Search

Patrick Hamo

Examiner (ID: 2096, Phone: (571)272-3492 , Office: P/3746 )

Most Active Art Unit
3746
Art Unit(s)
3746
Total Applications
1033
Issued Applications
757
Pending Applications
18
Abandoned Applications
258

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 16739230 [patent_doc_number] => 10964899 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-03-30 [patent_title] => Hybrid junction solar light sensitive device [patent_app_type] => utility [patent_app_number] => 17/089796 [patent_app_country] => US [patent_app_date] => 2020-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3685 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17089796 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/089796
Hybrid junction solar light sensitive device Nov 4, 2020 Issued
Array ( [id] => 17463759 [patent_doc_number] => 20220077065 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-10 [patent_title] => INTERPOSER FOR 2.5D PACKAGING ARCHITECTURE [patent_app_type] => utility [patent_app_number] => 17/089744 [patent_app_country] => US [patent_app_date] => 2020-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6818 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17089744 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/089744
Stepped interposer for stacked chip package Nov 4, 2020 Issued
Array ( [id] => 16904861 [patent_doc_number] => 20210183777 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-17 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/090502 [patent_app_country] => US [patent_app_date] => 2020-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7416 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17090502 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/090502
Semiconductor package with interposer Nov 4, 2020 Issued
Array ( [id] => 18175160 [patent_doc_number] => 11574877 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-07 [patent_title] => Semiconductor miniaturization through component placement on stepped stiffener [patent_app_type] => utility [patent_app_number] => 17/088606 [patent_app_country] => US [patent_app_date] => 2020-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 7987 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17088606 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/088606
Semiconductor miniaturization through component placement on stepped stiffener Nov 3, 2020 Issued
Array ( [id] => 17295374 [patent_doc_number] => 20210391213 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-16 [patent_title] => INTERPOSER BOARD WITHOUT FEATURE LAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/073968 [patent_app_country] => US [patent_app_date] => 2020-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2394 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17073968 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/073968
Interposer board without feature layer structure and method for manufacturing the same Oct 18, 2020 Issued
Array ( [id] => 17536708 [patent_doc_number] => 20220115317 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-14 [patent_title] => THREE DIMENSIONAL MIM CAPACITOR AND METHODS OF MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 17/069083 [patent_app_country] => US [patent_app_date] => 2020-10-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8021 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17069083 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/069083
Three dimensional MIM capacitor having a comb structure and methods of making the same Oct 12, 2020 Issued
Array ( [id] => 17085494 [patent_doc_number] => 20210280501 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-09 [patent_title] => PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/068808 [patent_app_country] => US [patent_app_date] => 2020-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5258 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17068808 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/068808
Pressurizing members for semiconductor package Oct 11, 2020 Issued
Array ( [id] => 18205472 [patent_doc_number] => 11587877 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-21 [patent_title] => Semiconductor device in which peeling off of sealing resin from the wire is suppressed [patent_app_type] => utility [patent_app_number] => 17/065733 [patent_app_country] => US [patent_app_date] => 2020-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 54 [patent_figures_cnt] => 54 [patent_no_of_words] => 28978 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 376 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17065733 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/065733
Semiconductor device in which peeling off of sealing resin from the wire is suppressed Oct 7, 2020 Issued
Array ( [id] => 17652810 [patent_doc_number] => 11355550 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-06-07 [patent_title] => Optoelectronic device having conductor arrangement structures non-overlapped with heat dissipation pads [patent_app_type] => utility [patent_app_number] => 17/064769 [patent_app_country] => US [patent_app_date] => 2020-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 32 [patent_no_of_words] => 8276 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17064769 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/064769
Optoelectronic device having conductor arrangement structures non-overlapped with heat dissipation pads Oct 6, 2020 Issued
Array ( [id] => 18874898 [patent_doc_number] => 11862721 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-02 [patent_title] => HEMT semiconductor device with a stepped sidewall [patent_app_type] => utility [patent_app_number] => 17/054516 [patent_app_country] => US [patent_app_date] => 2020-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 10915 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17054516 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/054516
