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Patrick Moon

Examiner (ID: 19451)

Most Active Art Unit
2694
Art Unit(s)
2629, 2694
Total Applications
474
Issued Applications
283
Pending Applications
1
Abandoned Applications
192

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
Array ( [id] => 12033705 [patent_doc_number] => 20170323804 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-11-09 [patent_title] => 'MICROELECTRONICS PACKAGE WITH INDUCTIVE ELEMENT AND MAGNETICALLY ENHANCED MOLD COMPOUND COMPONENT' [patent_app_type] => utility [patent_app_number] => 15/287273 [patent_app_country] => US [patent_app_date] => 2016-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5355 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15287273 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/287273
Microelectronics package with inductive element and magnetically enhanced mold compound component Oct 5, 2016 Issued
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