Search

Omar F. Mojaddedi

Examiner (ID: 14818, Phone: (313)446-6582 , Office: P/2898 )

Most Active Art Unit
2898
Art Unit(s)
2898, 2811
Total Applications
737
Issued Applications
595
Pending Applications
128
Abandoned Applications
54

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18929438 [patent_doc_number] => 20240032442 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => Spin-Orbit Torque Device Array and Method of Manufacturing Spin-Orbit Torque Device Array [patent_app_type] => utility [patent_app_number] => 18/153507 [patent_app_country] => US [patent_app_date] => 2023-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3267 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18153507 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/153507
Spin-orbit torque device array and method of manufacturing spin-orbit torque device array Jan 11, 2023 Issued
Array ( [id] => 18812781 [patent_doc_number] => 20230387118 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-30 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/094452 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13472 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18094452 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/094452
SEMICONDUCTOR DEVICE Jan 8, 2023 Pending
Array ( [id] => 19086358 [patent_doc_number] => 20240113159 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-04 [patent_title] => SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION [patent_app_type] => utility [patent_app_number] => 18/151059 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15649 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151059 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151059
Semiconductor die package and methods of formation Jan 5, 2023 Issued
Array ( [id] => 19523999 [patent_doc_number] => 12125739 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-22 [patent_title] => RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation [patent_app_type] => utility [patent_app_number] => 18/151235 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 7448 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151235 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151235
RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation Jan 5, 2023 Issued
Array ( [id] => 18498644 [patent_doc_number] => 20230221356 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-13 [patent_title] => CURRENT SENSE CIRCUIT HAVING A TEMPERATURE COMPENSATED RESPONSE [patent_app_type] => utility [patent_app_number] => 18/149331 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4336 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149331 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/149331
CURRENT SENSE CIRCUIT HAVING A TEMPERATURE COMPENSATED RESPONSE Jan 2, 2023 Abandoned
Array ( [id] => 18359890 [patent_doc_number] => 20230141481 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/149182 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7405 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 227 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149182 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/149182
Method of forming semiconductor structure and semiconductor structure Jan 2, 2023 Issued
Array ( [id] => 19285730 [patent_doc_number] => 20240222207 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => PACKAGE SUBSTRATE HAVING DEPRESSION [patent_app_type] => utility [patent_app_number] => 18/091349 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5574 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18091349 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/091349
PACKAGE SUBSTRATE HAVING DEPRESSION Dec 28, 2022 Pending
Array ( [id] => 18507653 [patent_doc_number] => 11705482 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-18 [patent_title] => Metal-insulator-metal capacitors [patent_app_type] => utility [patent_app_number] => 18/088437 [patent_app_country] => US [patent_app_date] => 2022-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 12044 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18088437 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/088437
Metal-insulator-metal capacitors Dec 22, 2022 Issued
Array ( [id] => 19269435 [patent_doc_number] => 20240213139 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => Backside Deep Trench Capacitor and Inductor Structures [patent_app_type] => utility [patent_app_number] => 18/087484 [patent_app_country] => US [patent_app_date] => 2022-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6658 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18087484 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/087484
Backside Deep Trench Capacitor and Inductor Structures Dec 21, 2022 Pending
Array ( [id] => 20455965 [patent_doc_number] => 12519027 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-06 [patent_title] => Embedded die packaging of power semiconductor devices [patent_app_type] => utility [patent_app_number] => 18/085660 [patent_app_country] => US [patent_app_date] => 2022-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 37 [patent_no_of_words] => 3397 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18085660 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/085660
Embedded die packaging of power semiconductor devices Dec 20, 2022 Issued
Array ( [id] => 19252823 [patent_doc_number] => 20240203820 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-20 [patent_title] => PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT [patent_app_type] => utility [patent_app_number] => 18/085284 [patent_app_country] => US [patent_app_date] => 2022-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9479 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18085284 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/085284
PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT Dec 19, 2022 Pending
Array ( [id] => 18488447 [patent_doc_number] => 20230215795 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-06 [patent_title] => MECHANICALLY REINFORCED ELECTRICAL PACKAGES [patent_app_type] => utility [patent_app_number] => 18/068267 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10313 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18068267 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/068267
MECHANICALLY REINFORCED ELECTRICAL PACKAGES Dec 18, 2022 Pending
Array ( [id] => 18326701 [patent_doc_number] => 20230124829 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/083894 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7265 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18083894 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/083894
Semiconductor device Dec 18, 2022 Issued
Array ( [id] => 18488448 [patent_doc_number] => 20230215796 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-06 [patent_title] => ELECTRICAL PACKAGES WITH ELONGATED INTERCONNECT MEMBERS [patent_app_type] => utility [patent_app_number] => 18/068343 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10303 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18068343 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/068343
ELECTRICAL PACKAGES WITH ELONGATED INTERCONNECT MEMBERS Dec 18, 2022 Pending
Array ( [id] => 19183868 [patent_doc_number] => 11990469 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Trimmable resistor circuit and method for operating the trimmable resistor circuit [patent_app_type] => utility [patent_app_number] => 18/066690 [patent_app_country] => US [patent_app_date] => 2022-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9582 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18066690 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/066690
Trimmable resistor circuit and method for operating the trimmable resistor circuit Dec 14, 2022 Issued
Array ( [id] => 20469554 [patent_doc_number] => 12525597 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-13 [patent_title] => Semiconductor composite device and method for manufacturing semiconductor composite device [patent_app_type] => utility [patent_app_number] => 18/064558 [patent_app_country] => US [patent_app_date] => 2022-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 53 [patent_no_of_words] => 11737 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18064558 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/064558
Semiconductor composite device and method for manufacturing semiconductor composite device Dec 11, 2022 Issued
Array ( [id] => 18281703 [patent_doc_number] => 20230097175 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => SEMICONDUCTOR STRUCTURE WITH CAPACITOR LANDING PAD AND METHOD OF MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/076419 [patent_app_country] => US [patent_app_date] => 2022-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4799 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18076419 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/076419
Semiconductor structure with capacitor landing pad and method of making the same Dec 6, 2022 Issued
Array ( [id] => 18528752 [patent_doc_number] => 11715757 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-01 [patent_title] => Three-dimensional metal-insulator-metal (MIM) capacitor [patent_app_type] => utility [patent_app_number] => 18/074617 [patent_app_country] => US [patent_app_date] => 2022-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 23 [patent_no_of_words] => 5651 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18074617 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/074617
Three-dimensional metal-insulator-metal (MIM) capacitor Dec 4, 2022 Issued
Array ( [id] => 19023225 [patent_doc_number] => 20240079396 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => PACKAGE STRUCTURE USING SEMICONDUCTOR CHIP TO SEPARATE DIFFERENT POTENTIALS [patent_app_type] => utility [patent_app_number] => 18/060086 [patent_app_country] => US [patent_app_date] => 2022-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5485 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18060086 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/060086
PACKAGE STRUCTURE USING SEMICONDUCTOR CHIP TO SEPARATE DIFFERENT POTENTIALS Nov 29, 2022 Pending
Array ( [id] => 19206205 [patent_doc_number] => 20240178104 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => LEADFRAME BASED POWER MODULE [patent_app_type] => utility [patent_app_number] => 18/070530 [patent_app_country] => US [patent_app_date] => 2022-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2847 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18070530 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/070530
LEADFRAME BASED POWER MODULE Nov 28, 2022 Pending
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