Search

Pamela E. Perkins

Examiner (ID: 12468, Phone: (571)272-1840 , Office: P/2822 )

Most Active Art Unit
2822
Art Unit(s)
2822
Total Applications
888
Issued Applications
738
Pending Applications
17
Abandoned Applications
134

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4443773 [patent_doc_number] => 07928571 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-19 [patent_title] => 'Device having dual etch stop liner and reformed silicide layer and related methods' [patent_app_type] => utility [patent_app_number] => 11/850968 [patent_app_country] => US [patent_app_date] => 2007-09-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 1761 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/928/07928571.pdf [firstpage_image] =>[orig_patent_app_number] => 11850968 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/850968
Device having dual etch stop liner and reformed silicide layer and related methods Sep 5, 2007 Issued
Array ( [id] => 4768805 [patent_doc_number] => 20080054461 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-06 [patent_title] => 'RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/847512 [patent_app_country] => US [patent_app_date] => 2007-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2840 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20080054461.pdf [firstpage_image] =>[orig_patent_app_number] => 11847512 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/847512
RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE Aug 29, 2007 Abandoned
Array ( [id] => 7515797 [patent_doc_number] => 08039869 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-18 [patent_title] => 'Gallium nitride device substrate containing a lattice parameter altering element' [patent_app_type] => utility [patent_app_number] => 11/838467 [patent_app_country] => US [patent_app_date] => 2007-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3726 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/039/08039869.pdf [firstpage_image] =>[orig_patent_app_number] => 11838467 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/838467
Gallium nitride device substrate containing a lattice parameter altering element Aug 13, 2007 Issued
Array ( [id] => 3992 [patent_doc_number] => 07816156 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-19 [patent_title] => 'Light emitting diode package and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/882167 [patent_app_country] => US [patent_app_date] => 2007-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 12 [patent_no_of_words] => 4388 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/816/07816156.pdf [firstpage_image] =>[orig_patent_app_number] => 11882167 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/882167
Light emitting diode package and fabrication method thereof Jul 30, 2007 Issued
Array ( [id] => 33252 [patent_doc_number] => 07785999 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-31 [patent_title] => 'Formation of fully silicided metal gate using dual self-aligned silicide process' [patent_app_type] => utility [patent_app_number] => 11/830277 [patent_app_country] => US [patent_app_date] => 2007-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 5977 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/785/07785999.pdf [firstpage_image] =>[orig_patent_app_number] => 11830277 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/830277
Formation of fully silicided metal gate using dual self-aligned silicide process Jul 29, 2007 Issued
Array ( [id] => 4624716 [patent_doc_number] => 08004017 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-23 [patent_title] => 'Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method' [patent_app_type] => utility [patent_app_number] => 11/880698 [patent_app_country] => US [patent_app_date] => 2007-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 8116 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/004/08004017.pdf [firstpage_image] =>[orig_patent_app_number] => 11880698 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/880698
Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method Jul 23, 2007 Issued
Array ( [id] => 8029243 [patent_doc_number] => 08143706 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-03-27 [patent_title] => 'Method of forming a component having dielectric sub-layers' [patent_app_type] => utility [patent_app_number] => 11/778201 [patent_app_country] => US [patent_app_date] => 2007-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 7289 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/143/08143706.pdf [firstpage_image] =>[orig_patent_app_number] => 11778201 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/778201
Method of forming a component having dielectric sub-layers Jul 15, 2007 Issued
Array ( [id] => 4657704 [patent_doc_number] => 20080026565 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'Method of manufacturing a composite of copper and resin' [patent_app_type] => utility [patent_app_number] => 11/827687 [patent_app_country] => US [patent_app_date] => 2007-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3004 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0026/20080026565.pdf [firstpage_image] =>[orig_patent_app_number] => 11827687 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/827687
Method of manufacturing a composite of copper and resin Jul 12, 2007 Issued
Array ( [id] => 4612992 [patent_doc_number] => 07989345 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-02 [patent_title] => 'Methods of forming blind wafer interconnects, and related structures and assemblies' [patent_app_type] => utility [patent_app_number] => 11/776137 [patent_app_country] => US [patent_app_date] => 2007-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 34 [patent_no_of_words] => 11283 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/989/07989345.pdf [firstpage_image] =>[orig_patent_app_number] => 11776137 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/776137
Methods of forming blind wafer interconnects, and related structures and assemblies Jul 10, 2007 Issued
Array ( [id] => 7751396 [patent_doc_number] => 08110442 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-07 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/819027 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 37 [patent_no_of_words] => 15118 [patent_no_of_claims] => 57 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/110/08110442.pdf [firstpage_image] =>[orig_patent_app_number] => 11819027 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/819027
Method of manufacturing semiconductor device Jun 24, 2007 Issued
