Search

Patricia Moody

Examiner (ID: 4475)

Most Active Art Unit
1804
Art Unit(s)
2900, 1804, 1803
Total Applications
250
Issued Applications
115
Pending Applications
14
Abandoned Applications
121

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20637798 [patent_doc_number] => 12598692 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-07 [patent_title] => Locking tensioner cooling assembly for pluggable electronic component [patent_app_type] => utility [patent_app_number] => 17/697909 [patent_app_country] => US [patent_app_date] => 2022-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 3520 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17697909 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/697909
Locking tensioner cooling assembly for pluggable electronic component Mar 16, 2022 Issued
Array ( [id] => 18251941 [patent_doc_number] => 20230078980 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP [patent_app_type] => utility [patent_app_number] => 17/696989 [patent_app_country] => US [patent_app_date] => 2022-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5289 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17696989 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/696989
Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip Mar 16, 2022 Issued
Array ( [id] => 20360162 [patent_doc_number] => 12476167 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-18 [patent_title] => Semiconductor chip package thermo-mechanical cooling assembly [patent_app_type] => utility [patent_app_number] => 17/696694 [patent_app_country] => US [patent_app_date] => 2022-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 3539 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17696694 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/696694
Semiconductor chip package thermo-mechanical cooling assembly Mar 15, 2022 Issued
Array ( [id] => 18631801 [patent_doc_number] => 20230290706 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-14 [patent_title] => VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR [patent_app_type] => utility [patent_app_number] => 17/693003 [patent_app_country] => US [patent_app_date] => 2022-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12859 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17693003 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/693003
VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR Mar 10, 2022 Pending
Array ( [id] => 17662682 [patent_doc_number] => 20220183147 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR CHIP [patent_app_type] => utility [patent_app_number] => 17/683979 [patent_app_country] => US [patent_app_date] => 2022-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5478 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17683979 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/683979
Circuit board having a cooling area above and below a semiconductor chip Feb 28, 2022 Issued
Array ( [id] => 18099743 [patent_doc_number] => 20220418084 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-29 [patent_title] => HEAT DISSIPATION STRUCTURE HAVING HOUSING MADE OF HIGH THERMAL RESISTANCE MATERIAL AND ELECTRONIC APPARATUS HAVING THE SAME [patent_app_type] => utility [patent_app_number] => 17/680341 [patent_app_country] => US [patent_app_date] => 2022-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2995 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17680341 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/680341
Heat dissipation structure having housing made of high thermal resistance material and electronic apparatus having the same Feb 24, 2022 Issued
Array ( [id] => 18999139 [patent_doc_number] => 11915995 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-27 [patent_title] => Power converter [patent_app_type] => utility [patent_app_number] => 17/677357 [patent_app_country] => US [patent_app_date] => 2022-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 7063 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17677357 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/677357
Power converter Feb 21, 2022 Issued
Array ( [id] => 19048282 [patent_doc_number] => 11937413 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Power electronics module and method for fabricating a power electronics module [patent_app_type] => utility [patent_app_number] => 17/675446 [patent_app_country] => US [patent_app_date] => 2022-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 6148 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 274 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17675446 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/675446
Power electronics module and method for fabricating a power electronics module Feb 17, 2022 Issued
Array ( [id] => 17835523 [patent_doc_number] => 20220272828 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-25 [patent_title] => Heat Removal Architecture for Stack-Type Component Carrier With Embedded Component [patent_app_type] => utility [patent_app_number] => 17/650405 [patent_app_country] => US [patent_app_date] => 2022-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9909 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17650405 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/650405
Heat removal architecture for stack-type component carrier with embedded component Feb 8, 2022 Issued
Array ( [id] => 17833648 [patent_doc_number] => 20220270952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-25 [patent_title] => POWER DEVICE, POWER DEVICE ASSEMBLY, AND RELATED APPARATUS [patent_app_type] => utility [patent_app_number] => 17/668158 [patent_app_country] => US [patent_app_date] => 2022-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13271 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17668158 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/668158
