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Nova M. Chapman

Examiner (ID: 7572)

Most Active Art Unit
3928
Art Unit(s)
3928
Total Applications
504
Issued Applications
0
Pending Applications
504
Abandoned Applications
0

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18757521 [patent_doc_number] => 20230360984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => Semiconductor Package Comprising Structures Configured to Withstand a Change of the Volume of a Potting Compound [patent_app_type] => utility [patent_app_number] => 18/142106 [patent_app_country] => US [patent_app_date] => 2023-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4050 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18142106 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/142106
Semiconductor Package Comprising Structures Configured to Withstand a Change of the Volume of a Potting Compound May 1, 2023 Pending
Array ( [id] => 19546422 [patent_doc_number] => 20240363458 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES [patent_app_type] => utility [patent_app_number] => 18/309408 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5798 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18309408 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/309408
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES Apr 27, 2023 Pending
Array ( [id] => 18757465 [patent_doc_number] => 20230360927 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND SYSTEM [patent_app_type] => utility [patent_app_number] => 18/140375 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3509 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18140375 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/140375
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND SYSTEM Apr 26, 2023 Pending
Array ( [id] => 19023132 [patent_doc_number] => 20240079303 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METHODS FOR MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/303663 [patent_app_country] => US [patent_app_date] => 2023-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8861 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18303663 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/303663
SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METHODS FOR MAKING THE SAME Apr 19, 2023 Pending
Array ( [id] => 19071200 [patent_doc_number] => 20240105626 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => Semiconductor Package with Local Interconnect and Chiplet Integration [patent_app_type] => utility [patent_app_number] => 18/296587 [patent_app_country] => US [patent_app_date] => 2023-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5642 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18296587 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/296587
Semiconductor Package with Local Interconnect and Chiplet Integration Apr 5, 2023 Pending
Array ( [id] => 18729375 [patent_doc_number] => 20230343671 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-26 [patent_title] => CERAMIC SUBSTRATE AND CERAMIC DIVIDED SUBSTRATE [patent_app_type] => utility [patent_app_number] => 18/126844 [patent_app_country] => US [patent_app_date] => 2023-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4419 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18126844 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/126844
CERAMIC SUBSTRATE AND CERAMIC DIVIDED SUBSTRATE Mar 26, 2023 Pending
Array ( [id] => 19007875 [patent_doc_number] => 20240071946 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => Electromagnetic Interference Shield with Thermal Conductivity [patent_app_type] => utility [patent_app_number] => 18/169662 [patent_app_country] => US [patent_app_date] => 2023-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6703 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169662 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169662
Electromagnetic Interference Shield with Thermal Conductivity Feb 14, 2023 Pending
Array ( [id] => 19384646 [patent_doc_number] => 20240274516 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => INTERPOSER WITH SOLDER RESIST POSTS [patent_app_type] => utility [patent_app_number] => 18/168420 [patent_app_country] => US [patent_app_date] => 2023-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7825 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -28 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18168420 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/168420
INTERPOSER WITH SOLDER RESIST POSTS Feb 12, 2023 Pending
Array ( [id] => 18570534 [patent_doc_number] => 20230260871 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => Three-Dimensional Device Package with Vertical Heat Pipes [patent_app_type] => utility [patent_app_number] => 18/167912 [patent_app_country] => US [patent_app_date] => 2023-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8495 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18167912 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/167912
Three-Dimensional Device Package with Vertical Heat Pipes Feb 12, 2023 Pending
Array ( [id] => 18540839 [patent_doc_number] => 20230245950 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES [patent_app_type] => utility [patent_app_number] => 18/160979 [patent_app_country] => US [patent_app_date] => 2023-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7759 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18160979 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/160979
HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES Jan 26, 2023 Pending
Array ( [id] => 18533253 [patent_doc_number] => 20230238329 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-27 [patent_title] => INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/158233 [patent_app_country] => US [patent_app_date] => 2023-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7416 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18158233 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/158233
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME Jan 22, 2023 Pending
Array ( [id] => 18379759 [patent_doc_number] => 20230154848 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/093497 [patent_app_country] => US [patent_app_date] => 2023-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3566 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18093497 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/093497
SEMICONDUCTOR STRUCTURE Jan 4, 2023 Pending
Array ( [id] => 18743423 [patent_doc_number] => 20230352411 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-02 [patent_title] => SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/090856 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7421 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18090856 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/090856
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME Dec 28, 2022 Pending
Array ( [id] => 18473114 [patent_doc_number] => 20230207402 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => DIRECTLY BONDED FRAME WAFERS [patent_app_type] => utility [patent_app_number] => 18/146326 [patent_app_country] => US [patent_app_date] => 2022-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14760 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18146326 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/146326
DIRECTLY BONDED FRAME WAFERS Dec 22, 2022 Pending
Array ( [id] => 19252815 [patent_doc_number] => 20240203812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-20 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/067375 [patent_app_country] => US [patent_app_date] => 2022-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 19473 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 413 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18067375 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/067375
SEMICONDUCTOR DEVICE Dec 15, 2022 Pending
Array ( [id] => 19760205 [patent_doc_number] => 20250048770 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-06 [patent_title] => PHOTOVOLTAIC CELL ELEMENT, PHOTOVOLTAIC CELL AND METHODS FOR MANUFACTURING SUCH ELEMENT AND CELL [patent_app_type] => utility [patent_app_number] => 18/719589 [patent_app_country] => US [patent_app_date] => 2022-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4317 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18719589 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/719589
PHOTOVOLTAIC CELL ELEMENT, PHOTOVOLTAIC CELL AND METHODS FOR MANUFACTURING SUCH ELEMENT AND CELL Dec 5, 2022 Pending
Array ( [id] => 18514639 [patent_doc_number] => 20230230899 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-20 [patent_title] => SEMICONDUCTOR APPARATUS [patent_app_type] => utility [patent_app_number] => 18/070943 [patent_app_country] => US [patent_app_date] => 2022-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9272 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18070943 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/070943
SEMICONDUCTOR APPARATUS Nov 28, 2022 Pending
Array ( [id] => 18409086 [patent_doc_number] => 20230170439 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-01 [patent_title] => LIGHT-EMITTING DEVICE [patent_app_type] => utility [patent_app_number] => 17/985607 [patent_app_country] => US [patent_app_date] => 2022-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7287 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17985607 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/985607
LIGHT-EMITTING DEVICE Nov 10, 2022 Pending
Array ( [id] => 19116581 [patent_doc_number] => 20240128331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-18 [patent_title] => BOTTOM ENHANCED LINER-LESS VIA CONTACT FOR REDUCED MOL RESISTANCE [patent_app_type] => utility [patent_app_number] => 17/965254 [patent_app_country] => US [patent_app_date] => 2022-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6582 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17965254 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/965254
BOTTOM ENHANCED LINER-LESS VIA CONTACT FOR REDUCED MOL RESISTANCE Oct 12, 2022 Pending
Array ( [id] => 18655246 [patent_doc_number] => 20230301097 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => SEMICONDUCTOR MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 17/949485 [patent_app_country] => US [patent_app_date] => 2022-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10126 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 325 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17949485 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/949485
SEMICONDUCTOR MEMORY DEVICE Sep 20, 2022 Pending
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