
Patricia Moody
Examiner (ID: 4475)
| Most Active Art Unit | 1804 |
| Art Unit(s) | 2900, 1804, 1803 |
| Total Applications | 250 |
| Issued Applications | 115 |
| Pending Applications | 14 |
| Abandoned Applications | 121 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 20637798
[patent_doc_number] => 12598692
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-04-07
[patent_title] => Locking tensioner cooling assembly for pluggable electronic component
[patent_app_type] => utility
[patent_app_number] => 17/697909
[patent_app_country] => US
[patent_app_date] => 2022-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 3520
[patent_no_of_claims] => 18
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[patent_words_short_claim] => 116
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17697909
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Array
(
[id] => 18251941
[patent_doc_number] => 20230078980
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-16
[patent_title] => THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP
[patent_app_type] => utility
[patent_app_number] => 17/696989
[patent_app_country] => US
[patent_app_date] => 2022-03-17
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/696989 | Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip | Mar 16, 2022 | Issued |
Array
(
[id] => 20360162
[patent_doc_number] => 12476167
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-11-18
[patent_title] => Semiconductor chip package thermo-mechanical cooling assembly
[patent_app_type] => utility
[patent_app_number] => 17/696694
[patent_app_country] => US
[patent_app_date] => 2022-03-16
[patent_effective_date] => 0000-00-00
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Array
(
[id] => 18631801
[patent_doc_number] => 20230290706
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-14
[patent_title] => VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR
[patent_app_type] => utility
[patent_app_number] => 17/693003
[patent_app_country] => US
[patent_app_date] => 2022-03-11
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/693003 | VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR | Mar 10, 2022 | Pending |
Array
(
[id] => 17662682
[patent_doc_number] => 20220183147
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-06-09
[patent_title] => CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR CHIP
[patent_app_type] => utility
[patent_app_number] => 17/683979
[patent_app_country] => US
[patent_app_date] => 2022-03-01
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/683979 | Circuit board having a cooling area above and below a semiconductor chip | Feb 28, 2022 | Issued |
Array
(
[id] => 18099743
[patent_doc_number] => 20220418084
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-12-29
[patent_title] => HEAT DISSIPATION STRUCTURE HAVING HOUSING MADE OF HIGH THERMAL RESISTANCE MATERIAL AND ELECTRONIC APPARATUS HAVING THE SAME
[patent_app_type] => utility
[patent_app_number] => 17/680341
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/680341 | Heat dissipation structure having housing made of high thermal resistance material and electronic apparatus having the same | Feb 24, 2022 | Issued |
Array
(
[id] => 18999139
[patent_doc_number] => 11915995
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-02-27
[patent_title] => Power converter
[patent_app_type] => utility
[patent_app_number] => 17/677357
[patent_app_country] => US
[patent_app_date] => 2022-02-22
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/677357 | Power converter | Feb 21, 2022 | Issued |
Array
(
[id] => 19048282
[patent_doc_number] => 11937413
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-03-19
[patent_title] => Power electronics module and method for fabricating a power electronics module
[patent_app_type] => utility
[patent_app_number] => 17/675446
[patent_app_country] => US
[patent_app_date] => 2022-02-18
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/675446 | Power electronics module and method for fabricating a power electronics module | Feb 17, 2022 | Issued |
Array
(
[id] => 17835523
[patent_doc_number] => 20220272828
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-08-25
[patent_title] => Heat Removal Architecture for Stack-Type Component Carrier With Embedded Component
[patent_app_type] => utility
[patent_app_number] => 17/650405
[patent_app_country] => US
[patent_app_date] => 2022-02-09
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/650405 | Heat removal architecture for stack-type component carrier with embedded component | Feb 8, 2022 | Issued |
Array
(
[id] => 17833648
[patent_doc_number] => 20220270952
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[patent_kind] => A1
[patent_issue_date] => 2022-08-25
[patent_title] => POWER DEVICE, POWER DEVICE ASSEMBLY, AND RELATED APPARATUS
[patent_app_type] => utility
[patent_app_number] => 17/668158
[patent_app_country] => US
[patent_app_date] => 2022-02-09
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/668158 | Power device, power device assembly, and related apparatus | Feb 8, 2022 | Issued |
Array
(
[id] => 17797603
[patent_doc_number] => 20220256695
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2022-08-11
[patent_title] => CIRCUIT BOARD
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/665651 | CIRCUIT BOARD | Feb 6, 2022 | Abandoned |
Array
(
[id] => 19040360
[patent_doc_number] => 20240090175
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[rel_patent_id] =>[rel_patent_doc_number] =>) 18/261994 | ELECTRONIC DEVICE AND PRODUCT | Jan 18, 2022 | Pending |
Array
(
[id] => 19010051
[patent_doc_number] => 20240074122
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[patent_kind] => A1
[patent_issue_date] => 2024-02-29
[patent_title] => Power Semiconductor Device and Method of Manufacturing the Same, and Power Conversion Device
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[rel_patent_id] =>[rel_patent_doc_number] =>) 18/258037 | Power semiconductor device and method of manufacturing the same, and power conversion device | Jan 13, 2022 | Issued |
Array
(
[id] => 17764799
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[patent_title] => ELASTIC THERMAL CONNECTION STRUCTURE
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/572974 | ELASTIC THERMAL CONNECTION STRUCTURE | Jan 10, 2022 | Abandoned |
Array
(
[id] => 18859077
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[patent_title] => Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
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Array
(
[id] => 17538471
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[patent_title] => BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/555340 | BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE | Dec 16, 2021 | Abandoned |
Array
(
[id] => 18671803
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[patent_title] => Data storage device
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/643379 | Data storage device | Dec 7, 2021 | Issued |
Array
(
[id] => 19278819
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[patent_title] => Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/541440 | Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer | Dec 2, 2021 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/457595 | Micro device with adaptable thermal management device | Dec 2, 2021 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/542217 | Power electronics system with a switching device and a liquid cooling device | Dec 2, 2021 | Issued |