => patents/06/323/06323439.pdf
[firstpage_image] =>[orig_patent_app_number] => 386334
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/386334 | Metal core multilayer resin wiring board with thin portion and method for manufacturing the same | Aug 30, 1999 | Issued |
Array
(
[id] => 1297015
[patent_doc_number] => 06631280
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-10-07
[patent_title] => 'Oxide superconducting wire with reduced AC loss'
[patent_app_type] => B1
[patent_app_number] => 09/380272
[patent_app_country] => US
[patent_app_date] => 1999-08-27
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[firstpage_image] =>[orig_patent_app_number] => 09380272
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/380272 | Oxide superconducting wire with reduced AC loss | Aug 26, 1999 | Issued |
Array
(
[id] => 7636169
[patent_doc_number] => 06380491
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-30
[patent_title] => 'Method for producing snap fit apertures for RF shield fences'
[patent_app_type] => B1
[patent_app_number] => 09/383701
[patent_app_country] => US
[patent_app_date] => 1999-08-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/380/06380491.pdf
[firstpage_image] =>[orig_patent_app_number] => 09383701
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/383701 | Method for producing snap fit apertures for RF shield fences | Aug 25, 1999 | Issued |
| 09/380178 | METHOD AND ARRANGEMENT FOR ATTACHING A COMPONENT | Aug 25, 1999 | Abandoned |
Array
(
[id] => 1459633
[patent_doc_number] => 06426467
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-30
[patent_title] => 'Film carrier with adjacent electrical sorting pads'
[patent_app_type] => B1
[patent_app_number] => 09/376368
[patent_app_country] => US
[patent_app_date] => 1999-08-18
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/426/06426467.pdf
[firstpage_image] =>[orig_patent_app_number] => 09376368
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/376368 | Film carrier with adjacent electrical sorting pads | Aug 17, 1999 | Issued |
Array
(
[id] => 1501907
[patent_doc_number] => 06486394
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-26
[patent_title] => 'Process for producing connecting conductors'
[patent_app_type] => B1
[patent_app_number] => 09/230713
[patent_app_country] => US
[patent_app_date] => 1999-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/06/486/06486394.pdf
[firstpage_image] =>[orig_patent_app_number] => 09230713
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/230713 | Process for producing connecting conductors | Aug 15, 1999 | Issued |
Array
(
[id] => 4308678
[patent_doc_number] => 06252178
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-26
[patent_title] => 'Semiconductor device with bonding anchors in build-up layers'
[patent_app_type] => 1
[patent_app_number] => 9/373303
[patent_app_country] => US
[patent_app_date] => 1999-08-12
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/252/06252178.pdf
[firstpage_image] =>[orig_patent_app_number] => 373303
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/373303 | Semiconductor device with bonding anchors in build-up layers | Aug 11, 1999 | Issued |
Array
(
[id] => 4308348
[patent_doc_number] => 06326560
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-04
[patent_title] => 'Adapter for a ball grid array device'
[patent_app_type] => 1
[patent_app_number] => 9/366812
[patent_app_country] => US
[patent_app_date] => 1999-08-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/06/326/06326560.pdf
[firstpage_image] =>[orig_patent_app_number] => 366812
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/366812 | Adapter for a ball grid array device | Aug 3, 1999 | Issued |
Array
(
[id] => 1536325
[patent_doc_number] => 06337307
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-08
[patent_title] => 'Oxide superconducting conductor with intermediate layer having aligned crystal orientation'
[patent_app_type] => B1
[patent_app_number] => 09/363816
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[pdf_file] => patents/06/337/06337307.pdf
[firstpage_image] =>[orig_patent_app_number] => 09363816
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/363816 | Oxide superconducting conductor with intermediate layer having aligned crystal orientation | Jul 29, 1999 | Issued |
Array
(
[id] => 1460971
[patent_doc_number] => 06392159
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-21
[patent_title] => 'Embedded structure for engineering change and repair of circuit boards'
[patent_app_type] => B1
[patent_app_number] => 09/362273
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/362273 | Embedded structure for engineering change and repair of circuit boards | Jul 26, 1999 | Issued |
Array
(
[id] => 1476058
[patent_doc_number] => 06388208
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[patent_issue_date] => 2002-05-14
[patent_title] => 'Multi-connection via with electrically isolated segments'
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[patent_app_number] => 09/360002
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[pdf_file] => patents/06/388/06388208.pdf
[firstpage_image] =>[orig_patent_app_number] => 09360002
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/360002 | Multi-connection via with electrically isolated segments | Jul 22, 1999 | Issued |
Array
(
[id] => 1546946
[patent_doc_number] => 06444917
[patent_country] => US
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[patent_title] => 'Encapsulated ceramic superconductors'
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[patent_app_number] => 09/360318
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[firstpage_image] =>[orig_patent_app_number] => 09360318
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/360318 | Encapsulated ceramic superconductors | Jul 22, 1999 | Issued |
Array
(
[id] => 1546969
[patent_doc_number] => 06444924
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Printed wiring board with joining pin and manufacturing method therefor'
[patent_app_type] => B1
[patent_app_number] => 09/359981
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[patent_app_date] => 1999-07-23
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[firstpage_image] =>[orig_patent_app_number] => 09359981
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/359981 | Printed wiring board with joining pin and manufacturing method therefor | Jul 22, 1999 | Issued |
| 09/356608 | DIRECT ATTACHED BOARD TO BOARD INTERCONNECTION AND METHOD FOR FORMING SAME | Jul 18, 1999 | Abandoned |
Array
(
[id] => 4340050
[patent_doc_number] => 06333469
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[patent_issue_date] => 2001-12-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/353385 | Wafer-scale package structure and circuit board attached thereto | Jul 14, 1999 | Issued |
Array
(
[id] => 4280925
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/352321 | Device and method for connecting two electronic components | Jul 11, 1999 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/334565 | Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal | Jun 20, 1999 | Issued |