Array ( [id] => 8920813 [patent_doc_number] => 08486745 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-16 [patent_title] => 'Multi-terminal phase change devices' [patent_app_type] => utility [patent_app_number] => 11/811077 [patent_app_country] => US [patent_app_date] => 2007-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 56 [patent_no_of_words] => 5803 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11811077 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/811077
Multi-terminal phase change devices Jun 6, 2007 Issued
Array ( [id] => 82835 [patent_doc_number] => 07745904 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-06-29 [patent_title] => 'Shallow trench isolation structure for semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/809519 [patent_app_country] => US [patent_app_date] => 2007-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 2950 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/745/07745904.pdf [firstpage_image] =>[orig_patent_app_number] => 11809519 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/809519
Shallow trench isolation structure for semiconductor device May 30, 2007 Issued
Array ( [id] => 4583277 [patent_doc_number] => 07851381 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-14 [patent_title] => 'Surface treatment method for nitride crystal, nitride crystal substrate, nitride crystal substrate with epitaxial layer and semiconductor device, and method of manufacturing nitride crystal substrate with epitaxial layer and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/806317 [patent_app_country] => US [patent_app_date] => 2007-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 13817 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/851/07851381.pdf [firstpage_image] =>[orig_patent_app_number] => 11806317 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/806317
Surface treatment method for nitride crystal, nitride crystal substrate, nitride crystal substrate with epitaxial layer and semiconductor device, and method of manufacturing nitride crystal substrate with epitaxial layer and semiconductor device May 30, 2007 Issued
Array ( [id] => 4792230 [patent_doc_number] => 20080293204 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-27 [patent_title] => 'Shallow junction formation and high dopant activation rate of MOS devices' [patent_app_type] => utility [patent_app_number] => 11/804927 [patent_app_country] => US [patent_app_date] => 2007-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2360 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0293/20080293204.pdf [firstpage_image] =>[orig_patent_app_number] => 11804927 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/804927
Shallow junction formation and high dopant activation rate of MOS devices May 20, 2007 Issued
Array ( [id] => 7597676 [patent_doc_number] => 07618901 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-11-17 [patent_title] => 'Process for growing a dielectric layer on a silicon-containing surface using a mixture of N2O and O3' [patent_app_type] => utility [patent_app_number] => 11/744458 [patent_app_country] => US [patent_app_date] => 2007-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1820 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/618/07618901.pdf [firstpage_image] =>[orig_patent_app_number] => 11744458 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/744458
Process for growing a dielectric layer on a silicon-containing surface using a mixture of N2O and O3 May 3, 2007 Issued
Array ( [id] => 7503307 [patent_doc_number] => 08034683 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-10-11 [patent_title] => 'Method of forming a phase change material layer, method of forming a phase change memory device using the same, and a phase change memory device so formed' [patent_app_type] => utility [patent_app_number] => 11/785807 [patent_app_country] => US [patent_app_date] => 2007-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 9392 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/034/08034683.pdf [firstpage_image] =>[orig_patent_app_number] => 11785807 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/785807
Method of forming a phase change material layer, method of forming a phase change memory device using the same, and a phase change memory device so formed Apr 19, 2007 Issued
Array ( [id] => 5098671 [patent_doc_number] => 20070181931 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-09 [patent_title] => 'HAFNIUM TANTALUM OXIDE DIELECTRICS' [patent_app_type] => utility [patent_app_number] => 11/735247 [patent_app_country] => US [patent_app_date] => 2007-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 10286 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0181/20070181931.pdf [firstpage_image] =>[orig_patent_app_number] => 11735247 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/735247
Hafnium tantalum oxide dielectrics Apr 12, 2007 Issued
Array ( [id] => 8164350 [patent_doc_number] => 08173537 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2012-05-08 [patent_title] => 'Methods for reducing UV and dielectric diffusion barrier interaction' [patent_app_type] => utility [patent_app_number] => 11/693617 [patent_app_country] => US [patent_app_date] => 2007-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 9555 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 38 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/173/08173537.pdf [firstpage_image] =>[orig_patent_app_number] => 11693617 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/693617
Methods for reducing UV and dielectric diffusion barrier interaction Mar 28, 2007 Issued
Array ( [id] => 4495680 [patent_doc_number] => 07947565 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-24 [patent_title] => 'Forming method of porous low-k layer and interconnect process' [patent_app_type] => utility [patent_app_number] => 11/672307 [patent_app_country] => US [patent_app_date] => 2007-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4499 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/947/07947565.pdf [firstpage_image] =>[orig_patent_app_number] => 11672307 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/672307
Forming method of porous low-k layer and interconnect process Feb 6, 2007 Issued
Array ( [id] => 5236613 [patent_doc_number] => 20070128770 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-07 [patent_title] => 'MICROELECTRONIC COMPONENT ASSEMBLIES HAVING LEAD FRAMES ADAPTED TO REDUCE PACKAGE BOW' [patent_app_type] => utility [patent_app_number] => 11/672297 [patent_app_country] => US [patent_app_date] => 2007-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7559 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20070128770.pdf [firstpage_image] =>[orig_patent_app_number] => 11672297 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/672297
Microelectronic component assemblies having lead frames adapted to reduce package bow Feb 6, 2007 Issued
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