Search

Paras D. Shah

Examiner (ID: 9016, Phone: (571)270-1650 , Office: P/2659 )

Most Active Art Unit
2659
Art Unit(s)
2653, 2626, 2659
Total Applications
738
Issued Applications
515
Pending Applications
27
Abandoned Applications
203

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19384715 [patent_doc_number] => 20240274585 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING [patent_app_type] => utility [patent_app_number] => 18/330074 [patent_app_country] => US [patent_app_date] => 2023-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 26788 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18330074 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/330074
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING Jun 5, 2023 Pending
Array ( [id] => 18821229 [patent_doc_number] => 20230395570 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS [patent_app_type] => utility [patent_app_number] => 18/205916 [patent_app_country] => US [patent_app_date] => 2023-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9945 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18205916 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/205916
Thermal management of three-dimensional integrated circuits Jun 4, 2023 Issued
Array ( [id] => 19627143 [patent_doc_number] => 12165992 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-10 [patent_title] => Package structure and fabricating method thereof [patent_app_type] => utility [patent_app_number] => 18/327076 [patent_app_country] => US [patent_app_date] => 2023-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 15 [patent_no_of_words] => 7285 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18327076 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/327076
Package structure and fabricating method thereof May 31, 2023 Issued
Array ( [id] => 18653133 [patent_doc_number] => 20230298973 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/325104 [patent_app_country] => US [patent_app_date] => 2023-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10099 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18325104 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/325104
Package and manufacturing method thereof May 28, 2023 Issued
Array ( [id] => 19589809 [patent_doc_number] => 20240387366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE [patent_app_type] => utility [patent_app_number] => 18/317462 [patent_app_country] => US [patent_app_date] => 2023-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 17639 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18317462 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/317462
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE May 14, 2023 Pending
Array ( [id] => 19370575 [patent_doc_number] => 12062669 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-13 [patent_title] => SLT integrated circuit capacitor structure and methods [patent_app_type] => utility [patent_app_number] => 18/313826 [patent_app_country] => US [patent_app_date] => 2023-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7373 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313826 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/313826
SLT integrated circuit capacitor structure and methods May 7, 2023 Issued
Array ( [id] => 18600198 [patent_doc_number] => 20230274999 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => Semiconductor Device and Method of Manufacture [patent_app_type] => utility [patent_app_number] => 18/312877 [patent_app_country] => US [patent_app_date] => 2023-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8490 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18312877 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/312877
Semiconductor device and method of manufacture May 4, 2023 Issued
Array ( [id] => 18600224 [patent_doc_number] => 20230275025 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof [patent_app_type] => utility [patent_app_number] => 18/313012 [patent_app_country] => US [patent_app_date] => 2023-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9280 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313012 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/313012
Method of forming an interconnect structure having an air gap and structure thereof May 4, 2023 Issued
Array ( [id] => 19906534 [patent_doc_number] => 12283553 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-22 [patent_title] => Semiconductor die with warpage release layer structure in package and fabricating method thereof [patent_app_type] => utility [patent_app_number] => 18/311434 [patent_app_country] => US [patent_app_date] => 2023-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 28 [patent_no_of_words] => 5256 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18311434 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/311434
Semiconductor die with warpage release layer structure in package and fabricating method thereof May 2, 2023 Issued
Array ( [id] => 18586056 [patent_doc_number] => 20230268321 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS [patent_app_type] => utility [patent_app_number] => 18/141415 [patent_app_country] => US [patent_app_date] => 2023-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 25562 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18141415 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/141415
3D semiconductor device and structure with metal layers Apr 28, 2023 Issued
Array ( [id] => 19116485 [patent_doc_number] => 20240128235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-18 [patent_title] => ELECTRONIC CIRCUIT FABRICATION [patent_app_type] => utility [patent_app_number] => 18/308885 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8185 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308885 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/308885
ELECTRONIC CIRCUIT FABRICATION Apr 27, 2023 Pending
Array ( [id] => 18586052 [patent_doc_number] => 20230268317 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-24 [patent_title] => Packages Formed Using RDL-Last Process [patent_app_type] => utility [patent_app_number] => 18/308900 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7953 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308900 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/308900
Packages Formed Using RDL-Last Process Apr 27, 2023 Pending
Array ( [id] => 19546511 [patent_doc_number] => 20240363547 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/308866 [patent_app_country] => US [patent_app_date] => 2023-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8515 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18308866 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/308866
CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME Apr 27, 2023 Pending
Array ( [id] => 19161123 [patent_doc_number] => 20240153830 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-09 [patent_title] => SEMICONDUCTOR DEVICE INCLUDING DETECTION STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/139707 [patent_app_country] => US [patent_app_date] => 2023-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 25255 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18139707 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/139707
SEMICONDUCTOR DEVICE INCLUDING DETECTION STRUCTURE Apr 25, 2023 Issued
Array ( [id] => 20509033 [patent_doc_number] => 12543325 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-02-03 [patent_title] => Three-dimensional semiconductor devices [patent_app_type] => utility [patent_app_number] => 18/307402 [patent_app_country] => US [patent_app_date] => 2023-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 16 [patent_no_of_words] => 8424 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18307402 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/307402
THREE-DIMENSIONAL SEMICONDUCTOR DEVICES Apr 25, 2023 Issued
Array ( [id] => 20496921 [patent_doc_number] => 12538815 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-27 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 18/138363 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4202 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138363 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/138363
Semiconductor package and method of fabricating the same Apr 23, 2023 Issued
Array ( [id] => 18821118 [patent_doc_number] => 20230395459 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/305726 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9146 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18305726 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/305726
SEMICONDUCTOR PACKAGE Apr 23, 2023 Pending
Array ( [id] => 19494327 [patent_doc_number] => 12113051 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-08 [patent_title] => Die to die interface circuit [patent_app_type] => utility [patent_app_number] => 18/301817 [patent_app_country] => US [patent_app_date] => 2023-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 10104 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18301817 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/301817
Die to die interface circuit Apr 16, 2023 Issued
Array ( [id] => 19654476 [patent_doc_number] => 12176276 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-24 [patent_title] => Semiconductor device package and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/133463 [patent_app_country] => US [patent_app_date] => 2023-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 7121 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18133463 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/133463
Semiconductor device package and method for manufacturing the same Apr 10, 2023 Issued
Array ( [id] => 18540917 [patent_doc_number] => 20230246028 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/297293 [patent_app_country] => US [patent_app_date] => 2023-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12708 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18297293 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/297293
Semiconductor device structure and method for forming the same Apr 6, 2023 Issued
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