| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |
Array
(
[id] => 12033705
[patent_doc_number] => 20170323804
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-11-09
[patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT'
[patent_app_type] => utility
[patent_app_number] => 15/287273
[patent_app_country] => US
[patent_app_date] => 2016-10-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 5355
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/287273 | Microelectronics package with inductive element and magnetically enhanced mold compound component | Oct 5, 2016 | Issued |