
Nitin Parekh
Examiner (ID: 16622, Phone: (571)272-1663 , Office: P/2811 )
| Most Active Art Unit | 2811 |
| Art Unit(s) | 2811 |
| Total Applications | 1977 |
| Issued Applications | 1684 |
| Pending Applications | 30 |
| Abandoned Applications | 273 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18661320
[patent_doc_number] => 20230307333
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-28
[patent_title] => LOW-STRESS PASSIVATION LAYER
[patent_app_type] => utility
[patent_app_number] => 18/329327
[patent_app_country] => US
[patent_app_date] => 2023-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6686
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18329327
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/329327 | Low-stress passivation layer | Jun 4, 2023 | Issued |
Array
(
[id] => 19376593
[patent_doc_number] => 12068173
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-20
[patent_title] => Package structure and manufacturing method thereof
[patent_app_type] => utility
[patent_app_number] => 18/321686
[patent_app_country] => US
[patent_app_date] => 2023-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 20
[patent_no_of_words] => 7209
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18321686
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/321686 | Package structure and manufacturing method thereof | May 21, 2023 | Issued |
Array
(
[id] => 19341436
[patent_doc_number] => 12051633
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-07-30
[patent_title] => Semiconductor device
[patent_app_type] => utility
[patent_app_number] => 18/317699
[patent_app_country] => US
[patent_app_date] => 2023-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 21
[patent_no_of_words] => 11455
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 383
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18317699
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/317699 | Semiconductor device | May 14, 2023 | Issued |
Array
(
[id] => 19108681
[patent_doc_number] => 11961795
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-16
[patent_title] => Semiconductor package and package-on-package including the same
[patent_app_type] => utility
[patent_app_number] => 18/143750
[patent_app_country] => US
[patent_app_date] => 2023-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 28
[patent_no_of_words] => 13955
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 198
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18143750
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/143750 | Semiconductor package and package-on-package including the same | May 4, 2023 | Issued |
Array
(
[id] => 19046726
[patent_doc_number] => 11935846
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-03-19
[patent_title] => Electronic device
[patent_app_type] => utility
[patent_app_number] => 18/310094
[patent_app_country] => US
[patent_app_date] => 2023-05-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 47
[patent_no_of_words] => 12222
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 194
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18310094
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/310094 | Electronic device | Apr 30, 2023 | Issued |
Array
(
[id] => 18669967
[patent_doc_number] => 11776879
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2023-10-03
[patent_title] => Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof
[patent_app_type] => utility
[patent_app_number] => 18/306948
[patent_app_country] => US
[patent_app_date] => 2023-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 8
[patent_no_of_words] => 3296
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 571
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18306948
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/306948 | Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof | Apr 24, 2023 | Issued |
Array
(
[id] => 18570700
[patent_doc_number] => 20230261037
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-17
[patent_title] => PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/306222
[patent_app_country] => US
[patent_app_date] => 2023-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8129
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 45
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18306222
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/306222 | Package | Apr 23, 2023 | Issued |
Array
(
[id] => 19229706
[patent_doc_number] => 12009350
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-11
[patent_title] => Semiconductor package and method of fabricating the same
[patent_app_type] => utility
[patent_app_number] => 18/130760
[patent_app_country] => US
[patent_app_date] => 2023-04-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 43
[patent_figures_cnt] => 43
[patent_no_of_words] => 14573
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18130760
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/130760 | Semiconductor package and method of fabricating the same | Apr 3, 2023 | Issued |
Array
(
[id] => 18555283
[patent_doc_number] => 20230253300
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-10
[patent_title] => CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND METHODS FOR FORMING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/191147
[patent_app_country] => US
[patent_app_date] => 2023-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13643
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18191147
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/191147 | Chip package structure including a silicon substrate interposer and methods for forming the same | Mar 27, 2023 | Issued |
Array
(
[id] => 18735734
[patent_doc_number] => 11804475
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-10-31
[patent_title] => Semiconductor package for thermal dissipation
[patent_app_type] => utility
[patent_app_number] => 18/175189
[patent_app_country] => US
[patent_app_date] => 2023-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 11
[patent_no_of_words] => 8319
