Patricia Moody

Array ( [id] => 17764801 [patent_doc_number] => 20220238414 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-28 [patent_title] => THERMAL CONDUCTIVE STRUCTURE AND ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/541782 [patent_app_country] => US [patent_app_date] => 2021-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4640 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17541782 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19468001 [patent_doc_number] => 20240321671 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-26 [patent_title] => HEAT RADIATOR AND ELECTRONIC COMPONENT MODULE [patent_app_type] => utility [patent_app_number] => 18/269768 [patent_app_country] => US [patent_app_date] => 2021-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6254 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18269768 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18365901 [patent_doc_number] => 20230147492 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => THERMAL INTERFACE MATERIAL (TIM) FILLING STRUCTURE FOR HIGH WARPAGE CHIPS [patent_app_type] => utility [patent_app_number] => 17/524364 [patent_app_country] => US [patent_app_date] => 2021-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3828 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17524364 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19351269 [patent_doc_number] => 20240260233 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-01 [patent_title] => DIMM COOLING ASSEMBLIES [patent_app_type] => utility [patent_app_number] => 18/565880 [patent_app_country] => US [patent_app_date] => 2021-11-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10091 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18565880 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18723255 [patent_doc_number] => 11800633 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-24 [patent_title] => Inductor and power module [patent_app_type] => utility [patent_app_number] => 17/523018 [patent_app_country] => US [patent_app_date] => 2021-11-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4538 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17523018 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18349401 [patent_doc_number] => 20230137512 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => STACKED SSD SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/517911 [patent_app_country] => US [patent_app_date] => 2021-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6786 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17517911 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18002573 [patent_doc_number] => 11503701 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2022-11-15 [patent_title] => Electronic device having heat transfer clamp and associated methods [patent_app_type] => utility [patent_app_number] => 17/452243 [patent_app_country] => US [patent_app_date] => 2021-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 3877 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17452243 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18336290 [patent_doc_number] => 20230128239 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => ELECTRONIC DEVICE HAVING FLEXIBLE, HEAT CONDUCTIVE LAYER AND ASSOCIATED METHODS [patent_app_type] => utility [patent_app_number] => 17/452241 [patent_app_country] => US [patent_app_date] => 2021-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3866 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17452241 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17585150 [patent_doc_number] => 20220142005 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => JOINT STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE JOINT STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/509242 [patent_app_country] => US [patent_app_date] => 2021-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9248 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17509242 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18920336 [patent_doc_number] => 11882645 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-23 [patent_title] => Multi chip hardware security module [patent_app_type] => utility [patent_app_number] => 17/451827 [patent_app_country] => US [patent_app_date] => 2021-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4609 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17451827 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18334519 [patent_doc_number] => 20230126467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => PRINTED CIRCUIT BOARD (PCB) INCLUDING HEATSINKS [patent_app_type] => utility [patent_app_number] => 17/451710 [patent_app_country] => US [patent_app_date] => 2021-10-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5212 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17451710 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17391437 [patent_doc_number] => 20220039291 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-03 [patent_title] => LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM [patent_app_type] => utility [patent_app_number] => 17/503875 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11308 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17503875 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18776329 [patent_doc_number] => 20230371167 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => SUBSTRATE FOR AN ELECTRONIC CHIP [patent_app_type] => utility [patent_app_number] => 18/246933 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4976 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18246933 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18002570 [patent_doc_number] => 11503698 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2022-11-15 [patent_title] => Flexible circuit board and heat spreader thereof [patent_app_type] => utility [patent_app_number] => 17/494002 [patent_app_country] => US [patent_app_date] => 2021-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1079 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17494002 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18283823 [patent_doc_number] => 20230099295 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-30 [patent_title] => ELECTRONIC DEVICE COMPRISING AN ELECTROWETTING DEVICE [patent_app_type] => utility [patent_app_number] => 17/485140 [patent_app_country] => US [patent_app_date] => 2021-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12111 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -35 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17485140 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19936747 [patent_doc_number] => 12309966 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-20 [patent_title] => Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force [patent_app_type] => utility [patent_app_number] => 17/475026 [patent_app_country] => US [patent_app_date] => 2021-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2333 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17475026 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19901442 [patent_doc_number] => 12279395 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-15 [patent_title] => Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention [patent_app_type] => utility [patent_app_number] => 17/474974 [patent_app_country] => US [patent_app_date] => 2021-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 24 [patent_no_of_words] => 3350 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17474974 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17321242 [patent_doc_number] => 20210410292 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-30 [patent_title] => SELECTIVELY APPLIED PROTECTIVE LAYER ON EXPOSED MATERIALS OF ELECTRONIC CIRCUIT BOARD AND ELECTRONIC COMPONENTS DISPOSED THERON FOR IMMERSION BATH COOLED SYSTEMS [patent_app_type] => utility [patent_app_number] => 17/473915 [patent_app_country] => US [patent_app_date] => 2021-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6176 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17473915 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18243487 [patent_doc_number] => 20230075798 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-09 [patent_title] => RACK BASED DISTRIBUTION UNIT FOR ELECTRONICS COOLING [patent_app_type] => utility [patent_app_number] => 17/469654 [patent_app_country] => US [patent_app_date] => 2021-09-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4976 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17469654 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17568499 [patent_doc_number] => 20220132649 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-28 [patent_title] => PASS-THROUGH LATCHING HEAT SINK [patent_app_type] => utility [patent_app_number] => 17/467827 [patent_app_country] => US [patent_app_date] => 2021-09-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3195 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17467827 [rel_patent_id] =>[rel_patent_doc_number] =>)