Search

Niki Marina Eloshway

Examiner (ID: 18560, Phone: (571)272-4538 , Office: P/3728 )

Most Active Art Unit
3736
Art Unit(s)
3736, 3207, 3727, 3781, 3728
Total Applications
2477
Issued Applications
1472
Pending Applications
223
Abandoned Applications
809

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8398950 [patent_doc_number] => 08269340 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-09-18 [patent_title] => 'Curvilinear heat spreader/lid with improved heat dissipation' [patent_app_type] => utility [patent_app_number] => 11/857812 [patent_app_country] => US [patent_app_date] => 2007-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2266 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11857812 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/857812
Curvilinear heat spreader/lid with improved heat dissipation Sep 18, 2007 Issued
Array ( [id] => 31934 [patent_doc_number] => 07790270 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-07 [patent_title] => 'Wiring board and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/898971 [patent_app_country] => US [patent_app_date] => 2007-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 21 [patent_no_of_words] => 8510 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/790/07790270.pdf [firstpage_image] =>[orig_patent_app_number] => 11898971 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/898971
Wiring board and semiconductor device Sep 17, 2007 Issued
Array ( [id] => 8203023 [patent_doc_number] => 08188603 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-29 [patent_title] => 'Post passivation interconnection schemes on top of IC chip' [patent_app_type] => utility [patent_app_number] => 11/856076 [patent_app_country] => US [patent_app_date] => 2007-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 7328 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/188/08188603.pdf [firstpage_image] =>[orig_patent_app_number] => 11856076 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/856076
Post passivation interconnection schemes on top of IC chip Sep 16, 2007 Issued
Array ( [id] => 8572278 [patent_doc_number] => 08338928 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-12-25 [patent_title] => 'Three-dimensional package structure' [patent_app_type] => utility [patent_app_number] => 11/847351 [patent_app_country] => US [patent_app_date] => 2007-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 4378 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11847351 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/847351
Three-dimensional package structure Aug 29, 2007 Issued
Array ( [id] => 93118 [patent_doc_number] => 07737548 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-06-15 [patent_title] => 'Semiconductor die package including heat sinks' [patent_app_type] => utility [patent_app_number] => 11/847001 [patent_app_country] => US [patent_app_date] => 2007-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 13 [patent_no_of_words] => 3729 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/737/07737548.pdf [firstpage_image] =>[orig_patent_app_number] => 11847001 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/847001
Semiconductor die package including heat sinks Aug 28, 2007 Issued
Array ( [id] => 4749300 [patent_doc_number] => 20080157371 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Metal Line of Semiconductor Device and Method of Manufacturing the Same' [patent_app_type] => utility [patent_app_number] => 11/842851 [patent_app_country] => US [patent_app_date] => 2007-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3595 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157371.pdf [firstpage_image] =>[orig_patent_app_number] => 11842851 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/842851
Metal line of semiconductor device and method of manufacturing the same Aug 20, 2007 Issued
Array ( [id] => 5413609 [patent_doc_number] => 20090039496 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-12 [patent_title] => 'METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/837211 [patent_app_country] => US [patent_app_date] => 2007-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7110 [patent_no_of_claims] => 57 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0039/20090039496.pdf [firstpage_image] =>[orig_patent_app_number] => 11837211 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/837211
Method for fabricating a semiconductor and semiconductor package Aug 9, 2007 Issued
Array ( [id] => 4518118 [patent_doc_number] => 07932605 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-26 [patent_title] => 'Semiconductor device and manufacturing method therefor' [patent_app_type] => utility [patent_app_number] => 11/889071 [patent_app_country] => US [patent_app_date] => 2007-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 63 [patent_no_of_words] => 29692 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/932/07932605.pdf [firstpage_image] =>[orig_patent_app_number] => 11889071 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/889071
Semiconductor device and manufacturing method therefor Aug 7, 2007 Issued
Array ( [id] => 132834 [patent_doc_number] => 07701062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-20 [patent_title] => 'Semiconductor device and method for producing the same' [patent_app_type] => utility [patent_app_number] => 11/834081 [patent_app_country] => US [patent_app_date] => 2007-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 8174 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/701/07701062.pdf [firstpage_image] =>[orig_patent_app_number] => 11834081 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/834081
Semiconductor device and method for producing the same Aug 5, 2007 Issued
Array ( [id] => 4654958 [patent_doc_number] => 20080023818 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'Contact device for use in a power semiconductor module or in a disc-type thyristor' [patent_app_type] => utility [patent_app_number] => 11/881966 [patent_app_country] => US [patent_app_date] => 2007-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2223 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20080023818.pdf [firstpage_image] =>[orig_patent_app_number] => 11881966 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/881966
