Search

Patrick Hamo

Examiner (ID: 2096, Phone: (571)272-3492 , Office: P/3746 )

Most Active Art Unit
3746
Art Unit(s)
3746
Total Applications
1033
Issued Applications
757
Pending Applications
18
Abandoned Applications
258

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5828362 [patent_doc_number] => 20060063379 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-03-23 [patent_title] => 'Forming a combined copper diffusion barrier and seed layer' [patent_app_type] => utility [patent_app_number] => 10/943359 [patent_app_country] => US [patent_app_date] => 2004-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1461 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0063/20060063379.pdf [firstpage_image] =>[orig_patent_app_number] => 10943359 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/943359
Forming a combined copper diffusion barrier and seed layer Sep 16, 2004 Abandoned
Array ( [id] => 7125195 [patent_doc_number] => 20050056939 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-17 [patent_title] => 'Thin-film capacitor and method of producing the capacitor' [patent_app_type] => utility [patent_app_number] => 10/939340 [patent_app_country] => US [patent_app_date] => 2004-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3403 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20050056939.pdf [firstpage_image] =>[orig_patent_app_number] => 10939340 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/939340
Thin-film capacitor and method of producing the capacitor Sep 13, 2004 Abandoned
Array ( [id] => 6971901 [patent_doc_number] => 20050037611 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-17 [patent_title] => 'EMI and noise shielding for multi-metal layer high frequency integrated circuit processes' [patent_app_type] => utility [patent_app_number] => 10/938768 [patent_app_country] => US [patent_app_date] => 2004-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2173 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0037/20050037611.pdf [firstpage_image] =>[orig_patent_app_number] => 10938768 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/938768
EMI and noise shielding for multi-metal layer high frequency integrated circuit processes Sep 9, 2004 Issued
Array ( [id] => 5903458 [patent_doc_number] => 20060046383 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-03-02 [patent_title] => 'Method for forming a nanocrystal floating gate for a flash memory device' [patent_app_type] => utility [patent_app_number] => 10/933920 [patent_app_country] => US [patent_app_date] => 2004-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3188 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0046/20060046383.pdf [firstpage_image] =>[orig_patent_app_number] => 10933920 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/933920
Method for forming a nanocrystal floating gate for a flash memory device Sep 1, 2004 Abandoned
Array ( [id] => 7154849 [patent_doc_number] => 20050026438 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-03 [patent_title] => 'Semiconductor processing methods' [patent_app_type] => utility [patent_app_number] => 10/931607 [patent_app_country] => US [patent_app_date] => 2004-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5641 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0026/20050026438.pdf [firstpage_image] =>[orig_patent_app_number] => 10931607 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/931607
Semiconductor processing methods Aug 30, 2004 Issued
Array ( [id] => 757743 [patent_doc_number] => 07015128 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2006-03-21 [patent_title] => 'Method of making a semiconductor chip assembly with an embedded metal particle' [patent_app_type] => utility [patent_app_number] => 10/924670 [patent_app_country] => US [patent_app_date] => 2004-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 68 [patent_figures_cnt] => 242 [patent_no_of_words] => 41934 [patent_no_of_claims] => 210 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 25 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/015/07015128.pdf [firstpage_image] =>[orig_patent_app_number] => 10924670 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/924670
Method of making a semiconductor chip assembly with an embedded metal particle Aug 23, 2004 Issued
Array ( [id] => 690412 [patent_doc_number] => 07074653 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-11 [patent_title] => 'Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages' [patent_app_type] => utility [patent_app_number] => 10/923920 [patent_app_country] => US [patent_app_date] => 2004-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2445 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 18 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/074/07074653.pdf [firstpage_image] =>[orig_patent_app_number] => 10923920 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/923920
Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages Aug 22, 2004 Issued
Array ( [id] => 767274 [patent_doc_number] => 07009297 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2006-03-07 [patent_title] => 'Semiconductor chip assembly with embedded metal particle' [patent_app_type] => utility [patent_app_number] => 10/922280 [patent_app_country] => US [patent_app_date] => 2004-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 68 [patent_figures_cnt] => 206 [patent_no_of_words] => 41839 [patent_no_of_claims] => 110 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 18 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/009/07009297.pdf [firstpage_image] =>[orig_patent_app_number] => 10922280 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/922280
Semiconductor chip assembly with embedded metal particle Aug 18, 2004 Issued
Array ( [id] => 6977969 [patent_doc_number] => 20050287687 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-12-29 [patent_title] => 'METHOD OF FABRICATING ALGAINP LIGHT-EMITTING DIODE AND STRUCTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 10/917950 [patent_app_country] => US [patent_app_date] => 2004-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2581 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20050287687.pdf [firstpage_image] =>[orig_patent_app_number] => 10917950 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/917950
Method of fabricating AlGaInP light-emitting diode and structure thereof Aug 12, 2004 Issued
