
Pamela E. Perkins
Examiner (ID: 12468, Phone: (571)272-1840 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822 |
| Total Applications | 888 |
| Issued Applications | 738 |
| Pending Applications | 17 |
| Abandoned Applications | 134 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4443773
[patent_doc_number] => 07928571
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[patent_issue_date] => 2011-04-19
[patent_title] => 'Device having dual etch stop liner and reformed silicide layer and related methods'
[patent_app_type] => utility
[patent_app_number] => 11/850968
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/850968 | Device having dual etch stop liner and reformed silicide layer and related methods | Sep 5, 2007 | Issued |
Array
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[patent_title] => 'RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/847512
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Array
(
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[patent_issue_date] => 2011-10-18
[patent_title] => 'Gallium nitride device substrate containing a lattice parameter altering element'
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Array
(
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[patent_issue_date] => 2010-10-19
[patent_title] => 'Light emitting diode package and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/882167
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Array
(
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[patent_title] => 'Formation of fully silicided metal gate using dual self-aligned silicide process'
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/778201 | Method of forming a component having dielectric sub-layers | Jul 15, 2007 | Issued |
Array
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[patent_title] => 'Method of manufacturing a composite of copper and resin'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/776137 | Methods of forming blind wafer interconnects, and related structures and assemblies | Jul 10, 2007 | Issued |
Array
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Array
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Array
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Array
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Array
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