
Pamela E. Perkins
Examiner (ID: 8226, Phone: (571)272-1840 , Office: P/2822 )
| Most Active Art Unit | 2822 |
| Art Unit(s) | 2822 |
| Total Applications | 888 |
| Issued Applications | 738 |
| Pending Applications | 17 |
| Abandoned Applications | 134 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10277201
[patent_doc_number] => 20150162198
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-06-11
[patent_title] => 'SEMICONDUCTOR DEVICE HAVING A DOUBLE DEEP WELL AND METHOD OF MANUFACTURING SAME'
[patent_app_type] => utility
[patent_app_number] => 14/626259
[patent_app_country] => US
[patent_app_date] => 2015-02-19
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/626259 | Semiconductor device having a double deep well and method of manufacturing same | Feb 18, 2015 | Issued |
Array
(
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[patent_kind] => A1
[patent_issue_date] => 2015-06-11
[patent_title] => 'SEMICONDUCTOR CHIP WITH POWER GATING THROUGH SILICON VIAS'
[patent_app_type] => utility
[patent_app_number] => 14/618106
[patent_app_country] => US
[patent_app_date] => 2015-02-10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/618106 | Semiconductor chip with power gating through silicon vias | Feb 9, 2015 | Issued |
Array
(
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[patent_title] => 'Device isolation in FinFET CMOS'
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Array
(
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[patent_issue_date] => 2017-01-03
[patent_title] => 'Wafer-level die attach metallization'
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[patent_app_number] => 14/591566
[patent_app_country] => US
[patent_app_date] => 2015-01-07
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Array
(
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[patent_title] => 'Epitaxial formation mechanisms of source and drain regions'
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Array
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[patent_title] => 'SPALLING METHODS TO FORM MULTI-JUNCTION PHOTOVOLTAIC STRUCTURE'
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Array
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[patent_title] => 'Method of fabricating low CTE interposer without TSV structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/524280 | Method of fabricating low CTE interposer without TSV structure | Oct 26, 2014 | Issued |
Array
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[patent_title] => 'Bottom recess process for an outer blocking dielectric layer inside a memory opening'
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Array
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[patent_title] => 'Manufacturing Method of an Array Substrate'
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Array
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[patent_title] => 'Early Bit Line Air Gap Formation'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/520117 | Early bit line air gap formation | Oct 20, 2014 | Issued |
Array
(
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[patent_title] => 'SOLID STATE IMAGING DEVICE AND METHOD OF FABRICATING THE SAME'
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Array
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Array
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/517387 | Various stress free sensor packages using wafer level supporting die and air gap technique | Oct 16, 2014 | Issued |
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