
Niki Marina Eloshway
Examiner (ID: 18560, Phone: (571)272-4538 , Office: P/3728 )
| Most Active Art Unit | 3736 |
| Art Unit(s) | 3736, 3207, 3727, 3781, 3728 |
| Total Applications | 2477 |
| Issued Applications | 1472 |
| Pending Applications | 223 |
| Abandoned Applications | 809 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6137610
[patent_doc_number] => 20110127680
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-02
[patent_title] => 'SPACER, AND ITS MANUFACTURING METHOD'
[patent_app_type] => utility
[patent_app_number] => 12/674761
[patent_app_country] => US
[patent_app_date] => 2008-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 67
[patent_figures_cnt] => 67
[patent_no_of_words] => 18170
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0127/20110127680.pdf
[firstpage_image] =>[orig_patent_app_number] => 12674761
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/674761 | Spacer, and its manufacturing method | Aug 24, 2008 | Issued |
Array
(
[id] => 5556570
[patent_doc_number] => 20090268147
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-29
[patent_title] => 'CHIP HAVING A DRIVING INTEGRATED CIRCUIT AND LIQUID CRYSTAL DISPLAY HAVING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/194546
[patent_app_country] => US
[patent_app_date] => 2008-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_no_of_claims] => 27
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[pdf_file] => publications/A1/0268/20090268147.pdf
[firstpage_image] =>[orig_patent_app_number] => 12194546
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/194546 | Liquid crystal display | Aug 19, 2008 | Issued |
Array
(
[id] => 4711179
[patent_doc_number] => 20080299705
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-04
[patent_title] => 'Chip Scale Package Having Flip Chip Interconnect on Die Paddle'
[patent_app_type] => utility
[patent_app_number] => 12/191542
[patent_app_country] => US
[patent_app_date] => 2008-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3921
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[pdf_file] => publications/A1/0299/20080299705.pdf
[firstpage_image] =>[orig_patent_app_number] => 12191542
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/191542 | Chip scale package having flip chip interconnect on die paddle | Aug 13, 2008 | Issued |
Array
(
[id] => 6231367
[patent_doc_number] => 20100264552
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-10-21
[patent_title] => 'CIRCUIT DEVICE, METHOD OF MANUFACTURING THE CIRCUIT DEVICE, DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE'
[patent_app_type] => utility
[patent_app_number] => 12/673409
[patent_app_country] => US
[patent_app_date] => 2008-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 15488
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[pdf_file] => publications/A1/0264/20100264552.pdf
[firstpage_image] =>[orig_patent_app_number] => 12673409
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/673409 | Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module | Aug 7, 2008 | Issued |
Array
(
[id] => 5413619
[patent_doc_number] => 20090039506
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-12
[patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A SEMICONDUCTOR CHIP WHICH IS MOUNTED SPANING A PLURALITY OF WIRING BOARDS AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/186056
[patent_app_country] => US
[patent_app_date] => 2008-08-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 5280
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[pdf_file] => publications/A1/0039/20090039506.pdf
[firstpage_image] =>[orig_patent_app_number] => 12186056
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/186056 | Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof | Aug 4, 2008 | Issued |
Array
(
[id] => 5358150
[patent_doc_number] => 20090032944
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-05
[patent_title] => 'ELECTRONIC DEVICE, METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/181536
[patent_app_country] => US
[patent_app_date] => 2008-07-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0032/20090032944.pdf
[firstpage_image] =>[orig_patent_app_number] => 12181536
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/181536 | Electronic device, method of producing the same, and semiconductor device | Jul 28, 2008 | Issued |
Array
(
[id] => 7796356
[patent_doc_number] => 08125064
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2012-02-28
[patent_title] => 'Increased I/O semiconductor package and method of making same'
[patent_app_type] => utility
[patent_app_number] => 12/181256
[patent_app_country] => US
[patent_app_date] => 2008-07-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[patent_no_of_words] => 7693
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[pdf_file] => patents/08/125/08125064.pdf
[firstpage_image] =>[orig_patent_app_number] => 12181256
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/181256 | Increased I/O semiconductor package and method of making same | Jul 27, 2008 | Issued |
Array
(
[id] => 8859135
[patent_doc_number] => 08461672
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-06-11
[patent_title] => 'Reconstituted wafer stack packaging with after-applied pad extensions'
[patent_app_type] => utility
[patent_app_number] => 12/670952
[patent_app_country] => US
[patent_app_date] => 2008-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 8690
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12670952
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/670952 | Reconstituted wafer stack packaging with after-applied pad extensions | Jul 24, 2008 | Issued |
Array
(
[id] => 4836935
[patent_doc_number] => 20080277799
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-13
[patent_title] => 'LOW TEMPERATURE METHODS OF FORMING BACK SIDE REDISTRIBUTION LAYERS IN ASSOCIATION WITH THROUGH WAFER INTERCONNECTS, SEMICONDUCTOR DEVICES INCLUDING SAME, AND ASSEMBLIES'
[patent_app_type] => utility
[patent_app_number] => 12/178066
[patent_app_country] => US
[patent_app_date] => 2008-07-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0277/20080277799.pdf
[firstpage_image] =>[orig_patent_app_number] => 12178066
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/178066 | Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects | Jul 22, 2008 | Issued |
Array
(
[id] => 5518629
[patent_doc_number] => 20090026610
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-29
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/177696
[patent_app_country] => US
[patent_app_date] => 2008-07-22
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0026/20090026610.pdf
[firstpage_image] =>[orig_patent_app_number] => 12177696
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/177696 | Semiconductor device and method of manufacturing the same | Jul 21, 2008 | Issued |
Array
(
[id] => 6503350
[patent_doc_number] => 20100013101
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-21
[patent_title] => 'Method for Manufacturing a Multichip Module Assembly'
[patent_app_type] => utility
[patent_app_number] => 12/175726
[patent_app_country] => US
[patent_app_date] => 2008-07-18
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/175726 | Method for manufacturing a multichip module assembly | Jul 17, 2008 | Issued |
Array
(
[id] => 6464424
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[patent_title] => 'INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/172431 | INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAME | Jul 13, 2008 | Abandoned |
Array
(
[id] => 7530393
[patent_doc_number] => 07842615
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[patent_issue_date] => 2010-11-30
[patent_title] => 'Semiconductor device having a copper metal line and method of forming the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/169526 | Semiconductor device having a copper metal line and method of forming the same | Jul 7, 2008 | Issued |
Array
(
[id] => 6591953
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[patent_issue_date] => 2010-01-07
[patent_title] => 'INTEGRATED CIRCUIT STRUCTURE'
[patent_app_type] => utility
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Array
(
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[patent_title] => 'MANUFACTURING METHOD FOR INTEGRATING A SHUNT RESISTOR INTO A SEMICONDUCTOR PACKAGE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/165932 | Manufacturing method for integrating a shunt resistor into a semiconductor package | Jun 30, 2008 | Issued |
Array
(
[id] => 4476883
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[patent_kind] => B2
[patent_issue_date] => 2011-03-15
[patent_title] => 'Magnetic particle-based composite materials for semiconductor packages'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/164996 | Magnetic particle-based composite materials for semiconductor packages | Jun 29, 2008 | Issued |
Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/147122 | Wiring structure and method of manufacturing the same | Jun 25, 2008 | Issued |
Array
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