Contact device for use in a power semiconductor module or in a disc-type thyristor Jul 29, 2007 Issued
Array ( [id] => 4457715 [patent_doc_number] => 07893545 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-22 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/779731 [patent_app_country] => US [patent_app_date] => 2007-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 20 [patent_no_of_words] => 4623 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/893/07893545.pdf [firstpage_image] =>[orig_patent_app_number] => 11779731 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/779731
Semiconductor device Jul 17, 2007 Issued
Array ( [id] => 5288135 [patent_doc_number] => 20090020865 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-22 [patent_title] => 'Method for Packaging Semiconductor Dies Having Through-Silicon Vias' [patent_app_type] => utility [patent_app_number] => 11/778511 [patent_app_country] => US [patent_app_date] => 2007-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2216 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0020/20090020865.pdf [firstpage_image] =>[orig_patent_app_number] => 11778511 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/778511
Method for packaging semiconductor dies having through-silicon vias Jul 15, 2007 Issued
Array ( [id] => 5223019 [patent_doc_number] => 20070252285 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-01 [patent_title] => 'Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/824527 [patent_app_country] => US [patent_app_date] => 2007-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 8427 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0252/20070252285.pdf [firstpage_image] =>[orig_patent_app_number] => 11824527 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/824527
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device Jun 28, 2007 Abandoned
Array ( [id] => 5346202 [patent_doc_number] => 20090001563 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-01 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM WITH ADHESIVELESS PACKAGE ATTACH' [patent_app_type] => utility [patent_app_number] => 11/769691 [patent_app_country] => US [patent_app_date] => 2007-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 7663 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20090001563.pdf [firstpage_image] =>[orig_patent_app_number] => 11769691 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/769691
Integrated circuit package in package system with adhesiveless package attach Jun 26, 2007 Issued
Array ( [id] => 6563326 [patent_doc_number] => 20100059879 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-03-11 [patent_title] => 'Power Amplifier Assembly' [patent_app_type] => utility [patent_app_number] => 12/305693 [patent_app_country] => US [patent_app_date] => 2007-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6766 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0059/20100059879.pdf [firstpage_image] =>[orig_patent_app_number] => 12305693 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/305693
Power amplifier assembly Jun 14, 2007 Issued
Array ( [id] => 5208244 [patent_doc_number] => 20070246828 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-25 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/811981 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3812 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20070246828.pdf [firstpage_image] =>[orig_patent_app_number] => 11811981 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/811981
Semiconductor device and method of manufacturing the same Jun 12, 2007 Issued
Array ( [id] => 8329162 [patent_doc_number] => 08237259 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-08-07 [patent_title] => 'Embedded chip package' [patent_app_type] => utility [patent_app_number] => 11/762411 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 19 [patent_no_of_words] => 5355 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11762411 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/762411
Embedded chip package Jun 12, 2007 Issued
Array ( [id] => 112858 [patent_doc_number] => 07719125 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-18 [patent_title] => 'Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips' [patent_app_type] => utility [patent_app_number] => 11/805661 [patent_app_country] => US [patent_app_date] => 2007-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 5425 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/719/07719125.pdf [firstpage_image] =>[orig_patent_app_number] => 11805661 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/805661
Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips May 22, 2007 Issued
Array ( [id] => 170520 [patent_doc_number] => 07662673 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-02-16 [patent_title] => 'Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument' [patent_app_type] => utility [patent_app_number] => 11/752777 [patent_app_country] => US [patent_app_date] => 2007-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 4540 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/662/07662673.pdf [firstpage_image] =>[orig_patent_app_number] => 11752777 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/752777
Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument May 22, 2007 Issued
Array ( [id] => 5044134 [patent_doc_number] => 20070262805 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-15 [patent_title] => 'Start-up circuit and start-up method' [patent_app_type] => utility [patent_app_number] => 11/801167 [patent_app_country] => US [patent_app_date] => 2007-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4433 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0262/20070262805.pdf [firstpage_image] =>[orig_patent_app_number] => 11801167 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/801167
Start-up circuit and start-up method May 8, 2007 Issued
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