HEMT semiconductor device with a stepped sidewall Sep 29, 2020 Issued
Array ( [id] => 17509396 [patent_doc_number] => 20220102499 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-31 [patent_title] => TRANSISTORS INCLUDING TWO-DIMENSIONAL MATERIALS [patent_app_type] => utility [patent_app_number] => 17/032989 [patent_app_country] => US [patent_app_date] => 2020-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20193 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17032989 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/032989
Transistors including two-dimensional materials Sep 24, 2020 Issued
Array ( [id] => 16560891 [patent_doc_number] => 20210006040 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-01-07 [patent_title] => LIGHT EMITTING ELEMENT [patent_app_type] => utility [patent_app_number] => 17/031232 [patent_app_country] => US [patent_app_date] => 2020-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10476 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17031232 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/031232
Light emitting element to control an oscillation wavelength Sep 23, 2020 Issued
Array ( [id] => 17077895 [patent_doc_number] => 11114310 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-09-07 [patent_title] => Embedded packaging method capable of realizing heat dissipation [patent_app_type] => utility [patent_app_number] => 17/026788 [patent_app_country] => US [patent_app_date] => 2020-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 4914 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 347 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17026788 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/026788
Embedded packaging method capable of realizing heat dissipation Sep 20, 2020 Issued
Array ( [id] => 16586411 [patent_doc_number] => 20210020813 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-01-21 [patent_title] => SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/026752 [patent_app_country] => US [patent_app_date] => 2020-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12905 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17026752 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/026752
Semiconductor device with transmissive layer and manufacturing method thereof Sep 20, 2020 Issued
Array ( [id] => 17347131 [patent_doc_number] => 20220013462 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-13 [patent_title] => PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/026793 [patent_app_country] => US [patent_app_date] => 2020-09-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4140 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17026793 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/026793
Package substrate and manufacturing method thereof Sep 20, 2020 Issued
Array ( [id] => 16904863 [patent_doc_number] => 20210183779 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-17 [patent_title] => MULTI-LEVEL FAN-OUT INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES [patent_app_type] => utility [patent_app_number] => 17/024182 [patent_app_country] => US [patent_app_date] => 2020-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10215 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17024182 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/024182
Multi-level components for integrated-circuit packages Sep 16, 2020 Issued
Array ( [id] => 19328792 [patent_doc_number] => 12046481 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-23 [patent_title] => Systems and methods for reducing via formation impact on electronic device formation [patent_app_type] => utility [patent_app_number] => 17/641540 [patent_app_country] => US [patent_app_date] => 2020-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 42 [patent_no_of_words] => 20830 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17641540 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/641540
Systems and methods for reducing via formation impact on electronic device formation Sep 8, 2020 Issued
Array ( [id] => 17463755 [patent_doc_number] => 20220077061 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-10 [patent_title] => SEMICONDUCTOR DEVICE WITH COMPOSITE LANDING PAD FOR METAL PLUG [patent_app_type] => utility [patent_app_number] => 17/015816 [patent_app_country] => US [patent_app_date] => 2020-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8137 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17015816 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/015816
Semiconductor device with composite landing pad for metal plug Sep 8, 2020 Issued
Array ( [id] => 17115656 [patent_doc_number] => 20210296253 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-23 [patent_title] => SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD OF THE SAME [patent_app_type] => utility [patent_app_number] => 17/012317 [patent_app_country] => US [patent_app_date] => 2020-09-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3857 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17012317 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/012317
Semiconductor storage device including a memory cell array and manufacturing method of the same Sep 3, 2020 Issued
Array ( [id] => 17085409 [patent_doc_number] => 20210280416 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-09 [patent_title] => MANUFACTURING METHOD AND SUPPORT OF SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/012337 [patent_app_country] => US [patent_app_date] => 2020-09-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9099 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17012337 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/012337
Manufacturing method of a semiconductor device including a support Sep 3, 2020 Issued
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