Search

Paul B. Prebilic

Examiner (ID: 10323, Phone: (571)272-4758 , Office: P/3774 )

Most Active Art Unit
3774
Art Unit(s)
3302, 1801, 3774, 3738, 2899, 3308
Total Applications
2387
Issued Applications
1530
Pending Applications
179
Abandoned Applications
684

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6694942 [patent_doc_number] => 20030107136 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-12 [patent_title] => 'Chip structure and process for forming the same' [patent_app_type] => new [patent_app_number] => 10/337673 [patent_app_country] => US [patent_app_date] => 2003-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8199 [patent_no_of_claims] => 220 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0107/20030107136.pdf [firstpage_image] =>[orig_patent_app_number] => 10337673 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/337673
Chip structure to improve resistance-capacitance delay and reduce energy loss of the chip Jan 5, 2003 Issued
Array ( [id] => 6690934 [patent_doc_number] => 20030038366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-27 [patent_title] => 'Three-dimensional semiconductor device having plural active semiconductor components' [patent_app_type] => new [patent_app_number] => 10/268752 [patent_app_country] => US [patent_app_date] => 2002-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 7866 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20030038366.pdf [firstpage_image] =>[orig_patent_app_number] => 10268752 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/268752
Three-dimensional semiconductor device having plural active semiconductor components Oct 10, 2002 Abandoned
Array ( [id] => 7963791 [patent_doc_number] => 06680532 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-01-20 [patent_title] => 'Multi chip module' [patent_app_type] => B1 [patent_app_number] => 10/265751 [patent_app_country] => US [patent_app_date] => 2002-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2015 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/680/06680532.pdf [firstpage_image] =>[orig_patent_app_number] => 10265751 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/265751
Multi chip module Oct 6, 2002 Issued
Array ( [id] => 1197830 [patent_doc_number] => 06727582 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-04-27 [patent_title] => 'Semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/255961 [patent_app_country] => US [patent_app_date] => 2002-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3379 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/727/06727582.pdf [firstpage_image] =>[orig_patent_app_number] => 10255961 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/255961
Semiconductor device Sep 26, 2002 Issued
Array ( [id] => 6776269 [patent_doc_number] => 20030047349 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-13 [patent_title] => 'Integrated circuit package and printed circuit board arrangement' [patent_app_type] => new [patent_app_number] => 10/065016 [patent_app_country] => US [patent_app_date] => 2002-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2909 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20030047349.pdf [firstpage_image] =>[orig_patent_app_number] => 10065016 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/065016
Integrated circuit package and printed circuit board arrangement Sep 9, 2002 Issued
Array ( [id] => 6718712 [patent_doc_number] => 20030052399 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-20 [patent_title] => 'Semiconductor device having semiconductor element packaged on interposer' [patent_app_type] => new [patent_app_number] => 10/222841 [patent_app_country] => US [patent_app_date] => 2002-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5511 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0052/20030052399.pdf [firstpage_image] =>[orig_patent_app_number] => 10222841 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/222841
Semiconductor device having semiconductor element packaged on interposer Aug 18, 2002 Issued
Array ( [id] => 1225227 [patent_doc_number] => 06700207 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-02 [patent_title] => 'Flip-chip ball grid array package for electromigration testing' [patent_app_type] => B2 [patent_app_number] => 10/212448 [patent_app_country] => US [patent_app_date] => 2002-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 3025 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/700/06700207.pdf [firstpage_image] =>[orig_patent_app_number] => 10212448 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/212448
Flip-chip ball grid array package for electromigration testing Aug 4, 2002 Issued
Array ( [id] => 1056352 [patent_doc_number] => 06855575 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-15 [patent_title] => 'Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 10/202764 [patent_app_country] => US [patent_app_date] => 2002-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2725 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/855/06855575.pdf [firstpage_image] =>[orig_patent_app_number] => 10202764 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/202764
Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof Jul 23, 2002 Issued
Array ( [id] => 1210966 [patent_doc_number] => 06713862 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-30 [patent_title] => 'Low temperature co-fired ceramic-metal packaging technology' [patent_app_type] => B2 [patent_app_number] => 10/199418 [patent_app_country] => US [patent_app_date] => 2002-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 4712 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/713/06713862.pdf [firstpage_image] =>[orig_patent_app_number] => 10199418 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/199418
Low temperature co-fired ceramic-metal packaging technology Jul 18, 2002 Issued
Array ( [id] => 6748096 [patent_doc_number] => 20030042616 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-06 [patent_title] => 'ANGLED EDGE CONNECTIONS FOR MULTICHIP STRUCTURES' [patent_app_type] => new [patent_app_number] => 10/198791 [patent_app_country] => US [patent_app_date] => 2002-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3915 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20030042616.pdf [firstpage_image] =>[orig_patent_app_number] => 10198791 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/198791