Array ( [id] => 961071 [patent_doc_number] => 06951784 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-10-04 [patent_title] => 'Three-mask method of constructing the final hard mask used for etching the silicon fins for FinFETs' [patent_app_type] => utility [patent_app_number] => 10/710822 [patent_app_country] => US [patent_app_date] => 2004-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 21 [patent_no_of_words] => 3274 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/951/06951784.pdf [firstpage_image] =>[orig_patent_app_number] => 10710822 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/710822
Three-mask method of constructing the final hard mask used for etching the silicon fins for FinFETs Aug 4, 2004 Issued
Array ( [id] => 915399 [patent_doc_number] => 07327016 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-02-05 [patent_title] => 'High permeability composite films to reduce noise in high speed interconnects' [patent_app_type] => utility [patent_app_number] => 10/910676 [patent_app_country] => US [patent_app_date] => 2004-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 15272 [patent_no_of_claims] => 50 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/327/07327016.pdf [firstpage_image] =>[orig_patent_app_number] => 10910676 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/910676
High permeability composite films to reduce noise in high speed interconnects Aug 2, 2004 Issued
Array ( [id] => 616809 [patent_doc_number] => 07145222 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-05 [patent_title] => 'Leadless semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/901090 [patent_app_country] => US [patent_app_date] => 2004-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2098 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/145/07145222.pdf [firstpage_image] =>[orig_patent_app_number] => 10901090 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/901090
Leadless semiconductor package Jul 28, 2004 Issued
Array ( [id] => 770317 [patent_doc_number] => 07005749 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-02-28 [patent_title] => 'Flip chip package structure' [patent_app_type] => utility [patent_app_number] => 10/899870 [patent_app_country] => US [patent_app_date] => 2004-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2086 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/005/07005749.pdf [firstpage_image] =>[orig_patent_app_number] => 10899870 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/899870
Flip chip package structure Jul 26, 2004 Issued
Array ( [id] => 7191528 [patent_doc_number] => 20050040512 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-24 [patent_title] => 'Circuit device' [patent_app_type] => utility [patent_app_number] => 10/899220 [patent_app_country] => US [patent_app_date] => 2004-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4319 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0040/20050040512.pdf [firstpage_image] =>[orig_patent_app_number] => 10899220 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/899220
Circuit device Jul 25, 2004 Issued
Array ( [id] => 7212822 [patent_doc_number] => 20050054186 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-03-10 [patent_title] => 'Wire bonding method, semiconductor chip, and semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/885769 [patent_app_country] => US [patent_app_date] => 2004-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2611 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20050054186.pdf [firstpage_image] =>[orig_patent_app_number] => 10885769 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/885769
Wire bonding method, semiconductor chip, and semiconductor package Jul 7, 2004 Issued
Array ( [id] => 7033777 [patent_doc_number] => 20050032287 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-10 [patent_title] => 'Semiconductor device and a method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/885319 [patent_app_country] => US [patent_app_date] => 2004-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7075 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0032/20050032287.pdf [firstpage_image] =>[orig_patent_app_number] => 10885319 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/885319
Semiconductor device and a method of manufacturing the same Jul 6, 2004 Issued
Array ( [id] => 7253855 [patent_doc_number] => 20050142869 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-30 [patent_title] => 'Method for fabricating cylinder type capacitor' [patent_app_type] => utility [patent_app_number] => 10/879749 [patent_app_country] => US [patent_app_date] => 2004-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2896 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0142/20050142869.pdf [firstpage_image] =>[orig_patent_app_number] => 10879749 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/879749
Method for fabricating cylinder type capacitor Jun 29, 2004 Issued
Array ( [id] => 5895041 [patent_doc_number] => 20060003580 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-05 [patent_title] => 'Under bump metallurgy process on passivation opening' [patent_app_type] => utility [patent_app_number] => 10/881490 [patent_app_country] => US [patent_app_date] => 2004-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1413 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20060003580.pdf [firstpage_image] =>[orig_patent_app_number] => 10881490 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/881490
Under bump metallurgy process on passivation opening Jun 29, 2004 Abandoned
Array ( [id] => 5894947 [patent_doc_number] => 20060003486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-05 [patent_title] => 'Plasma treatment method for electromigration reduction' [patent_app_type] => utility [patent_app_number] => 10/882069 [patent_app_country] => US [patent_app_date] => 2004-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3026 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20060003486.pdf [firstpage_image] =>[orig_patent_app_number] => 10882069 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/882069
Plasma treatment method for electromigration reduction Jun 29, 2004 Issued
Array ( [id] => 6996816 [patent_doc_number] => 20050136594 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-23 [patent_title] => 'Method for forming bit-line of semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/879299 [patent_app_country] => US [patent_app_date] => 2004-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2023 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0136/20050136594.pdf [firstpage_image] =>[orig_patent_app_number] => 10879299 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/879299
Method for forming bit-line of semiconductor device Jun 29, 2004 Issued
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