Search

Nitin Parekh

Examiner (ID: 16622, Phone: (571)272-1663 , Office: P/2811 )

Most Active Art Unit
2811
Art Unit(s)
2811
Total Applications
1977
Issued Applications
1684
Pending Applications
30
Abandoned Applications
273

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18661320 [patent_doc_number] => 20230307333 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => LOW-STRESS PASSIVATION LAYER [patent_app_type] => utility [patent_app_number] => 18/329327 [patent_app_country] => US [patent_app_date] => 2023-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6686 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18329327 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/329327
Low-stress passivation layer Jun 4, 2023 Issued
Array ( [id] => 19376593 [patent_doc_number] => 12068173 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-20 [patent_title] => Package structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/321686 [patent_app_country] => US [patent_app_date] => 2023-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 20 [patent_no_of_words] => 7209 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18321686 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/321686
Package structure and manufacturing method thereof May 21, 2023 Issued
Array ( [id] => 19341436 [patent_doc_number] => 12051633 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-30 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/317699 [patent_app_country] => US [patent_app_date] => 2023-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 21 [patent_no_of_words] => 11455 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 383 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18317699 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/317699
Semiconductor device May 14, 2023 Issued
Array ( [id] => 19108681 [patent_doc_number] => 11961795 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-16 [patent_title] => Semiconductor package and package-on-package including the same [patent_app_type] => utility [patent_app_number] => 18/143750 [patent_app_country] => US [patent_app_date] => 2023-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 28 [patent_no_of_words] => 13955 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 198 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18143750 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/143750
Semiconductor package and package-on-package including the same May 4, 2023 Issued
Array ( [id] => 19046726 [patent_doc_number] => 11935846 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Electronic device [patent_app_type] => utility [patent_app_number] => 18/310094 [patent_app_country] => US [patent_app_date] => 2023-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 47 [patent_no_of_words] => 12222 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18310094 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/310094
Electronic device Apr 30, 2023 Issued
Array ( [id] => 18669967 [patent_doc_number] => 11776879 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2023-10-03 [patent_title] => Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof [patent_app_type] => utility [patent_app_number] => 18/306948 [patent_app_country] => US [patent_app_date] => 2023-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 3296 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 571 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18306948 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/306948
Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof Apr 24, 2023 Issued
Array ( [id] => 18570700 [patent_doc_number] => 20230261037 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => PACKAGE [patent_app_type] => utility [patent_app_number] => 18/306222 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8129 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18306222 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/306222
Package Apr 23, 2023 Issued
Array ( [id] => 19229706 [patent_doc_number] => 12009350 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 18/130760 [patent_app_country] => US [patent_app_date] => 2023-04-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 43 [patent_no_of_words] => 14573 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18130760 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/130760
Semiconductor package and method of fabricating the same Apr 3, 2023 Issued
Array ( [id] => 18555283 [patent_doc_number] => 20230253300 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND METHODS FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/191147 [patent_app_country] => US [patent_app_date] => 2023-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13643 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18191147 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/191147
Chip package structure including a silicon substrate interposer and methods for forming the same Mar 27, 2023 Issued
Array ( [id] => 18735734 [patent_doc_number] => 11804475 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-31 [patent_title] => Semiconductor package for thermal dissipation [patent_app_type] => utility [patent_app_number] => 18/175189 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 8319 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18175189 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/175189
Semiconductor package for thermal dissipation Feb 26, 2023 Issued
Array ( [id] => 18500486 [patent_doc_number] => 20230223279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-13 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/174576 [patent_app_country] => US [patent_app_date] => 2023-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4342 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174576 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/174576
Semiconductor package and method of manufacturing semiconductor package Feb 23, 2023 Issued
Array ( [id] => 18919125 [patent_doc_number] => 11881413 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-23 [patent_title] => Method for manufacturing electronic chips [patent_app_type] => utility [patent_app_number] => 18/153929 [patent_app_country] => US [patent_app_date] => 2023-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 37 [patent_no_of_words] => 8681 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18153929 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/153929
Method for manufacturing electronic chips Jan 11, 2023 Issued
Array ( [id] => 19229701 [patent_doc_number] => 12009345 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => 3D package structure and methods of forming same [patent_app_type] => utility [patent_app_number] => 18/149509 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 34 [patent_no_of_words] => 6519 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149509 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/149509
3D package structure and methods of forming same Jan 2, 2023 Issued
Array ( [id] => 18337348 [patent_doc_number] => 20230129297 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => LEADFRAME WITH GROUND PAD CANTILEVER [patent_app_type] => utility [patent_app_number] => 18/087515 [patent_app_country] => US [patent_app_date] => 2022-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5034 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18087515 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/087515
Leadframe with ground pad cantilever Dec 21, 2022 Issued
Array ( [id] => 19900234 [patent_doc_number] => 12278171 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Chip package and method of forming a chip package [patent_app_type] => utility [patent_app_number] => 18/084604 [patent_app_country] => US [patent_app_date] => 2022-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 1081 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18084604 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/084604
Chip package and method of forming a chip package Dec 19, 2022 Issued
Array ( [id] => 18935490 [patent_doc_number] => 11887934 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-30 [patent_title] => Package structure and fabrication methods [patent_app_type] => utility [patent_app_number] => 18/075141 [patent_app_country] => US [patent_app_date] => 2022-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 72 [patent_no_of_words] => 16460 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18075141 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/075141
Package structure and fabrication methods Dec 4, 2022 Issued
Array ( [id] => 18857193 [patent_doc_number] => 11854784 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Chip scale package structure and method of forming the same [patent_app_type] => utility [patent_app_number] => 17/989498 [patent_app_country] => US [patent_app_date] => 2022-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 40 [patent_no_of_words] => 11836 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 225 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17989498 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/989498
Chip scale package structure and method of forming the same Nov 16, 2022 Issued
Array ( [id] => 18222949 [patent_doc_number] => 20230061943 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-02 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/984195 [patent_app_country] => US [patent_app_date] => 2022-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7668 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17984195 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/984195
Semiconductor package Nov 8, 2022 Issued
Array ( [id] => 18163470 [patent_doc_number] => 20230030063 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-02 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/960632 [patent_app_country] => US [patent_app_date] => 2022-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11455 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17960632 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/960632
Semiconductor device Oct 4, 2022 Issued
Array ( [id] => 19507891 [patent_doc_number] => 12119321 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-15 [patent_title] => Semiconductor device and a method of manufacturing thereof [patent_app_type] => utility [patent_app_number] => 17/947536 [patent_app_country] => US [patent_app_date] => 2022-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 12172 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17947536 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/947536
Semiconductor device and a method of manufacturing thereof Sep 18, 2022 Issued
Menu