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18175189
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/175189 | Semiconductor package for thermal dissipation | Feb 26, 2023 | Issued |
Array
(
[id] => 18500486
[patent_doc_number] => 20230223279
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-07-13
[patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/174576
[patent_app_country] => US
[patent_app_date] => 2023-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4342
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174576
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/174576 | Semiconductor package and method of manufacturing semiconductor package | Feb 23, 2023 | Issued |
Array
(
[id] => 18919125
[patent_doc_number] => 11881413
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-01-23
[patent_title] => Method for manufacturing electronic chips
[patent_app_type] => utility
[patent_app_number] => 18/153929
[patent_app_country] => US
[patent_app_date] => 2023-01-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 37
[patent_no_of_words] => 8681
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 124
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18153929
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/153929 | Method for manufacturing electronic chips | Jan 11, 2023 | Issued |
Array
(
[id] => 19229701
[patent_doc_number] => 12009345
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-06-11
[patent_title] => 3D package structure and methods of forming same
[patent_app_type] => utility
[patent_app_number] => 18/149509
[patent_app_country] => US
[patent_app_date] => 2023-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 34
[patent_figures_cnt] => 34
[patent_no_of_words] => 6519
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 207
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149509
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/149509 | 3D package structure and methods of forming same | Jan 2, 2023 | Issued |
Array
(
[id] => 18337348
[patent_doc_number] => 20230129297
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-04-27
[patent_title] => LEADFRAME WITH GROUND PAD CANTILEVER
[patent_app_type] => utility
[patent_app_number] => 18/087515
[patent_app_country] => US
[patent_app_date] => 2022-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5034
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18087515
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/087515 | Leadframe with ground pad cantilever | Dec 21, 2022 | Issued |
Array
(
[id] => 19900234
[patent_doc_number] => 12278171
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-04-15
[patent_title] => Chip package and method of forming a chip package
[patent_app_type] => utility
[patent_app_number] => 18/084604
[patent_app_country] => US
[patent_app_date] => 2022-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 1081
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18084604
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/084604 | Chip package and method of forming a chip package | Dec 19, 2022 | Issued |
Array
(
[id] => 18935490
[patent_doc_number] => 11887934
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-01-30
[patent_title] => Package structure and fabrication methods
[patent_app_type] => utility
[patent_app_number] => 18/075141
[patent_app_country] => US
[patent_app_date] => 2022-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 72
[patent_no_of_words] => 16460
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 195
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18075141
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/075141 | Package structure and fabrication methods | Dec 4, 2022 | Issued |
Array
(
[id] => 18857193
[patent_doc_number] => 11854784
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2023-12-26
[patent_title] => Chip scale package structure and method of forming the same
[patent_app_type] => utility
[patent_app_number] => 17/989498
[patent_app_country] => US
[patent_app_date] => 2022-11-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 40
[patent_no_of_words] => 11836
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 225
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17989498
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/989498 | Chip scale package structure and method of forming the same | Nov 16, 2022 | Issued |
Array
(
[id] => 18222949
[patent_doc_number] => 20230061943
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-02
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/984195
[patent_app_country] => US
[patent_app_date] => 2022-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7668
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17984195
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/984195 | Semiconductor package | Nov 8, 2022 | Issued |
Array
(
[id] => 18163470
[patent_doc_number] => 20230030063
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-02-02
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/960632
[patent_app_country] => US
[patent_app_date] => 2022-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11455
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -13
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17960632
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/960632 | Semiconductor device | Oct 4, 2022 | Issued |
Array
(
[id] => 19507891
[patent_doc_number] => 12119321
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-10-15
[patent_title] => Semiconductor device and a method of manufacturing thereof
[patent_app_type] => utility
[patent_app_number] => 17/947536
[patent_app_country] => US
[patent_app_date] => 2022-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 14
[patent_no_of_words] => 12172
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 152
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17947536
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/947536 | Semiconductor device and a method of manufacturing thereof | Sep 18, 2022 | Issued |