Power device, power device assembly, and related apparatus Feb 8, 2022 Issued
Array ( [id] => 17797603 [patent_doc_number] => 20220256695 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-11 [patent_title] => CIRCUIT BOARD [patent_app_type] => utility [patent_app_number] => 17/665651 [patent_app_country] => US [patent_app_date] => 2022-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5378 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -2 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17665651 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/665651
CIRCUIT BOARD Feb 6, 2022 Abandoned
Array ( [id] => 19040360 [patent_doc_number] => 20240090175 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => ELECTRONIC DEVICE AND PRODUCT [patent_app_type] => utility [patent_app_number] => 18/261994 [patent_app_country] => US [patent_app_date] => 2022-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3831 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 30 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18261994 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/261994
ELECTRONIC DEVICE AND PRODUCT Jan 18, 2022 Pending
Array ( [id] => 19010051 [patent_doc_number] => 20240074122 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => Power Semiconductor Device and Method of Manufacturing the Same, and Power Conversion Device [patent_app_type] => utility [patent_app_number] => 18/258037 [patent_app_country] => US [patent_app_date] => 2022-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8742 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18258037 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/258037
Power semiconductor device and method of manufacturing the same, and power conversion device Jan 13, 2022 Issued
Array ( [id] => 17764799 [patent_doc_number] => 20220238412 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-28 [patent_title] => ELASTIC THERMAL CONNECTION STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/572974 [patent_app_country] => US [patent_app_date] => 2022-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5803 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17572974 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/572974
ELASTIC THERMAL CONNECTION STRUCTURE Jan 10, 2022 Abandoned
Array ( [id] => 18859077 [patent_doc_number] => 11856687 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device [patent_app_type] => utility [patent_app_number] => 17/558341 [patent_app_country] => US [patent_app_date] => 2021-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3026 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 235 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17558341 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/558341
Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device Dec 20, 2021 Issued
Array ( [id] => 17538471 [patent_doc_number] => 20220117080 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-14 [patent_title] => BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE [patent_app_type] => utility [patent_app_number] => 17/555340 [patent_app_country] => US [patent_app_date] => 2021-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7763 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17555340 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/555340
BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE Dec 16, 2021 Abandoned
Array ( [id] => 18671803 [patent_doc_number] => 11778736 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-03 [patent_title] => Data storage device [patent_app_type] => utility [patent_app_number] => 17/643379 [patent_app_country] => US [patent_app_date] => 2021-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 2991 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17643379 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/643379
Data storage device Dec 7, 2021 Issued
Array ( [id] => 19278819 [patent_doc_number] => 12028963 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-02 [patent_title] => Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer [patent_app_type] => utility [patent_app_number] => 17/541440 [patent_app_country] => US [patent_app_date] => 2021-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4432 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17541440 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/541440
Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer Dec 2, 2021 Issued
Array ( [id] => 18425914 [patent_doc_number] => 20230180379 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-08 [patent_title] => MICRO DEVICE WITH ADAPTABLE THERMAL MANAGEMENT DEVICE [patent_app_type] => utility [patent_app_number] => 17/457595 [patent_app_country] => US [patent_app_date] => 2021-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6626 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17457595 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/457595
Micro device with adaptable thermal management device Dec 2, 2021 Issued
Array ( [id] => 17660769 [patent_doc_number] => 20220181234 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-09 [patent_title] => POWER ELECTRONICS SYSTEM WITH A SWITCHING DEVICE AND A LIQUID COOLING DEVICE [patent_app_type] => utility [patent_app_number] => 17/542217 [patent_app_country] => US [patent_app_date] => 2021-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3447 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 245 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17542217 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/542217
Power electronics system with a switching device and a liquid cooling device Dec 2, 2021 Issued
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