Angled edge connections for multichip structures Jul 17, 2002 Issued
Array ( [id] => 7421199 [patent_doc_number] => 20040000702 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-01 [patent_title] => 'Integrated circuit and laminated leadframe package' [patent_app_type] => new [patent_app_number] => 10/183287 [patent_app_country] => US [patent_app_date] => 2002-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2887 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20040000702.pdf [firstpage_image] =>[orig_patent_app_number] => 10183287 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/183287
Integrated circuit and laminated leadframe package Jun 26, 2002 Issued
Array ( [id] => 6170363 [patent_doc_number] => 20020153618 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-24 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/162613 [patent_app_country] => US [patent_app_date] => 2002-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 8534 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0153/20020153618.pdf [firstpage_image] =>[orig_patent_app_number] => 10162613 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/162613
Semiconductor device Jun 5, 2002 Issued
Array ( [id] => 6153920 [patent_doc_number] => 20020145188 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-10 [patent_title] => 'Flat semiconductor device and power converter employing the same' [patent_app_type] => new [patent_app_number] => 10/161674 [patent_app_country] => US [patent_app_date] => 2002-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 8048 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20020145188.pdf [firstpage_image] =>[orig_patent_app_number] => 10161674 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/161674
Flat semiconductor device and power converter employing the same Jun 4, 2002 Abandoned
Array ( [id] => 6539052 [patent_doc_number] => 20020137262 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-26 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/152727 [patent_app_country] => US [patent_app_date] => 2002-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6227 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20020137262.pdf [firstpage_image] =>[orig_patent_app_number] => 10152727 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/152727
Semiconductor device May 22, 2002 Issued
Array ( [id] => 6539039 [patent_doc_number] => 20020137261 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-26 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/152726 [patent_app_country] => US [patent_app_date] => 2002-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6217 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20020137261.pdf [firstpage_image] =>[orig_patent_app_number] => 10152726 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/152726
Method of making semiconductor device having improved heat radiation plate arrangement May 22, 2002 Issued
Array ( [id] => 1218120 [patent_doc_number] => 06707148 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-16 [patent_title] => 'Bumped integrated circuits for optical applications' [patent_app_type] => B1 [patent_app_number] => 10/153269 [patent_app_country] => US [patent_app_date] => 2002-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2490 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/707/06707148.pdf [firstpage_image] =>[orig_patent_app_number] => 10153269 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/153269
Bumped integrated circuits for optical applications May 20, 2002 Issued
Array ( [id] => 1210873 [patent_doc_number] => 06713815 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-30 [patent_title] => 'Semiconductor device with transistors that convert a voltage difference into a drain current difference' [patent_app_type] => B2 [patent_app_number] => 10/147415 [patent_app_country] => US [patent_app_date] => 2002-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 5989 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/713/06713815.pdf [firstpage_image] =>[orig_patent_app_number] => 10147415 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/147415
Semiconductor device with transistors that convert a voltage difference into a drain current difference May 15, 2002 Issued
Array ( [id] => 5901099 [patent_doc_number] => 20020140080 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof' [patent_app_type] => new [patent_app_number] => 10/147672 [patent_app_country] => US [patent_app_date] => 2002-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1223 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140080.pdf [firstpage_image] =>[orig_patent_app_number] => 10147672 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/147672
Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof May 14, 2002 Issued
Array ( [id] => 1374912 [patent_doc_number] => 06566739 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-05-20 [patent_title] => 'Dual chip package' [patent_app_type] => B2 [patent_app_number] => 10/143071 [patent_app_country] => US [patent_app_date] => 2002-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4228 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 291 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/566/06566739.pdf [firstpage_image] =>[orig_patent_app_number] => 10143071 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/143071
Dual chip package May 9, 2002 Issued
Array ( [id] => 1266563 [patent_doc_number] => 06661089 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-12-09 [patent_title] => 'Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same' [patent_app_type] => B2 [patent_app_number] => 10/137834 [patent_app_country] => US [patent_app_date] => 2002-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 19 [patent_no_of_words] => 4393 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/661/06661089.pdf [firstpage_image] =>[orig_patent_app_number] => 10137834 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/137834
Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same May 2, 2002 Issued
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