
Niki Marina Eloshway
Examiner (ID: 18560, Phone: (571)272-4538 , Office: P/3728 )
| Most Active Art Unit | 3736 |
| Art Unit(s) | 3736, 3207, 3727, 3781, 3728 |
| Total Applications | 2477 |
| Issued Applications | 1472 |
| Pending Applications | 223 |
| Abandoned Applications | 809 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8398950
[patent_doc_number] => 08269340
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-09-18
[patent_title] => 'Curvilinear heat spreader/lid with improved heat dissipation'
[patent_app_type] => utility
[patent_app_number] => 11/857812
[patent_app_country] => US
[patent_app_date] => 2007-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2266
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 133
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11857812
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/857812 | Curvilinear heat spreader/lid with improved heat dissipation | Sep 18, 2007 | Issued |
Array
(
[id] => 31934
[patent_doc_number] => 07790270
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-07
[patent_title] => 'Wiring board and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/898971
[patent_app_country] => US
[patent_app_date] => 2007-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 21
[patent_no_of_words] => 8510
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/790/07790270.pdf
[firstpage_image] =>[orig_patent_app_number] => 11898971
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/898971 | Wiring board and semiconductor device | Sep 17, 2007 | Issued |
Array
(
[id] => 8203023
[patent_doc_number] => 08188603
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-05-29
[patent_title] => 'Post passivation interconnection schemes on top of IC chip'
[patent_app_type] => utility
[patent_app_number] => 11/856076
[patent_app_country] => US
[patent_app_date] => 2007-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 11
[patent_no_of_words] => 7328
[patent_no_of_claims] => 14
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[patent_words_short_claim] => 226
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/188/08188603.pdf
[firstpage_image] =>[orig_patent_app_number] => 11856076
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/856076 | Post passivation interconnection schemes on top of IC chip | Sep 16, 2007 | Issued |
Array
(
[id] => 8572278
[patent_doc_number] => 08338928
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-12-25
[patent_title] => 'Three-dimensional package structure'
[patent_app_type] => utility
[patent_app_number] => 11/847351
[patent_app_country] => US
[patent_app_date] => 2007-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 4378
[patent_no_of_claims] => 22
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11847351
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/847351 | Three-dimensional package structure | Aug 29, 2007 | Issued |
Array
(
[id] => 93118
[patent_doc_number] => 07737548
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-15
[patent_title] => 'Semiconductor die package including heat sinks'
[patent_app_type] => utility
[patent_app_number] => 11/847001
[patent_app_country] => US
[patent_app_date] => 2007-08-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 3729
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[patent_words_short_claim] => 88
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/737/07737548.pdf
[firstpage_image] =>[orig_patent_app_number] => 11847001
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/847001 | Semiconductor die package including heat sinks | Aug 28, 2007 | Issued |
Array
(
[id] => 4749300
[patent_doc_number] => 20080157371
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'Metal Line of Semiconductor Device and Method of Manufacturing the Same'
[patent_app_type] => utility
[patent_app_number] => 11/842851
[patent_app_country] => US
[patent_app_date] => 2007-08-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3595
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20080157371.pdf
[firstpage_image] =>[orig_patent_app_number] => 11842851
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/842851 | Metal line of semiconductor device and method of manufacturing the same | Aug 20, 2007 | Issued |
Array
(
[id] => 5413609
[patent_doc_number] => 20090039496
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-12
[patent_title] => 'METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/837211
[patent_app_country] => US
[patent_app_date] => 2007-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7110
[patent_no_of_claims] => 57
[patent_no_of_ind_claims] => 8
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0039/20090039496.pdf
[firstpage_image] =>[orig_patent_app_number] => 11837211
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/837211 | Method for fabricating a semiconductor and semiconductor package | Aug 9, 2007 | Issued |
Array
(
[id] => 4518118
[patent_doc_number] => 07932605
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-04-26
[patent_title] => 'Semiconductor device and manufacturing method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/889071
[patent_app_country] => US
[patent_app_date] => 2007-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
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[patent_no_of_words] => 29692
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[pdf_file] => patents/07/932/07932605.pdf
[firstpage_image] =>[orig_patent_app_number] => 11889071
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/889071 | Semiconductor device and manufacturing method therefor | Aug 7, 2007 | Issued |
Array
(
[id] => 132834
[patent_doc_number] => 07701062
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-20
[patent_title] => 'Semiconductor device and method for producing the same'
[patent_app_type] => utility
[patent_app_number] => 11/834081
[patent_app_country] => US
[patent_app_date] => 2007-08-06
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/701/07701062.pdf
[firstpage_image] =>[orig_patent_app_number] => 11834081
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/834081 | Semiconductor device and method for producing the same | Aug 5, 2007 | Issued |
Array
(
[id] => 4654958
[patent_doc_number] => 20080023818
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-31
[patent_title] => 'Contact device for use in a power semiconductor module or in a disc-type thyristor'
[patent_app_type] => utility
[patent_app_number] => 11/881966
[patent_app_country] => US
[patent_app_date] => 2007-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2223
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0023/20080023818.pdf
[firstpage_image] =>[orig_patent_app_number] => 11881966
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/881966 | Contact device for use in a power semiconductor module or in a disc-type thyristor | Jul 29, 2007 | Issued |
Array
(
[id] => 4457715
[patent_doc_number] => 07893545
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-22
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/779731
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/893/07893545.pdf
[firstpage_image] =>[orig_patent_app_number] => 11779731
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/779731 | Semiconductor device | Jul 17, 2007 | Issued |
Array
(
[id] => 5288135
[patent_doc_number] => 20090020865
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-22
[patent_title] => 'Method for Packaging Semiconductor Dies Having Through-Silicon Vias'
[patent_app_type] => utility
[patent_app_number] => 11/778511
[patent_app_country] => US
[patent_app_date] => 2007-07-16
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[pdf_file] => publications/A1/0020/20090020865.pdf
[firstpage_image] =>[orig_patent_app_number] => 11778511
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/778511 | Method for packaging semiconductor dies having through-silicon vias | Jul 15, 2007 | Issued |
Array
(
[id] => 5223019
[patent_doc_number] => 20070252285
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-01
[patent_title] => 'Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/824527
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/824527 | Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device | Jun 28, 2007 | Abandoned |
Array
(
[id] => 5346202
[patent_doc_number] => 20090001563
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-01
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM WITH ADHESIVELESS PACKAGE ATTACH'
[patent_app_type] => utility
[patent_app_number] => 11/769691
[patent_app_country] => US
[patent_app_date] => 2007-06-27
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0001/20090001563.pdf
[firstpage_image] =>[orig_patent_app_number] => 11769691
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/769691 | Integrated circuit package in package system with adhesiveless package attach | Jun 26, 2007 | Issued |
Array
(
[id] => 6563326
[patent_doc_number] => 20100059879
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-03-11
[patent_title] => 'Power Amplifier Assembly'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/305693 | Power amplifier assembly | Jun 14, 2007 | Issued |
Array
(
[id] => 5208244
[patent_doc_number] => 20070246828
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[patent_issue_date] => 2007-10-25
[patent_title] => 'Semiconductor device and method of manufacturing the same'
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[firstpage_image] =>[orig_patent_app_number] => 11811981
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Array
(
[id] => 8329162
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[patent_title] => 'Embedded chip package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/762411 | Embedded chip package | Jun 12, 2007 | Issued |
Array
(
[id] => 112858
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[patent_title] => 'Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/805661 | Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips | May 22, 2007 | Issued |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/801167 | Start-up circuit and start-up method | May 8, 2007 | Issued |